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Memory(65687)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Technology | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Clock Frequency | Memory Type | Memory Size | Access Time | Memory Format | Memory Organization | Memory Interface | Write Cycle Time - Word, Page |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Alliance Memory, Inc. AS4C128M32MD2-18BCN | Alliance Memory, Inc. |
Min: 1 Mult: 1 |
/image/Alliance Memory, Inc. | - | Tray | Obsolete | -25°C ~ 85°C (TC) | Surface Mount | 134-VFBGA | AS4C128 | SDRAM - Mobile LPDDR2 | 1.14V ~ 1.95V | 134-FBGA (10x11.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1450-1404 | EAR99 | 8542.32.0036 | 168 | 533 MHz | Volatile | 4Gbit | DRAM | 128M x 32 | Parallel | 15ns | ||
| Alliance Memory, Inc. AS4C2M32D1A-5BIN | Alliance Memory, Inc. |
Min: 1 Mult: 1 |
/image/Alliance Memory, Inc. | - | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LFBGA | AS4C2M32 | SDRAM - DDR | 2.3V ~ 2.7V | 144-LFBGA (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1450-1406 | EAR99 | 8542.32.0002 | 189 | 200 MHz | Volatile | 64Mbit | 700 ps | DRAM | 2M x 32 | Parallel | 15ns | |
| Alliance Memory, Inc. AS4C32M32MD2-25BCN | Alliance Memory, Inc. |
Min: 1 Mult: 1 |
/image/Alliance Memory, Inc. | - | Tray | Obsolete | -30°C ~ 85°C (TC) | Surface Mount | 134-VFBGA | AS4C2M32 | SDRAM - Mobile LPDDR2 | 1.14V ~ 1.95V | 134-FBGA (10x11.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1450-1410 | EAR99 | 8542.32.0032 | 128 | 400 MHz | Volatile | 1Gbit | DRAM | 32M x 32 | Parallel | 15ns | ||
| Alliance Memory, Inc. AS4C64M16MD2-25BCN | Alliance Memory, Inc. |
Min: 1 Mult: 1 |
/image/Alliance Memory, Inc. | - | Tray | Obsolete | -30°C ~ 85°C (TC) | Surface Mount | 134-VFBGA | AS4C64 | SDRAM - Mobile LPDDR2 | 1.14V ~ 1.95V | 134-FBGA (10x11.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1450-1412 | EAR99 | 8542.32.0032 | 128 | 400 MHz | Volatile | 1Gbit | DRAM | 64M x 16 | Parallel | 15ns | ||
| Kioxia America, Inc. TC58CVG2S0HQAIE | Kioxia America, Inc. |
Min: 1 Mult: 1 |
/image/Kioxia America, Inc. | - | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | TC58CVG2 | FLASH - NAND (SLC) | 2.7V ~ 3.6V | 16-SOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 168 | 104 MHz | Non-Volatile | 4Gbit | 280 µs | FLASH | 512M x 8 | SPI | - | ||
| Winbond Electronics W25Q128JVPIQ | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | W25Q128 | FLASH - NOR | 2.7V ~ 3.6V | 8-WSON (6x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 100 | 133 MHz | Non-Volatile | 128Mbit | FLASH | 16M x 8 | SPI - Quad I/O, QPI, DTR | 3ms | |||
| Winbond Electronics W25Q128JVEIM | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | W25Q128 | FLASH - NOR | 2.7V ~ 3.6V | 8-WSON (8x6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 63 | 133 MHz | Non-Volatile | 128Mbit | FLASH | 16M x 8 | SPI - Quad I/O, QPI, DTR | 3ms | |||
| Winbond Electronics W25Q128JVFIM | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | W25Q128 | FLASH - NOR | 2.7V ~ 3.6V | 16-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 44 | 133 MHz | Non-Volatile | 128Mbit | FLASH | 16M x 8 | SPI - Quad I/O, QPI, DTR | 3ms | |||
| Winbond Electronics W25Q128JVFIM TR | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | W25Q128 | FLASH - NOR | 2.7V ~ 3.6V | 16-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 1,000 | 133 MHz | Non-Volatile | 128Mbit | FLASH | 16M x 8 | SPI - Quad I/O, QPI, DTR | 3ms | |||
| Winbond Electronics W25Q128JVSIM | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | W25Q128 | FLASH - NOR | 2.7V ~ 3.6V | 8-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 90 | 133 MHz | Non-Volatile | 128Mbit | FLASH | 16M x 8 | SPI - Quad I/O, QPI, DTR | 3ms | |||
 |
Winbond Electronics W25Q128JVTIM TR | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | W25Q128 | FLASH - NOR | 2.7V ~ 3.6V | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 2,000 | 133 MHz | Non-Volatile | 128Mbit | FLASH | 16M x 8 | SPI - Quad I/O | - | ||||||
|
Winbond Electronics W25Q128JVTIQ | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Active | -40°C ~ 85°C (TA) | W25Q128 | FLASH - NOR | 2.7V ~ 3.6V | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 90 | 133 MHz | Non-Volatile | 128Mbit | FLASH | 16M x 8 | SPI - Quad I/O | - | ||||||
| Winbond Electronics W25Q128FVBIG | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Discontinued at Digi-Key | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | W25Q128 | FLASH - NOR | 2.7V ~ 3.6V | 24-TFBGA (6x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 480 | 104 MHz | Non-Volatile | 128Mbit | FLASH | 16M x 8 | SPI - Quad I/O, QPI | 50µs, 3ms | |||
| Winbond Electronics W25Q128FVTIQ | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Discontinued at Digi-Key | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | W25Q128 | FLASH - NOR | 2.7V ~ 3.6V | 8-VSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 90 | 104 MHz | Non-Volatile | 128Mbit | FLASH | 16M x 8 | SPI - Quad I/O, QPI | 50µs, 3ms | |||
| Micron Technology Inc. 29F2G08ABAEAH4-E:E | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | - | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 63-VFBGA | MT29F2G08 | FLASH - NAND | 2.7V ~ 3.6V | 63-VFBGA (9x11) | ROHS3 Compliant | 3 (168 Hours) | 3A991B1A | 8542.32.0071 | 1,260 | Non-Volatile | 2Gbit | FLASH | 256M x 8 | Parallel | - | ||||||
| Micron Technology Inc. 29F2G08ABBFAH4:F | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | - | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 63-VFBGA | MT29F2G08 | FLASH - NAND | 1.7V ~ 1.95V | 63-VFBGA (9x11) | ROHS3 Compliant | 3 (168 Hours) | OBSOLETE | 0000.00.0000 | 1,260 | Non-Volatile | 2Gbit | FLASH | 256M x 8 | Parallel | - | ||||||
| Micron Technology Inc. 29F2G16ABBFAH4:F | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | - | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 63-VFBGA | MT29F2G16 | FLASH - NAND | 1.7V ~ 1.95V | 63-VFBGA (9x11) | ROHS3 Compliant | 3 (168 Hours) | OBSOLETE | 0000.00.0000 | 1,260 | Non-Volatile | 2Gbit | FLASH | 128M x 16 | Parallel | - | ||||||
|
Micron Technology Inc. 29F4G08ABADAM60A3WC1 | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | - | Bulk | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | Die | MT29F4G08 | FLASH - NAND | 2.7V ~ 3.6V | Die | ROHS3 Compliant | 3 (168 Hours) | OBSOLETE | 0000.00.0000 | 1 | Non-Volatile | 4Gbit | FLASH | 512M x 8 | Parallel | - | |||||
| Micron Technology Inc. 29F8G08ADADAH4-E:D | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | - | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 63-VFBGA | MT29F8G08 | FLASH - NAND | 2.7V ~ 3.6V | 63-VFBGA (9x11) | ROHS3 Compliant | 3 (168 Hours) | OBSOLETE | 0000.00.0000 | 1,260 | Non-Volatile | 8Gbit | FLASH | 1G x 8 | Parallel | - | ||||||
| Micron Technology Inc. 29F2G08ABAEAH4-E:E TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | - | Tape & Reel (TR) | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 63-VFBGA | MT29F2G08 | FLASH - NAND | 2.7V ~ 3.6V | 63-VFBGA (9x11) | ROHS3 Compliant | 3 (168 Hours) | OBSOLETE | 0000.00.0000 | 1,000 | Non-Volatile | 2Gbit | FLASH | 256M x 8 | Parallel | - | ||||||
| Kaga FEI America, Inc. MB85RC64TAPNF-G-BDERE1 | Kaga FEI America, Inc. |
Min: 1 Mult: 1 |
/image/Kaga FEI America, Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | MB85RC64 | FRAM (Ferroelectric RAM) | 1.8V ~ 3.6V | 8-SOP | download | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.32.0071 | 1,500 | 3.4 MHz | Non-Volatile | 64Kbit | 130 ns | FRAM | 8K x 8 | I²C | - | |||
| Kaga FEI America, Inc. MB85RQ4MLPF-G-BCERE1 | Kaga FEI America, Inc. |
Min: 1 Mult: 1 |
/image/Kaga FEI America, Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | MB85RQ4 | FRAM (Ferroelectric RAM) | 1.7V ~ 1.95V | 16-SOP | download | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.32.0071 | 500 | 108 MHz | Non-Volatile | 4Mbit | FRAM | 512K x 8 | SPI - Quad I/O | - | ||||
| Kaga FEI America, Inc. MB85AS4MTPF-G-BCERE1 | Kaga FEI America, Inc. |
Min: 1 Mult: 1 |
/image/Kaga FEI America, Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | MB85AS4 | ReRAM (Resistive RAM) | 1.65V ~ 3.6V | 8-SOP | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.32.0071 | 500 | 5 MHz | Non-Volatile | 4Mbit | RAM | 512K x 8 | SPI | 17ms | ||||
| Winbond Electronics W25Q256JVFIM TR | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | W25Q256 | FLASH - NOR | 2.7V ~ 3.6V | 16-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 1,000 | 133 MHz | Non-Volatile | 256Mbit | FLASH | 32M x 8 | SPI - Quad I/O | 3ms | |||
| Winbond Electronics W25Q256JVFIM | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | W25Q256 | FLASH - NOR | 2.7V ~ 3.6V | 16-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 44 | 133 MHz | Non-Volatile | 256Mbit | FLASH | 32M x 8 | SPI - Quad I/O | 3ms | |||
| Winbond Electronics W25Q256FVBIP TR | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | W25Q256 | FLASH - NOR | 2.7V ~ 3.6V | 24-TFBGA (6x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 2,000 | 104 MHz | Non-Volatile | 256Mbit | FLASH | 32M x 8 | SPI - Quad I/O, QPI | 50µs, 3ms | |||
| Winbond Electronics W25Q256FVCIP TR | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | W25Q256 | FLASH - NOR | 2.7V ~ 3.6V | 24-TFBGA (6x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 2,000 | 104 MHz | Non-Volatile | 256Mbit | FLASH | 32M x 8 | SPI - Quad I/O, QPI | 50µs, 3ms | |||
| Winbond Electronics W25Q256FVFIP TR | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | W25Q256 | FLASH - NOR | 2.7V ~ 3.6V | 16-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 1,000 | 104 MHz | Non-Volatile | 256Mbit | FLASH | 32M x 8 | SPI - Quad I/O, QPI | 50µs, 3ms | |||
| Winbond Electronics W25Q256FVBIP | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Discontinued at Digi-Key | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | W25Q256 | FLASH - NOR | 2.7V ~ 3.6V | 24-TFBGA (6x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 480 | 104 MHz | Non-Volatile | 256Mbit | FLASH | 32M x 8 | SPI - Quad I/O, QPI | 50µs, 3ms | |||
| Winbond Electronics W25Q256FVCIP | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Discontinued at Digi-Key | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | W25Q256 | FLASH - NOR | 2.7V ~ 3.6V | 24-TFBGA (6x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 480 | 104 MHz | Non-Volatile | 256Mbit | FLASH | 32M x 8 | SPI - Quad I/O, QPI | 50µs, 3ms |
