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Sensors, Transducers
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Switches
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Microcontrollers, Microprocessor, FPGA Modules(1446)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
Digi DC-SP-01R-JT | Digi |
Min: 1 Mult: 1 |
/image/Digi | Digi Connect SP | Bulk | Obsolete | 0°C ~ 60°C | 1.680" L x 3.880" W (42.70mm x 98.50mm) | 1 (Unlimited) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 1 | ARM7TDMI, NS7520 | 55MHz | 16MB | 4MB | MPU Core | - | RJ45 | ||||
|
Digi FS-3038 | Digi |
Min: 1 Mult: 1 |
/image/Digi | ConnectCore® | Bulk | Obsolete | -40°C ~ 85°C | 1 (Unlimited) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 1 | ARM926EJ-S, NS9215 | 150MHz | 32MB | 16MB | MPU Core | - | ||||||
| Trenz Electronic GmbH 0714-02-35-2I | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0714 | Bulk | Obsolete | -40°C ~ 85°C | 1.570" L x 1.180" W (40.00mm x 30.00mm) | download | 1 (Unlimited) | REACH Unaffected | 1686-1031 | 3A991D | 8471.50.0150 | 1 | Artix-7 A35T | - | 16MB | FPGA Core | - | Samtec LSHM | ||||
|
Wandboard.Org EDM1-IMX6U-MSD-BW | Wandboard.Org |
Min: 1 Mult: 1 |
/image/Wandboard.Org | - | Box | Active | - | 2.360" L x 3.230" W (60.00mm x 82.00mm) | EDM1-IMX6 | ROHS3 Compliant | 0000.00.0000 | 10 | ARM® Cortex®-A9, i.MX6DualLite | - | 1GB | - | MPU Core | - | EDM Connector | |||||
| Wandboard.Org EDM1-IMX6Q-MSD-BW | Wandboard.Org |
Min: 1 Mult: 1 |
/image/Wandboard.Org | - | Box | Active | - | 2.360" L x 3.230" W (60.00mm x 82.00mm) | EDM1-IMX6 | ROHS3 Compliant | 1 (Unlimited) | 5A002A1 | 8471.50.0150 | 10 | ARM® Cortex®-A9, i.MX6Quad | - | 2GB | - | MPU Core | - | EDM Connector | ||||
|
Wandboard.Org EDM1-IMX6QP-MSD-BW | Wandboard.Org |
Min: 1 Mult: 1 |
/image/Wandboard.Org | - | Box | Active | - | 2.360" L x 3.230" W (60.00mm x 82.00mm) | EDM1-IMX6 | ROHS3 Compliant | 5A002A1 | 8471.50.0150 | 10 | ARM® Cortex®-A9, i.MX6QuadPlus | - | 2GB | - | MPU Core | - | EDM Connector | ||||
| Trenz Electronic GmbH 0600-03BM | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0600 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0600 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-100 | 125MHz | 1GB | 16MB | FPGA Core | - | Samtec LSHM | ||
| Trenz Electronic GmbH 0600-03IVFN | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0600 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0600 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-150 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | ||
| Octavo Systems LLC D3358-512M-IND | Octavo Systems LLC |
Min: 1 Mult: 1 |
/image/Octavo Systems LLC | OSD335x | Tray | Active | -40°C ~ 85°C | 1.060" L x 1.060" W (27.00mm x 27.00mm) | OSD3358 | download | ROHS3 Compliant | 4 (72 Hours) | 1676-1001 | 5A992C | 8542.31.0001 | 40 | ARM® Cortex®-A8, AM3358 | 1GHz | 512MB | - | MPU Core | NEON™ SIMD | 400-BGA | ||
|
Digi DC-ME4-01T-CC | Digi |
Min: 1 Mult: 1 |
/image/Digi | Digi Connect ME® | Bulk | Obsolete | -40°C ~ 85°C | 1.450" L x 0.750" W (36.70mm x 19.10mm) | DC-ME4 | Not Applicable | REACH Unaffected | OBSOLETE | 0000.00.0000 | 1 | ARM7TDMI, NS7520 | 55MHz | 8MB | 4MB | MPU Core | - | RJ45 | |||
|
Digi DC-ME4-01T-CC-1 | Digi |
Min: 1 Mult: 1 |
/image/Digi | Digi Connect ME® | Bulk | Obsolete | -40°C ~ 85°C | 1.450" L x 0.750" W (36.70mm x 19.10mm) | DC-ME4 | Not Applicable | REACH Unaffected | OBSOLETE | 0000.00.0000 | 1 | ARM7TDMI, NS7520 | 55MHz | 8MB | 4MB | MPU Core | - | RJ45 | |||
|
Trenz Electronic GmbH 0820-04-50121FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-50121FA | OBSOLETE | 1 | - | - | - | - | - | - | ||||
|
Trenz Electronic GmbH 0820-04-SDR21FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-SDR21FA | OBSOLETE | 1 | - | - | - | - | - | - | ||||
|
Trenz Electronic GmbH 0820-04-2BI21FL | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2BI21FL | OBSOLETE | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784I | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||
|
Trenz Electronic GmbH 0820-04-2BI21M | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2BI21M | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784I | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||
|
Trenz Electronic GmbH 0820-04-40121MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Active | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-40121MA | 1 | - | - | - | - | - | - | |||||
|
Trenz Electronic GmbH 0720-03-S003C1 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at Digi-Key | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-S003C1 | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | ||||
|
Trenz Electronic GmbH 0720-03-S002 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | - | - | Not Applicable | 1686-TE0720-03-S002 | OBSOLETE | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | |||||
| Trenz Electronic GmbH 0720-03-62I33MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at Digi-Key | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-62I33MA | EAR99 | 8473.30.1180 | 1 | ARM Cortex-A9 | - | 1GB | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||
| Trenz Electronic GmbH 0720-03-61Q33ML | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at Digi-Key | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-61Q33ML | 1 | ARM Cortex-A9 | - | 1GB | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||
|
Trenz Electronic GmbH 0720-03-S001C1 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | - | - | Not Applicable | 1686-TE0720-03-S001C1 | OBSOLETE | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | |||||
|
Trenz Electronic GmbH 0823-01-S002 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0823 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0823-01-S002 | 1 | ARM Cortex-A53, ARM® Cortex®-R5 | - | - | - | MCU, FPGA | - | USB | ||||||
| Trenz Electronic GmbH 0741-04-B2C-1-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Box | Active | ROHS3 Compliant | Not Applicable | 1686-TE0741-04-B2C-1-A | 1 | |||||||||||||||
| Trenz Electronic GmbH 0813-01-4BE11-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Box | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0813-01-4BE11-A | EAR99 | 8538.90.8180 | 1 | Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E | - | 2GB | 128MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||
|
Trenz Electronic GmbH 0741-04-G2C-1-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-G2C-1-A | 1 | Xilinx Kintex-7 FPGA XC7K410T-2FBG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | ||||
|
Trenz Electronic GmbH 0741-04-B3E-1-AF | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | * | Box | Active | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-B3E-1-AF | 1 | ||||||||||||||
|
Trenz Electronic GmbH 0808-05-BBE21-AZ | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Box | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1 | Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 2GB | 128MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||||
|
Trenz Electronic GmbH 0741-04-A2C-1-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-A2C-1-A | 1 | Xilinx Kintex-7 FPGA XC7K70T-2FBG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | ||||
|
Trenz Electronic GmbH 0741-04-B2C-1-AF | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-B2C-1-AF | 1 | Xilinx Kintex-7 FPGA XC7K160T-2FFG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | ||||
|
Trenz Electronic GmbH S00014 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | * | Box | Obsolete | ROHS3 Compliant | 1 (Unlimited) | 1686-S00014 | OBSOLETE | 1 |
