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Memory(65687)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Technology | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Clock Frequency | Memory Type | Memory Size | Access Time | Memory Format | Memory Organization | Memory Interface | Write Cycle Time - Word, Page |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ISSI, Integrated Silicon Solution Inc IS43TR81280A-15GBL | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
/image/ISSI, Integrated Silicon Solution Inc | - | Bulk | Discontinued at Digi-Key | 0°C ~ 70°C (TA) | Surface Mount | 78-TFBGA | IS43TR81280 | SDRAM - DDR3 | 1.425V ~ 1.575V | 78-TWBGA (8x10.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.32.0032 | 242 | 667 MHz | Volatile | 1Gbit | 20 ns | DRAM | 128M x 8 | Parallel | 15ns | ||
| ISSI, Integrated Silicon Solution Inc IS62WV2568DBLL-45TLI | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
/image/ISSI, Integrated Silicon Solution Inc | - | Bulk | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | IS62WV2568 | SRAM - Asynchronous | 2.5V ~ 3.6V | 32-TSOP I | download | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 3A991 | 8542.32.0041 | 1 | Volatile | 2Mbit | 45 ns | SRAM | 256K x 8 | Parallel | 45ns | |||
| GigaDevice Semiconductor (HK) Limited GD25Q80EWIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | GD25Q80 | FLASH - NOR | 2.7V ~ 3.6V | 8-WSON (5x6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.32.0071 | 3,000 | 133 MHz | Non-Volatile | 8Mbit | 7 ns | FLASH | 1M x 8 | SPI - Quad I/O | 70µs, 2ms | ||
 |
GigaDevice Semiconductor (HK) Limited GD25Q256EYIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | GD25Q256 | FLASH - NOR | 2.7V ~ 3.6V | 8-WSON (6x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1970-GD25Q256EYIGRTR | 3A991B1A | 8542.32.0071 | 3,000 | 133 MHz | Non-Volatile | 256Mbit | 7 ns | FLASH | 32M x 8 | SPI - Quad I/O | 50µs, 2.4ms |
| GigaDevice Semiconductor (HK) Limited GD25Q64ETIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | GD25Q64 | FLASH - NOR | 2.7V ~ 3.6V | 8-SOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1970-GD25Q64ETIGRTR | 3A991B1A | 8542.32.0071 | 3,000 | 133 MHz | Non-Volatile | 64Mbit | 7 ns | FLASH | 8M x 8 | SPI - Quad I/O | 70µs, 2.4ms | |
|
GigaDevice Semiconductor (HK) Limited GD25Q128EWIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | GD25Q128 | FLASH - NOR | 2.7V ~ 3.6V | 8-WSON (5x6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 3,000 | 133 MHz | Non-Volatile | 128Mbit | 7 ns | FLASH | 16M x 8 | SPI - Quad I/O | 70µs, 2.4ms | |
|
GigaDevice Semiconductor (HK) Limited GD25Q32ETIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | GD25Q32 | FLASH - NOR | 2.7V ~ 3.6V | 8-SOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 3,000 | 133 MHz | Non-Volatile | 32Mbit | 7 ns | FLASH | 4M x 8 | SPI - Quad I/O | 70µs, 2.4ms | |
|
GigaDevice Semiconductor (HK) Limited GD25Q16EWIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | GD25Q16 | FLASH - NOR | 2.7V ~ 3.6V | 8-WSON (5x6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.32.0071 | 3,000 | 133 MHz | Non-Volatile | 16Mbit | 7 ns | FLASH | 2M x 8 | SPI - Quad I/O | 70µs, 2ms | |
| GigaDevice Semiconductor (HK) Limited GD25Q80ESIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | GD25Q80 | FLASH - NOR | 2.7V ~ 3.6V | 8-SOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.32.0071 | 2,000 | 133 MHz | Non-Volatile | 8Mbit | 7 ns | FLASH | 1M x 8 | SPI - Quad I/O | 70µs, 2ms | ||
| GigaDevice Semiconductor (HK) Limited GD25LQ128ESIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | GD25LQ128 | FLASH - NOR | 1.65V ~ 2V | 8-SOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1970-GD25LQ128ESIGRCT | 3A991B1A | 8542.32.0071 | 2,000 | 120 MHz | Non-Volatile | 128Mbit | 7 ns | FLASH | 16M x 8 | SPI - Quad I/O | 60µs, 2.4ms | |
|
Analog Devices Inc./Maxim Integrated DS2501P+T&R | Analog Devices Inc./Maxim Integrated |
Min: 1 Mult: 1 |
/image/Analog Devices Inc./Maxim Integrated | - | Bulk | Obsolete | ROHS3 Compliant | 175-DS2501P+T&R | OBSOLETE | 1 | |||||||||||||||||||
| Winbond Electronics W631GG6NB-12 TR | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | - | Tape & Reel (TR) | Active | 0°C ~ 95°C (TC) | Surface Mount | 96-VFBGA | W631GG6 | SDRAM - DDR3 | 1.425V ~ 1.575V | 96-VFBGA (7.5x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.32.0032 | 3,000 | 800 MHz | Volatile | 1Gbit | 20 ns | DRAM | 64M x 16 | SSTL_15 | 15ns | ||
| Microchip Technology 24FC512T-E/Q4B | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 24FC512 | EEPROM | 1.7V ~ 5.5V | 8-UDFN (2x3) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.32.0051 | 5,000 | 1 MHz | Non-Volatile | 512Kbit | 900 ns | EEPROM | 64K x 8 | I²C | 5ms | ||
| Microchip Technology AT24CSW010-STUM-T | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TC) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | AT24CSW010 | EEPROM | 1.7V ~ 3.6V | TSOT-23-5 | download | ROHS3 Compliant | 2 (1 Year) | REACH Unaffected | EAR99 | 8542.32.0051 | 5,000 | 1 MHz | Non-Volatile | 1Kbit | 450 ns | EEPROM | 128 x 8 | I²C | 5ms | ||
| Microchip Technology 24FC512T-I/Q4B | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 24FC512 | EEPROM | 1.7V ~ 5.5V | 8-UDFN (2x3) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.32.0051 | 5,000 | 1 MHz | Non-Volatile | 512Kbit | 900 ns | EEPROM | 64K x 8 | I²C | 5ms | ||
| Microchip Technology 24CS512T-E/Q4B | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 24CS512 | EEPROM | 1.7V ~ 5.5V | 8-UDFN (2x3) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.32.0051 | 5,000 | 3.4 MHz | Non-Volatile | 512Kbit | 400 ns | EEPROM | 64K x 8 | I²C | 5ms | ||
| ISSI, Integrated Silicon Solution Inc IS46LD32128A-18BPLA2 | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
/image/ISSI, Integrated Silicon Solution Inc | Automotive, AEC-Q100 | Tray | Obsolete | -40°C ~ 105°C (TC) | Surface Mount | 168-VFBGA | IS46LD32128 | SDRAM - Mobile LPDDR2-S4 | 1.14V ~ 1.3V, 1.7V ~ 1.95V | 168-VFBGA (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 706-IS46LD32128A-18BPLA2 | OBSOLETE | 1 | 533 MHz | Volatile | 4Gbit | 5.5 ns | DRAM | 128M x 32 | HSUL_12 | 15ns | |||
| ISSI, Integrated Silicon Solution Inc IS43LD16256A-25BPLI | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
/image/ISSI, Integrated Silicon Solution Inc | - | Tray | Obsolete | -40°C ~ 85°C (TC) | Surface Mount | 168-VFBGA | IS43LD16256 | SDRAM - Mobile LPDDR2-S4 | 1.14V ~ 1.3V, 1.7V ~ 1.95V | 168-VFBGA (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 706-IS43LD16256A-25BPLI | OBSOLETE | 1 | 400 MHz | Volatile | 4Gbit | 5.5 ns | DRAM | 256M x 16 | HSUL_12 | 15ns | |||
| ISSI, Integrated Silicon Solution Inc IS43LD16256A-18BPLI-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
/image/ISSI, Integrated Silicon Solution Inc | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TC) | Surface Mount | 168-VFBGA | IS43LD16256 | SDRAM - Mobile LPDDR2-S4 | 1.14V ~ 1.3V, 1.7V ~ 1.95V | 168-VFBGA (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 706-IS43LD16256A-18BPLI-TR | OBSOLETE | 1 | 533 MHz | Volatile | 4Gbit | 5.5 ns | DRAM | 256M x 16 | HSUL_12 | 15ns | |||
| ISSI, Integrated Silicon Solution Inc IS46LD32128B-18BPLA1-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
/image/ISSI, Integrated Silicon Solution Inc | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TC) | Surface Mount | 168-VFBGA | IS46LD32128 | SDRAM - Mobile LPDDR2-S4 | 1.14V ~ 1.3V, 1.7V ~ 1.95V | 168-VFBGA (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 706-IS46LD32128B-18BPLA1-TR | EAR99 | 8542.32.0036 | 1 | 533 MHz | Volatile | 4Gbit | 5.5 ns | DRAM | 128M x 32 | HSUL_12 | 15ns | |
| ISSI, Integrated Silicon Solution Inc IS43LD16256C-18BPLI | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
/image/ISSI, Integrated Silicon Solution Inc | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 85°C (TC) | Surface Mount | 168-VFBGA | IS43LD16256 | SDRAM - Mobile LPDDR2 | 1.14V ~ 1.3V, 1.7V ~ 1.95V | 168-VFBGA (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 706-IS43LD16256C-18BPLI | EAR99 | 8542.32.0036 | 1 | 533 MHz | Volatile | 4Gbit | 5.5 ns | DRAM | 256M x 16 | HSUL_12 | 15ns | |
| Winbond Electronics W25Q128JVBSQ | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 24-TBGA | W25Q128 | FLASH - NOR | 2.7V ~ 3.6V | 24-TFBGA (6x8) | 3 (168 Hours) | REACH Unaffected | 256-W25Q128JVBSQ | 1 | 133 MHz | Non-Volatile | 128Mbit | 6 ns | FLASH | 16M x 8 | SPI - Quad I/O | 3ms | |||||
| Winbond Electronics W25Q128JVFSM | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | W25Q128 | FLASH - NOR | 2.7V ~ 3.6V | 16-SOIC | 3 (168 Hours) | REACH Unaffected | 256-W25Q128JVFSM | 1 | 133 MHz | Non-Volatile | 128Mbit | 6 ns | FLASH | 16M x 8 | SPI - Quad I/O, QPI, DTR | 3ms | |||||
| Winbond Electronics W25Q128JVBAM | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | W25Q128 | FLASH - NOR | 2.7V ~ 3.6V | 24-TFBGA (6x8) | 3 (168 Hours) | REACH Unaffected | 256-W25Q128JVBAM | 1 | 133 MHz | Non-Volatile | 128Mbit | 6 ns | FLASH | 16M x 8 | SPI - Quad I/O, QPI, DTR | 3ms | |||||
| Winbond Electronics W25Q128JVFAQ | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | W25Q128 | FLASH - NOR | 2.7V ~ 3.6V | 16-SOIC | 3 (168 Hours) | REACH Unaffected | 256-W25Q128JVFAQ | 1 | 133 MHz | Non-Volatile | 128Mbit | 6 ns | FLASH | 16M x 8 | SPI - Quad I/O | 3ms | |||||
| Winbond Electronics W25Q128JVBSM | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 24-TBGA | W25Q128 | FLASH - NOR | 2.7V ~ 3.6V | 24-TFBGA (6x8) | 3 (168 Hours) | REACH Unaffected | 256-W25Q128JVBSM | 1 | 133 MHz | Non-Volatile | 128Mbit | 6 ns | FLASH | 16M x 8 | SPI - Quad I/O, QPI, DTR | 3ms | |||||
| Winbond Electronics W25Q128BVFBG | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | W25Q128 | FLASH - NOR | 2.7V ~ 3.6V | 16-SOIC | 3 (168 Hours) | REACH Unaffected | 256-W25Q128BVFBG | OBSOLETE | 1 | 104 MHz | Non-Volatile | 128Mbit | 7 ns | FLASH | 16M x 8 | SPI - Quad I/O | 50µs, 3ms | ||||
|
Winbond Electronics W25Q128BVBAG | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 63-VFBGA | W25Q128 | FLASH - NOR | 2.7V ~ 3.6V | 63-VFBGA (9x11) | 3 (168 Hours) | REACH Unaffected | 256-W25Q128BVBAG | OBSOLETE | 1 | 104 MHz | Non-Volatile | 128Mbit | 7 ns | FLASH | 16M x 8 | SPI - Quad I/O | 50µs, 3ms | |||
| Winbond Electronics W25Q128FWPAQ | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | W25Q128 | FLASH - NOR | 1.65V ~ 1.95V | 8-WSON (6x5) | 3 (168 Hours) | REACH Unaffected | 256-W25Q128FWPAQ | OBSOLETE | 1 | 104 MHz | Non-Volatile | 128Mbit | 6 ns | FLASH | 16M x 8 | SPI - Quad I/O, QPI | 60µs, 5ms | ||||
| Winbond Electronics W25Q128FWPBQ | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | W25Q128 | FLASH - NOR | 1.65V ~ 1.95V | 8-WSON (6x5) | 3 (168 Hours) | REACH Unaffected | 256-W25Q128FWPBQ | OBSOLETE | 1 | 104 MHz | Non-Volatile | 128Mbit | 6 ns | FLASH | 16M x 8 | SPI - Quad I/O, QPI | 60µs, 5ms |
