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Embedded(154023)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Base Product Number | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Controller Series |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Renesas Electronics America Inc R7S910025CBG#AC0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RZ/T1 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 320-FBGA | R7S910025 | 320-FBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 209 | ARM® Cortex®-R4F | 32-Bit Single-Core | 450MHz | CANbus, CSI, EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB | DMA, POR, PWM, WDT | - | ROMless | - | 1.5M x 8 | 1.14V ~ 3.6V | A/D 24x12b | Internal | ||||||||||||||||||
| Renesas Electronics America Inc R7S910026CBG#AC0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RZ/T1 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 320-FBGA | R7S910026 | 320-FBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 209 | ARM® Cortex®-R4F | 32-Bit Single-Core | 450MHz | CANbus, CSI, EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB | DMA, POR, PWM, WDT | - | ROMless | - | 1.5M x 8 | 1.14V ~ 3.6V | A/D 24x12b | Internal | ||||||||||||||||||
| Melexis Technologies NV MLX81107KLW-CAE-000-SP | Melexis Technologies NV |
Min: 1 Mult: 1 |
/image/Melexis Technologies NV | - | Bulk | Active | -40°C ~ 125°C (TA) | LIN Controller | Surface Mount | 20-VQFN Exposed Pad | MLX81107 | Not Verified | 5.5V ~ 18V | 20-QFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 73 | 12 | 16-Bit RISC | FLASH (24kB), EEPROM (384 B) | 1K x 8 | SPI | - | ||||||||||||||||||||||
| Melexis Technologies NV MLX81108KDC-CAE-000-SP | Melexis Technologies NV |
Min: 1 Mult: 1 |
/image/Melexis Technologies NV | - | Bulk | Active | -40°C ~ 125°C (TA) | LIN Controller | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | MLX81108 | Not Verified | 5.5V ~ 18V | 8-SOIC | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 80 | 4 | 16-Bit RISC | FLASH (24kB), EEPROM (384 B) | 1K x 8 | SPI | - | ||||||||||||||||||||||
| Melexis Technologies NV MLX81107KLW-CAE-000-RE | Melexis Technologies NV |
Min: 1 Mult: 1 |
/image/Melexis Technologies NV | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | LIN Controller | Surface Mount | 20-VQFN Exposed Pad | Not Verified | 5.5V ~ 18V | 20-QFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 5,000 | 12 | 16-Bit RISC | FLASH (24kB), EEPROM (384 B) | 1K x 8 | SPI | - | |||||||||||||||||||||||
| Melexis Technologies NV MLX81109KLW-CAE-000-RE | Melexis Technologies NV |
Min: 1 Mult: 1 |
/image/Melexis Technologies NV | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | LIN Controller | Surface Mount | 20-VQFN Exposed Pad | MLX81109 | Not Verified | 5.5V ~ 18V | 20-QFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 5,000 | 12 | 16-Bit RISC | FLASH (24kB), EEPROM (384 B) | 1K x 8 | SPI | - | ||||||||||||||||||||||
| NXP USA Inc. LS1012ASN7EKA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ® Layerscape | Tray | Active | 0°C ~ 105°C | Surface Mount | 211-VFLGA | LS1012 | 211-FCLGA (9.6x9.6) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325013557 | 3A991A2 | 8542.31.0001 | 168 | ARM® Cortex®-A53 | 600MHz | 1 Core, 64-Bit | - | DDR3L | - | - | GbE (2) | SATA 6Gbps (1) | USB 2.0 (1), USB 3.0 + PHY | - | Secure Boot, TrustZone® | - | ||||||||||||||||||
| NXP USA Inc. MC9S08AW32MFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-QFP | MC9S08 | 64-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319942557 | 3A991A2 | 8542.31.0001 | 84 | 54 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | |||||||||||||||||
| NXP USA Inc. MC9S08AW32VFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-QFP | MC9S08 | 64-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325685557 | 3A991A2 | 8542.31.0001 | 420 | 54 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | |||||||||||||||||
| NXP USA Inc. MC9S08QE32CFMR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | MC9S08 | 32-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322981528 | 3A991A2 | 8542.31.0001 | 5,000 | 26 | S08 | 8-Bit | 50MHz | I²C, LINbus, SCI, SPI | LVD, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | A/D 10x12b | Internal | |||||||||||||||||
| NXP USA Inc. MC9S08SL8VTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | MC9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 75 | 16 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | 256 x 8 | 512 x 8 | 2.7V ~ 5.5V | A/D 12x10b | External | ||||||||||||||||||
| NXP USA Inc. MCF51AC256BCFGER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF51AC | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | MCF51 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320266528 | 3A991A2 | 8542.31.0001 | 1,500 | 36 | Coldfire V1 | 32-Bit Single-Core | 50MHz | I²C, SCI, SPI | LVD, PWM, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 2.7V ~ 5.5V | A/D 9x12b | External | |||||||||||||||||
| NXP USA Inc. MCF5272CVM66R2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF527x | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 196-LBGA | MCF5272 | 196-LBGA (15x15) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 750 | 32 | Coldfire V2 | 32-Bit Single-Core | 66MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB | DMA, WDT | 16KB (4K x 32) | ROM | - | 1K x 32 | 3V ~ 3.6V | - | External | ||||||||||||||||||
| NXP USA Inc. MCHC11F1VFNE4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC11 | Tube | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 68-LCC (J-Lead) | MCHC11 | 68-PLCC (24.21x24.21) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314607574 | EAR99 | 8542.31.0001 | 18 | 30 | HC11 | 8-Bit | 4MHz | SCI, SPI | POR, WDT | - | ROMless | 512 x 8 | 1K x 8 | 4.75V ~ 5.25V | A/D 8x8b | Internal | ||||||||||||||||||
| NXP USA Inc. MKS22FN128VFT12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KS22 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | MKS22FN128 | 48-QFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 260 | 35 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, I²C, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 1x16b; D/A 1x12b | Internal | ||||||||||||||||||
| NXP USA Inc. S908AB32AE2CFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC08 | Bulk | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 64-QFP | S908 | 64-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325615557 | EAR99 | 8542.31.0001 | 420 | 51 | HC08 | 8-Bit | 8MHz | SCI, SPI | POR, PWM | 32KB (32K x 8) | FLASH | 512 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x8b | Internal | ||||||||||||||||||
| NXP USA Inc. S908AB32AH3CFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC08 | Bulk | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 64-QFP | S908 | 64-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310168557 | EAR99 | 8542.31.0001 | 420 | 51 | HC08 | 8-Bit | 8MHz | SCI, SPI | POR, PWM | 32KB (32K x 8) | FLASH | 512 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x8b | Internal | ||||||||||||||||||
| NXP USA Inc. S908AB32AH3CFUER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC08 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 64-QFP | S908 | 64-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310168528 | EAR99 | 8542.31.0001 | 750 | 51 | HC08 | 8-Bit | 8MHz | SCI, SPI | POR, PWM | 32KB (32K x 8) | FLASH | 512 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x8b | Internal | ||||||||||||||||||
| NXP USA Inc. S908AB32AH3MFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC08 | Bulk | Not For New Designs | -40°C ~ 125°C (TA) | Surface Mount | 64-QFP | S908 | 64-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319768557 | EAR99 | 8542.31.0001 | 420 | 51 | HC08 | 8-Bit | 8MHz | SCI, SPI | POR, PWM | 32KB (32K x 8) | FLASH | 512 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x8b | Internal | ||||||||||||||||||
| NXP USA Inc. S912B32E4CFUE8 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC12 | Bulk | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 80-QFP | S912 | 80-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935309891557 | EAR99 | 8542.31.0001 | 420 | 63 | CPU12 | 16-Bit | 8MHz | SCI, SPI | POR, PWM, WDT | 32KB (32K x 8) | FLASH | 768 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x10b | External | ||||||||||||||||||
| NXP USA Inc. S912B32E4MFUE8R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC12 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 125°C (TA) | Surface Mount | 80-QFP | S912 | 80-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313938528 | EAR99 | 8542.31.0001 | 750 | 63 | CPU12 | 16-Bit | 8MHz | SCI, SPI | POR, PWM, WDT | 32KB (32K x 8) | FLASH | 768 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x10b | External | ||||||||||||||||||
| NXP USA Inc. S912B32E4VFUE8R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC12 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 80-QFP | S912 | 80-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935309978528 | EAR99 | 8542.31.0001 | 750 | 63 | CPU12 | 16-Bit | 8MHz | SCI, SPI | POR, PWM, WDT | 32KB (32K x 8) | FLASH | 768 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x10b | External | ||||||||||||||||||
| NXP USA Inc. S912DG12AH4CPVE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC12 | Bulk | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317811557 | EAR99 | 8542.31.0001 | 300 | 69 | CPU12 | 16-Bit | 8MHz | CANbus, I²C, SCI, SPI | POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 4.5V ~ 5.5V | A/D 16x8/10b | Internal | ||||||||||||||||||
| NXP USA Inc. S912DG12CE1VPVER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC12 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310718528 | EAR99 | 8542.31.0001 | 500 | 69 | CPU12 | 16-Bit | 8MHz | CANbus, I²C, SCI, SPI | POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 4.5V ~ 5.5V | A/D 16x8/10b | Internal | ||||||||||||||||||
| NXP USA Inc. S912ZVCA96F0VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S912 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316485557 | 3A991A2 | 8542.31.0001 | 1,250 | 28 | HCS12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 2K x 8 | 8K x 8 | 3.5V ~ 40V | A/D 10x12b; D/A 1x8b | Internal | |||||||||||||||||
| NXP USA Inc. S912ZVLA12F0MLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | S912 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316407528 | 3A991A2 | 8542.31.0001 | 2,000 | 19 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 6x10b; D/A 1x8b | Internal | |||||||||||||||||
| NXP USA Inc. S912ZVLA12F0MLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | S912 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313301528 | 3A991A2 | 8542.31.0001 | 2,000 | 34 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 10x10b; D/A 1x8b | Internal | |||||||||||||||||
| NXP USA Inc. S9S12DP51J4CPVER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | S9S12 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322788528 | 3A991A2 | 8542.31.0001 | 500 | 20 | HCS12 | 16-Bit | 25MHz | CANbus, I²C, SCI, SPI | PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 14K x 8 | 2.35V ~ 5.25V | A/D 8x10b | External | ||||||||||||||||||
| NXP USA Inc. S9S12G192F0VLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313357528 | 3A991A2 | 8542.31.0001 | 2,000 | 40 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 192KB (192K x 8) | FLASH | 4K x 8 | 11K x 8 | 3.13V ~ 5.5V | A/D 16x10b | Internal | ||||||||||||||||||
| NXP USA Inc. SAC57D54HCVMO | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MAC57Dxxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 516-BGA | SAC57 | 516-MAPBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 200 | ARM® Cortex®-A5/M4/M0+ | 32-Bit Tri-Core | 80MHz, 160MHz, 320MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI | DMA, LCD, LVD/HVD, POR, PWM, WDT | 4MB (4M x 8) | FLASH | - | 2.3M x 8 | 3.15V ~ 5.5V | A/D 24x12b | Internal |
