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Microcontrollers, Microprocessor, FPGA Modules(1446)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Trenz Electronic GmbH 0807-03-7AI21-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0807 | Box | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0807 | download | ROHS3 Compliant | Not Applicable | 1686-TE0807-03-7AI21-A | 1 | Zynq UltraScale+ XCZU7CG-1FBVB900I | - | 4GB | 128MB | MPU Core | - | B2B | |||
|
Trenz Electronic GmbH 0820-04-4AE21FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-4AE21FA | OBSOLETE | 1 | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||
|
Trenz Electronic GmbH 0820-04-3AE21FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-3AE21FA | OBSOLETE | 1 | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||
|
Trenz Electronic GmbH 0820-04-2AE21FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2AE21FA | OBSOLETE | 1 | Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||
| Trenz Electronic GmbH 0820-04-4DE21FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-4DE21FA | 3A991A2 | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU4EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||
|
Trenz Electronic GmbH 0820-04-2BE21FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2BE21FA | OBSOLETE | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||
| Trenz Electronic GmbH 0710-02-72I21-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0710 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0710 | download | ROHS3 Compliant | Not Applicable | 1686-TE0710-02-72I21-A | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 100MHz | 512MB | 32MB | FPGA Core | - | Samtec LSHM | ||
| iWave Systems IW-G30M-C4CG-4E002G-E008G-BIA | iWave Systems |
Min: 1 Mult: 1 |
/image/iWave Systems | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 4.330" L x 2.950" W (110.00mm x 75.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 2503-IW-G30M-C4CG-4E002G-E008G-BIA | 8473.30.1180 | 1 | ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2) | 1.5GHz, 600MHz | 4GB, 1GB | 8GB eMMC | MPU, FPG | ARM® Mali 400 MP2 | 2 x 240 Pin | ||||
| iWave Systems IW-G30M-C5EV-4E004G-E008G-BIA | iWave Systems |
Min: 1 Mult: 1 |
/image/iWave Systems | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 4.330" L x 2.950" W (110.00mm x 75.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 2503-IW-G30M-C5EV-4E004G-E008G-BIA | 8473.30.1180 | 1 | ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2) | 1.5GHz, 600MHz | 4GB, 1GB | 8GB eMMC | MPU, FPGA | ARM® Mali 400 MP2 | 2 x 240 Pin | ||||
| iWave Systems IW-G24M-CU2F-4E002G-S008G-LIK | iWave Systems |
Min: 1 Mult: 1 |
/image/iWave Systems | Arria® 10 | Bulk | Active | -40°C ~ 85°C | 3.740" L x 2.950" W (95.00mm x 75.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 2503-IW-G24M-CU2F-4E002G-S008G-LIK | 8473.30.1180 | 1 | ARM® Cortex®-A9, Arria 10 SX | 1.5GHz | 4GB | 8GB | MPU, FPGA Core | - | 2 x 240 Pin | ||||
|
Critical Link LLC L138-DG-225-RI-1 | Critical Link LLC |
Min: 1 Mult: 1 |
/image/Critical Link LLC | MityDSP-L138F | Bulk | Obsolete | -40°C ~ 85°C | 2.660" L x 2.000" W (67.60mm x 50.80mm) | 1057-L138-DG-225-RI-1 | OBSOLETE | 1 | ARM926EJ-S, OMAP-L138 | 375MHz | 8kB (Internal), 128MB (External) | 256MB (NAND), 8MB (NOR) | MPU, DSP, FPGA Core | TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA) | SO-DIMM-200 | ||||||
|
Critical Link LLC 1810-DG-225-RI | Critical Link LLC |
Min: 1 Mult: 1 |
/image/Critical Link LLC | MitySOM | Bulk | Obsolete | -40°C ~ 85°C | 2.660" L x 2.000" W (67.60mm x 50.80mm) | download | 1057-1810-DG-225-RI | OBSOLETE | 1 | Spartan-6, XC6SLX16 | 375MHz | 8kB (Internal), 128MB (External) | 256MB (NAND), 8MB (NOR) | MPU, FPGA Core | Spartan-6, XC6SLX16 | SO-DIMM-200 | |||||
|
Critical Link LLC 1808-DG-225-RI | Critical Link LLC |
Min: 1 Mult: 1 |
/image/Critical Link LLC | MitySOM | Bulk | Obsolete | -40°C ~ 85°C | 2.660" L x 2.000" W (67.60mm x 50.80mm) | download | 1057-1808-DG-225-RI | OBSOLETE | 1 | Spartan-6, XC6SLX16 | 375MHz | 8kB (Internal), 128MB (External) | 256MB (NAND), 8MB (NOR) | MPU, FPGA Core | Spartan-6, XC6SLX16 | SO-DIMM-200 | |||||
|
Intel DG8065101418900 | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Bulk | Active | Not applicable | 3 (168 Hours) | Vendor Undefined | 0000.00.0000 | 1 | |||||||||||||
| Rochester Electronics, LLC D8087-1 | Rochester Electronics, LLC |
Min: 1 Mult: 1 |
/image/Rochester Electronics, LLC | * | Bulk | Active | download | RoHS non-compliant | 3 (168 Hours) | Vendor Undefined | EAR99 | 8542.39.0001 | 1 | ||||||||||||
| Critical Link LLC A10S-P9-A5E-RI-SB | Critical Link LLC |
Min: 1 Mult: 1 |
/image/Critical Link LLC | MitySOM | Bag | Active | -40°C ~ 85°C | 4.000" L x 4.000" W (101.50mm x 101.50mm) | A10S-P9 | download | 1 (Unlimited) | 1057-A10S-P9-A5E-RI-SB | 3A991A2 | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1.2GHz | 4GB | - | MPU, FPGA Core | NEON™ SIMD | Board-to-Board (BTB) | |||
| Critical Link LLC A10S-P9-A5E-RC-SB | Critical Link LLC |
Min: 1 Mult: 1 |
/image/Critical Link LLC | MitySOM | Bag | Active | 0°C ~ 70°C | 4.000" L x 4.000" W (101.50mm x 101.50mm) | A10S-P9 | download | 1 (Unlimited) | 1057-A10S-P9-A5E-RC-SB | 1 | ARM® Cortex®-A9 | 1.2GHz | 4GB | - | MPU, FPGA Core | NEON™ SIMD | Board-to-Board (BTB) | |||||
| Critical Link LLC A10S-P8-A5E-RI-SB | Critical Link LLC |
Min: 1 Mult: 1 |
/image/Critical Link LLC | MitySOM | Bag | Active | -40°C ~ 85°C | 4.000" L x 4.000" W (101.50mm x 101.50mm) | A10S-P8 | download | 1 (Unlimited) | 1057-A10S-P8-A5E-RI-SB | 1 | ARM® Cortex®-A9 | 1.2GHz | 4GB | - | MPU, FPGA Core | NEON™ SIMD | Board-to-Board (BTB) | |||||
| Alango VPM8 VOICE PROCESSING MODULE | Alango |
Min: 1 Mult: 1 |
/image/Alango | - | Tray | Active | - | 0.700" L x 0.620" W (17.80mm x 15.80mm) | download | ROHS3 Compliant | 2 (1 Year) | REACH Unaffected | 5A992C | 8517.62.9900 | 1 | RISC | 80MHz | - | - | DSP Core | - | - | |||
| Octavo Systems LLC D32MP157F-512M-EAA | Octavo Systems LLC |
Min: 1 Mult: 1 |
/image/Octavo Systems LLC | - | Tray | Active | -20°C ~ 85°C | 0.710" L x 0.710" W (18.00mm x 18.00mm) | ROHS3 Compliant | 4 (72 Hours) | 1676-OSD32MP157F-512M-EAA | 5A992C | 8542.31.0001 | 65 | STM32MP157F | 800MHz | 512MB | - | MPU Core | - | DSI | ||||
| Trenz Electronic GmbH 0715-05-71I33-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 1686-TE0715-05-71I33-A | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec LSHM | ||||||||
| ARIES Embedded M100PF-1AC | ARIES Embedded |
Min: 1 Mult: 1 |
/image/ARIES Embedded | PolarFire™ | Box | Active | 0°C ~ 70°C | 2.910" L x 1.650" W (74.00mm x 42.00mm) | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | 3199-M100PF-1AC | 3A991 | 8471.50.0150 | 1 | - | - | 1GB | - | FPGA | - | Board-to-Board (BTB) Socket | ||
| ARIES Embedded SPIDERSOM S | ARIES Embedded |
Min: 1 Mult: 1 |
/image/ARIES Embedded | - | Box | Active | 0°C ~ 70°C | 2.760" L x 1.380" W (70.00mm x 35.00mm) | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | 3199-SPIDERSOMS | 8471.50.0150 | 1 | PIC16F1454 | - | 8MB | 4MB | FPGA Core | - | Pin(s) | |||
|
Trenz Electronic GmbH 0720-04-61Q33MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-61Q33MA | EAR99 | 8471.50.0150 | 1 | ARM® Cortex®-A9 | - | 1GB | 32MB | Ethernet Core | - | Board-to-Board (BTB) Socket | |||
|
Trenz Electronic GmbH 0720-04-62I33NA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-62I33NA | 1 | ARM® Cortex®-A9 | - | 1GB | 32MB | Ethernet Core | - | Board-to-Board (BTB) Socket | |||||
|
Critical Link LLC L138-DI-336-RI | Critical Link LLC |
Min: 1 Mult: 1 |
/image/Critical Link LLC | - | Bulk | Obsolete | 1057-L138-DI-336-RI | OBSOLETE | 1 | |||||||||||||||
| ARIES Embedded MCV-X2DB | ARIES Embedded |
Min: 1 Mult: 1 |
/image/ARIES Embedded | - | Box | Active | 0°C ~ 70°C | 2.910" L x 1.650" W (74.00mm x 42.00mm) | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | 3A991 | 8471.50.0150 | 1 | ARM Cortex-A9 (Dual Core) | 800MHz | 1GB | 4GB | FPGA | - | 360 Pin | |||
|
Beacon EmbeddedWorks SOMIMX8MNS-11-29C0DMCR | Beacon EmbeddedWorks |
Min: 1 Mult: 1 |
/image/Beacon EmbeddedWorks | i.MX 8M | Bulk | Active | 0°C ~ 70°C | 1.100" L x 1.500" W (28.00mm x 38.00mm) | download | 460-SOMIMX8MNS-11-29C0DMCR | 1 | ARM® Cortex™-A53, ARM® Cortex™-M7 | 1.5GHz, 750MHz | 1GB | - | MCU Core | - | USB | ||||||
|
Trenz Electronic GmbH 0820-05-5DR21MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Active | - | - | download | 1686-TE0820-05-5DR21MA | 1 | - | - | 2GB | 128MB | MPU Core | - | - | ||||||
|
Trenz Electronic GmbH 0820-05-2AE21MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-2AE21MA | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E | Pin(s) |
