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Memory(66694)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Technology | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Clock Frequency | Memory Type | Memory Size | Access Time | Memory Format | Memory Organization | Memory Interface | Write Cycle Time - Word, Page |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Winbond Electronics W25Q32JVSFIM | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | W25Q32 | FLASH - NOR | 2.7V ~ 3.6V | 16-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 256-W25Q32JVSFIM | 3A991B1A | 8542.32.0071 | 44 | 133 MHz | Non-Volatile | 32Mbit | 6 ns | FLASH | 4M x 8 | SPI - Quad I/O, QPI, DTR | 3ms | |
| Winbond Electronics W25Q16JWXHIM TR | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-XFDFN Exposed Pad | W25Q16 | FLASH - NOR | 1.65V ~ 1.95V | 8-XSON (2x3) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 256-W25Q16JWXHIMTR | EAR99 | 8542.32.0071 | 4,000 | 133 MHz | Non-Volatile | 16Mbit | 6 ns | FLASH | 2M x 8 | SPI - Quad I/O, QPI, DTR | 3ms | |
| Microchip Technology 24FC01T-E/OT36KVAO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | SC-74A, SOT-753 | 24FC01 | EEPROM | 1.7V ~ 5.5V | SOT-23-5 | download | REACH Unaffected | 150-24FC01T-E/OT36KVAOTR | EAR99 | 8542.32.0051 | 3,000 | 1 MHz | Non-Volatile | 1Kbit | 450 ns | EEPROM | 128 x 8 | I²C | 5ms | |||
 |
Microchip Technology 24FC02T-E/ST36KVAO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 24FC02 | EEPROM | 1.7V ~ 5.5V | 8-TSSOP | download | REACH Unaffected | 150-24FC02T-E/ST36KVAOTR | EAR99 | 8542.32.0051 | 2,500 | 1 MHz | Non-Volatile | 2Kbit | 450 ns | EEPROM | 256 x 8 | I²C | 5ms | ||
| Winbond Electronics W25N01GVZEIR TR | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | W25N01 | FLASH - NAND (SLC) | 2.7V ~ 3.6V | 8-WSON (8x6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 256-W25N01GVZEIRTR | 3A991B1A | 8542.32.0071 | 4,000 | 104 MHz | Non-Volatile | 1Gbit | 7 ns | FLASH | 128M x 8 | SPI - Quad I/O | 700µs | |
| Winbond Electronics W25N01JWTBIG TR | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | W25N01 | FLASH - NAND (SLC) | 1.7V ~ 1.95V | 24-TFBGA (8x6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 256-W25N01JWTBIGTR | 3A991B1A | 8542.32.0071 | 2,000 | 166 MHz | Non-Volatile | 1Gbit | 6 ns | FLASH | 128M x 8 | SPI - Quad I/O, QPI, DTR | 700µs | |
| Winbond Electronics W29N01HZBINA TR | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 63-VFBGA | W29N01 | FLASH - NAND (SLC) | 1.7V ~ 1.95V | 63-VFBGA (9x11) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 256-W29N01HZBINATR | 3A991B1A | 8542.32.0071 | 2,500 | Non-Volatile | 1Gbit | 22 ns | FLASH | 128M x 8 | ONFI | 25ns | ||
| Winbond Electronics W25Q256JWBIM | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | W25Q256 | FLASH - NOR | 1.7V ~ 1.95V | 24-TFBGA (6x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 256-W25Q256JWBIM | 3A991B1A | 8542.32.0071 | 480 | 133 MHz | Non-Volatile | 256Mbit | 6 ns | FLASH | 32M x 8 | SPI - Quad I/O, QPI, DTR | 5ms | |
| Winbond Electronics W979H6KBVX1E | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | - | Tray | Not For New Designs | -25°C ~ 85°C (TC) | Surface Mount | 134-VFBGA | W979H6 | SDRAM - Mobile LPDDR2-S4B | 1.14V ~ 1.3V, 1.7V ~ 1.95V | 134-VFBGA (10x11.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 256-W979H6KBVX1E | EAR99 | 8542.32.0028 | 168 | 533 MHz | Volatile | 512Mbit | DRAM | 32M x 16 | HSUL_12 | 15ns | ||
| Winbond Electronics W9864G6JB-6I TR | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | - | Tape & Reel (TR) | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 60-TFBGA | W9864G6 | SDRAM | 3V ~ 3.6V | 60-VFBGA (6.4x10.1) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 256-W9864G6JB-6ITR | EAR99 | 8542.32.0024 | 2,000 | 166 MHz | Volatile | 64Mbit | 5 ns | DRAM | 4M x 16 | LVTTL | - | |
| Winbond Electronics W978H2KBVX2I TR | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | - | Tape & Reel (TR) | Not For New Designs | -40°C ~ 85°C (TC) | Surface Mount | 134-VFBGA | W978H2 | SDRAM - Mobile LPDDR2-S4B | 1.14V ~ 1.3V, 1.7V ~ 1.95V | 134-VFBGA (10x11.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 256-W978H2KBVX2ITR | EAR99 | 8542.32.0024 | 3,500 | 400 MHz | Volatile | 256Mbit | 5.5 ns | DRAM | 8M x 32 | HSUL_12 | 15ns | |
| Winbond Electronics W25Q20EWSVIG | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | W25Q20 | FLASH - NOR | 1.65V ~ 1.95V | 8-VSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 256-W25Q20EWSVIG | EAR99 | 8542.32.0071 | 480 | 104 MHz | Non-Volatile | 2Mbit | 6 ns | FLASH | 256K x 8 | SPI - Quad I/O | 30µs, 800µs | |
| Microchip Technology AT24CSW080-STUM-T | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TC) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | AT24CSW080 | EEPROM | 1.7V ~ 3.6V | TSOT-23-5 | download | ROHS3 Compliant | 2 (1 Year) | REACH Unaffected | EAR99 | 8542.32.0051 | 5,000 | 1 MHz | Non-Volatile | 8Kbit | 450 ns | EEPROM | 1K x 8 | I²C | 5ms | ||
| Microchip Technology AT24CSW040-STUM-T | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TC) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | AT24CSW040 | EEPROM | 1.7V ~ 3.6V | TSOT-23-5 | download | ROHS3 Compliant | 2 (1 Year) | REACH Unaffected | EAR99 | 8542.32.0051 | 5,000 | 1 MHz | Non-Volatile | 4Kbit | 450 ns | EEPROM | 512 x 8 | I²C | 5ms | ||
| Macronix MX25UW6345GBEI00 | Macronix |
Min: 1 Mult: 1 |
/image/Macronix | * | Tray | Active | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 3,000 | ||||||||||||||||||
| ISSI, Integrated Silicon Solution Inc IS43LD32128A-18BPL-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
/image/ISSI, Integrated Silicon Solution Inc | - | Tape & Reel (TR) | Obsolete | 0°C ~ 85°C (TC) | Surface Mount | 168-VFBGA | IS43LD32128 | SDRAM - Mobile LPDDR2-S4 | 1.14V ~ 1.3V, 1.7V ~ 1.95V | 168-VFBGA (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 706-IS43LD32128A-18BPL-TR | OBSOLETE | 1 | 533 MHz | Volatile | 4Gbit | 5.5 ns | DRAM | 128M x 32 | HSUL_12 | 15ns | |||
| ISSI, Integrated Silicon Solution Inc IS43LD16256A-25BPLI-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
/image/ISSI, Integrated Silicon Solution Inc | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TC) | Surface Mount | 168-VFBGA | IS43LD16256 | SDRAM - Mobile LPDDR2-S4 | 1.14V ~ 1.3V, 1.7V ~ 1.95V | 168-VFBGA (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 706-IS43LD16256A-25BPLI-TR | OBSOLETE | 1 | 400 MHz | Volatile | 4Gbit | 5.5 ns | DRAM | 256M x 16 | HSUL_12 | 15ns | |||
| ISSI, Integrated Silicon Solution Inc IS43LD16256C-25BPLI-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
/image/ISSI, Integrated Silicon Solution Inc | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TC) | Surface Mount | 168-VFBGA | IS43LD16256 | SDRAM - Mobile LPDDR2 | 1.14V ~ 1.3V, 1.7V ~ 1.95V | 168-VFBGA (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 706-IS43LD16256C-25BPLI-TR | EAR99 | 8542.32.0036 | 1 | 400 MHz | Volatile | 4Gbit | 5.5 ns | DRAM | 256M x 16 | HSUL_12 | 15ns | |
|
Renesas Electronics America Inc X28HC64PIZ-90 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | - | Bulk | Obsolete | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 20-X28HC64PIZ-90 | OBSOLETE | 13 | ||||||||||||||||
|
Renesas Electronics America Inc X28HC64SIZ-70 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | - | Bulk | Obsolete | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 20-X28HC64SIZ-70 | OBSOLETE | 25 | ||||||||||||||||
| Winbond Electronics W25Q64FWZPAQ | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | W25Q64 | FLASH - NOR | 1.65V ~ 1.95V | 8-WSON (6x5) | 3 (168 Hours) | REACH Unaffected | 256-W25Q64FWZPAQ | OBSOLETE | 1 | 104 MHz | Non-Volatile | 64Mbit | 6 ns | FLASH | 8M x 8 | SPI - Quad I/O, QPI | 60µs, 5ms | ||||
| Winbond Electronics W25Q64JWZPSM | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 8-WDFN Exposed Pad | W25Q64 | FLASH - NOR | 1.7V ~ 1.95V | 8-WSON (6x5) | 3 (168 Hours) | REACH Unaffected | 256-W25Q64JWZPSM | 1 | 133 MHz | Non-Volatile | 64Mbit | 6 ns | FLASH | 8M x 8 | SPI - Quad I/O, QPI, DTR | 3ms | |||||
| Winbond Electronics W25Q64JWSSAQ | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | W25Q64 | FLASH - NOR | 1.7V ~ 1.95V | 8-SOIC | 3 (168 Hours) | REACH Unaffected | 256-W25Q64JWSSAQ | 1 | 133 MHz | Non-Volatile | 64Mbit | 6 ns | FLASH | 8M x 8 | SPI - Quad I/O, QPI, DTR | 3ms | |||||
| Winbond Electronics W25Q64FWZPSQ | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 8-WDFN Exposed Pad | W25Q64 | FLASH - NOR | 1.65V ~ 1.95V | 8-WSON (6x5) | 3 (168 Hours) | REACH Unaffected | 256-W25Q64FWZPSQ | OBSOLETE | 1 | 104 MHz | Non-Volatile | 64Mbit | 6 ns | FLASH | 8M x 8 | SPI - Quad I/O, QPI | 60µs, 5ms | ||||
| Winbond Electronics W25Q64FWZPSG | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 8-WDFN Exposed Pad | W25Q64 | FLASH - NOR | 1.65V ~ 1.95V | 8-WSON (6x5) | 3 (168 Hours) | REACH Unaffected | 256-W25Q64FWZPSG | OBSOLETE | 1 | 104 MHz | Non-Volatile | 64Mbit | 6 ns | FLASH | 8M x 8 | SPI - Quad I/O, QPI | 60µs, 5ms | ||||
| Winbond Electronics W25Q32FVZPAQ | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | W25Q32 | FLASH - NOR | 2.7V ~ 3.6V | 8-WSON (6x5) | 3 (168 Hours) | REACH Unaffected | 256-W25Q32FVZPAQ | OBSOLETE | 1 | 104 MHz | Non-Volatile | 32Mbit | 7 ns | FLASH | 4M x 8 | SPI - Quad I/O, QPI | 50µs, 3ms | ||||
| Winbond Electronics W25Q32FVSSBQ | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | W25Q32 | FLASH - NOR | 2.7V ~ 3.6V | 8-SOIC | 3 (168 Hours) | REACH Unaffected | 256-W25Q32FVSSBQ | OBSOLETE | 1 | 104 MHz | Non-Volatile | 32Mbit | 7 ns | FLASH | 4M x 8 | SPI - Quad I/O, QPI | 50µs, 3ms | ||||
| Winbond Electronics W25Q32FVXGBQ | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 8-XDFN Exposed Pad | W25Q32 | FLASH - NOR | 2.7V ~ 3.6V | 8-XSON (4x4) | 3 (168 Hours) | REACH Unaffected | 256-W25Q32FVXGBQ | OBSOLETE | 1 | 104 MHz | Non-Volatile | 32Mbit | 7 ns | FLASH | 4M x 8 | SPI - Quad I/O, QPI | 50µs, 3ms | ||||
| Winbond Electronics W25Q32FVTBBQ | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | W25Q32 | FLASH - NOR | 2.7V ~ 3.6V | 24-TFBGA (8x6) | 3 (168 Hours) | REACH Unaffected | 256-W25Q32FVTBBQ | OBSOLETE | 1 | 104 MHz | Non-Volatile | 32Mbit | 7 ns | FLASH | 4M x 8 | SPI - Quad I/O, QPI | 50µs, 3ms | ||||
| Winbond Electronics W25Q32FVSFAQ | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | SpiFlash® | Tube | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | W25Q32 | FLASH - NOR | 2.7V ~ 3.6V | 16-SOIC | 3 (168 Hours) | REACH Unaffected | 256-W25Q32FVSFAQ | OBSOLETE | 1 | 104 MHz | Non-Volatile | 32Mbit | 7 ns | FLASH | 4M x 8 | SPI - Quad I/O, QPI | 50µs, 3ms |
