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Memory(66694)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Technology | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Clock Frequency | Programmable Type | Memory Type | Memory Size | Access Time | Memory Format | Memory Organization | Memory Interface | Write Cycle Time - Word, Page |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Infineon Technologies S80KS2563GABHM020 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | HYPERRAM™ | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 24-VBGA | S80KS2563 | PSRAM (Pseudo SRAM) | 1.7V ~ 2V | 24-FBGA (6x8) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991B1A | 8542.32.0024 | 338 | 200 MHz | Volatile | 256Mbit | 35 ns | PSRAM | 32M x 8 | SPI - Octal I/O | 35ns | ||||
| Infineon Technologies S80KS5123GABHA020 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | HYPERRAM™ | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 24-VBGA | S80KS5123 | PSRAM (Pseudo SRAM) | 1.7V ~ 2V | 24-FBGA (6x8) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991B1A | 8542.32.0028 | 338 | 200 MHz | Volatile | 512Mbit | 35 ns | PSRAM | 64M x 8 | SPI - Octal I/O | 35ns | ||||
 |
AMD XCF01SVO20C0100 | AMD |
Min: 1 Mult: 1 |
/image/AMD | - | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | Not Verified | 3V ~ 3.6V | 20-TSSOP | ROHS3 Compliant | 3 (168 Hours) | 122-XCF01SVO20C0100 | OBSOLETE | 2,500 | In System Programmable | 1Mb | ||||||||||||
| ISSI, Integrated Silicon Solution Inc IS25WP020E-JNLE | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
/image/ISSI, Integrated Silicon Solution Inc | - | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | IS25WP020 | FLASH - NOR | 1.7V ~ 1.95V | 8-SOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 706-IS25WP020E-JNLE | EAR99 | 8542.32.0071 | 100 | 104 MHz | Non-Volatile | 2Mbit | 8 ns | FLASH | 256K x 8 | SPI - Quad I/O, QPI, DTR | 1.2ms | |||
| ISSI, Integrated Silicon Solution Inc IS25WP040E-JYLE-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
/image/ISSI, Integrated Silicon Solution Inc | - | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | IS25WP040 | FLASH - NOR | 1.7V ~ 1.95V | 8-USON (2x3) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 706-IS25WP040E-JYLE-TR | EAR99 | 8542.32.0071 | 5,000 | 104 MHz | Non-Volatile | 4Mbit | 8 ns | FLASH | 512K x 8 | SPI - Quad I/O, QPI, DTR | 1.2ms | |||
|
Renesas Electronics America Inc R1EV5801MBTDRDI#B0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | R1EV5801MB | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | R1EV5801 | EEPROM | 2.7V ~ 5.5V | 32-TSOP I | download | ROHS3 Compliant | 3 (168 Hours) | 559-R1EV5801MBTDRDI#B0 | EAR99 | 8542.32.0051 | 1 | Non-Volatile | 1Mbit | 150 ns | EEPROM | 128K x 8 | Parallel | 10ms | ||||
|
Renesas Electronics America Inc R1EV58064BTCRBI#B2 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | R1EV58064BxxR | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | R1EV58064 | EEPROM | 2.7V ~ 5.5V | 28-TSOP I | download | ROHS3 Compliant | 3 (168 Hours) | 559-R1EV58064BTCRBI#B2 | EAR99 | 8542.32.0051 | 60 | Non-Volatile | 64Kbit | 100 ns | EEPROM | 8K x 8 | Parallel | 10ms | ||||
|
Renesas Electronics America Inc R1EV58064BDARBI#B2 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | R1EV58064BxxR | Tray | Obsolete | -40°C ~ 85°C (TA) | Through Hole | 28-DIP (0.600", 15.24mm) | R1EV58064 | EEPROM | 2.7V ~ 5.5V | 28-DIP | download | ROHS3 Compliant | 3 (168 Hours) | 559-R1EV58064BDARBI#B2 | EAR99 | 8542.32.0051 | 25 | Non-Volatile | 64Kbit | 100 ns | EEPROM | 8K x 8 | Parallel | 10ms | ||||
|
Renesas Electronics America Inc R1EV58256BTDRBI#B2 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | R1EV58256BxxR | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | R1EV58256 | EEPROM | 2.7V ~ 5.5V | 32-TSOP I | ROHS3 Compliant | 3 (168 Hours) | 559-R1EV58256BTDRBI#B2 | EAR99 | 8542.32.0051 | 60 | Non-Volatile | 256Kbit | 85 ns | EEPROM | 32K x 8 | Parallel | 10ms | |||||
|
Renesas Electronics America Inc R1EV58064BTCNBI#B2 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | R1EV58064BxxN | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | R1EV58064 | EEPROM | 2.7V ~ 5.5V | 28-TSOP I | download | ROHS3 Compliant | 3 (168 Hours) | 559-R1EV58064BTCNBI#B2 | EAR99 | 8542.32.0051 | 60 | Non-Volatile | 64Kbit | 100 ns | EEPROM | 8K x 8 | Parallel | 10ms | ||||
|
Renesas Electronics America Inc R1EV58064BSCNBI#B2 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | R1EV58064BxxN | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.330", 8.40mm Width) | R1EV58064 | EEPROM | 2.7V ~ 5.5V | 28-SOP | download | ROHS3 Compliant | 3 (168 Hours) | 559-R1EV58064BSCNBI#B2 | EAR99 | 8542.32.0051 | 25 | Non-Volatile | 64Kbit | 100 ns | EEPROM | 8K x 8 | Parallel | 10ms | ||||
|
Renesas Electronics America Inc R1EV58064BSCRBI#B2 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | R1EV58064BxxR | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.330", 8.40mm Width) | R1EV58064 | EEPROM | 2.7V ~ 5.5V | 28-SOP | download | ROHS3 Compliant | 3 (168 Hours) | 559-R1EV58064BSCRBI#B2 | EAR99 | 8542.32.0051 | 25 | Non-Volatile | 64Kbit | 100 ns | EEPROM | 8K x 8 | Parallel | 10ms | ||||
|
Renesas Electronics America Inc R1EV5801MBSDRDI#B0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | R1EV5801MB | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 32-SOIC (0.445", 11.30mm Width) | R1EV5801 | EEPROM | 2.7V ~ 5.5V | 32-SOP | download | ROHS3 Compliant | 3 (168 Hours) | 559-R1EV5801MBSDRDI#B0 | EAR99 | 8542.32.0051 | 1 | Non-Volatile | 1Mbit | 150 ns | EEPROM | 128K x 8 | Parallel | 10ms | ||||
|
Renesas Electronics America Inc R1EV58256BSCNBI#S2 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | R1EV58256BxxN | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.330", 8.40mm Width) | R1EV58256 | EEPROM | 2.7V ~ 5.5V | 28-SOP | ROHS3 Compliant | 3 (168 Hours) | 559-R1EV58256BSCNBI#S2TR | EAR99 | 8542.32.0051 | 1,000 | Non-Volatile | 256Kbit | 85 ns | EEPROM | 32K x 8 | Parallel | 10ms | |||||
|
Micron Technology Inc. 29F32G08ABEABM73A3WC1L | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | - | Bulk | Active | 0°C ~ 70°C | Surface Mount | Die | MT29F32G08 | FLASH - NAND (SLC) | - | Wafer | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 557-MT29F32G08ABEABM73A3WC1L | 1 | Non-Volatile | 32Gbit | FLASH | 4G x 8 | - | - | |||||||
|
Micron Technology Inc. 29F16G08CBACAL72A3WC1L | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | - | Bulk | Active | 0°C ~ 70°C (TA) | Surface Mount | Die | MT29F16G08 | FLASH - NAND (MLC) | 2.7V ~ 3.6V | Wafer | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 557-MT29F16G08CBACAL72A3WC1L | 1 | Non-Volatile | 16Gbit | FLASH | 2G x 8 | ONFI | 20ns | |||||||
| ISSI, Integrated Silicon Solution Inc IS21TF16G-JQLI-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
/image/ISSI, Integrated Silicon Solution Inc | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LBGA | IS21TF16G | FLASH - NAND (TLC) | 2.7V ~ 3.6V | 100-LFBGA (14x18) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 706-IS21TF16G-JQLI-TR | 3A991B1A | 8542.32.0071 | 1,000 | 200 MHz | Non-Volatile | 128Gbit | FLASH | 16G x 8 | MMC | - | ||||
| ISSI, Integrated Silicon Solution Inc IS21TF08G-JCLI-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
/image/ISSI, Integrated Silicon Solution Inc | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 153-VFBGA | IS21TF08G | FLASH - NAND (TLC) | 2.7V ~ 3.6V | 153-VFBGA (11.5x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 706-IS21TF08G-JCLI-TR | 3A991B1A | 8542.32.0071 | 2,000 | 200 MHz | Non-Volatile | 64Gbit | FLASH | 8G x 8 | MMC | - | ||||
| ISSI, Integrated Silicon Solution Inc IS21TF32G-JCLI | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
/image/ISSI, Integrated Silicon Solution Inc | - | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 153-VFBGA | IS21TF32G | FLASH - NAND (TLC) | 2.7V ~ 3.6V | 153-VFBGA (11.5x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 706-IS21TF32G-JCLI | 3A991B1A | 8542.32.0071 | 152 | 200 MHz | Non-Volatile | 256Gbit | FLASH | 32G x 8 | MMC | - | ||||
| ISSI, Integrated Silicon Solution Inc IS22TF08G-JCLA1 | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
/image/ISSI, Integrated Silicon Solution Inc | - | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 153-VFBGA | IS22TF08 | FLASH - NAND (pSLC) | 2.7V ~ 3.6V | 153-VFBGA (11.5x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 706-IS22TF08G-JCLA1 | 3A991B1A | 8542.32.0071 | 152 | 200 MHz | Non-Volatile | 64Gbit | FLASH | 8G x 8 | MMC | - | ||||
| ISSI, Integrated Silicon Solution Inc IS21TF16G-JCLI-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
/image/ISSI, Integrated Silicon Solution Inc | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 153-VFBGA | IS21TF16G | FLASH - NAND (TLC) | 2.7V ~ 3.6V | 153-VFBGA (11.5x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 706-IS21TF16G-JCLI-TR | 3A991B1A | 8542.32.0071 | 2,000 | 200 MHz | Non-Volatile | 128Gbit | FLASH | 16G x 8 | MMC | - | ||||
| ISSI, Integrated Silicon Solution Inc IS21TF64G-JCLI-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
/image/ISSI, Integrated Silicon Solution Inc | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 153-VFBGA | IS21TF64G | FLASH - NAND (TLC) | 2.7V ~ 3.6V | 153-VFBGA (11.5x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 706-IS21TF64G-JCLI-TR | 3A991B1A | 8542.32.0071 | 2,000 | 200 MHz | Non-Volatile | 512Gbit | FLASH | 64G x 8 | MMC | - | ||||
| Kaga FEI America, Inc. MB85AS8MTPWG-KBCERE1 | Kaga FEI America, Inc. |
Min: 1 Mult: 1 |
/image/Kaga FEI America, Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 11-XFBGA, WLBGA | MB85AS8 | ReRAM (Resistive RAM) | 1.6V ~ 3.6V | 11-WLP (2.07x2.88) | ROHS3 Compliant | 3 (168 Hours) | 865-MB85AS8MTPWG-KBCERE1TR | EAR99 | 8542.32.0071 | 10,000 | 10 MHz | Non-Volatile | 8Mbit | 35 ns | RAM | 1M x 8 | SPI | 10ms | |||||
| Kioxia America, Inc. THGBMUG8C2LBAIL | Kioxia America, Inc. |
Min: 1 Mult: 1 |
/image/Kioxia America, Inc. | - | Tray | Active | 3 (168 Hours) | 1853-THGBMUG8C2LBAIL | 3A991B1A | 8542.32.0071 | 152 | |||||||||||||||||||||
| Micron Technology Inc. FC4GLGDQ-AIT A TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | - | Tape & Reel (TR) | Last Time Buy | -40°C ~ 85°C (TA) | Surface Mount | 100-LBGA | MTFC4 | FLASH - NAND | 2.7V ~ 3.6V | 100-LBGA (14x18) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 557-MTFC4GLGDQ-AITATR | 1,000 | 52 MHz | Non-Volatile | 32Gbit | FLASH | 4G x 8 | MMC | - | |||||||
|
Renesas Electronics America Inc X28HC64JIZ-70T1 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 32-LCC (J-Lead) | X28HC64 | EEPROM | 4.5V ~ 5.5V | 32-PLCC (13.97x11.43) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 20-X28HC64JIZ-70T1TR | EAR99 | 8542.32.0051 | 750 | Non-Volatile | 64Kbit | 70 ns | EEPROM | 8K x 8 | Parallel | 5ms | ||||
| Micron Technology Inc. 61M256M32KPA-14 AAT:C | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | - | Bulk | Obsolete | -40°C ~ 105°C (TC) | Surface Mount | 180-TFBGA | MT61M256 | SGRAM - GDDR6 | 1.21V ~ 1.29V | 180-FBGA (12x14) | ROHS3 Compliant | 3 (168 Hours) | 557-MT61M256M32KPA-14AAT:C | OBSOLETE | 1,260 | 1.5 GHz | Volatile | 8Gbit | DRAM | 256M x 32 | Parallel | - | |||||||
| Micron Technology Inc. 62F1G64D8CH-031 WT:B TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | - | Tape & Reel (TR) | Active | -25°C ~ 85°C (TC) | - | - | MT62F1G64 | SDRAM - Mobile LPDDR5 | 1.05V | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 557-MT62F1G64D8CH-031WT:BTR | 2,500 | 3.2 GHz | Volatile | 64Gbit | DRAM | 1G x 64 | - | - | |||||||
|
Micron Technology Inc. 62F1G64D8CH-031 WT:A | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | - | Bulk | Obsolete | -25°C ~ 85°C (TC) | - | - | MT62F1G64 | SDRAM - Mobile LPDDR5 | 1.05V | - | ROHS3 Compliant | 3 (168 Hours) | 557-MT62F1G64D8CH-031WT:A | OBSOLETE | 1,190 | 3.2 GHz | Volatile | 64Gbit | DRAM | 1G x 64 | - | - | ||||||
|
Micron Technology Inc. 62F1G64D8CH-031 WT:A TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | - | Tape & Reel (TR) | Obsolete | -25°C ~ 85°C (TC) | - | - | MT62F1G64 | SDRAM - Mobile LPDDR5 | 1.05V | - | ROHS3 Compliant | 3 (168 Hours) | 557-MT62F1G64D8CH-031WT:ATR | OBSOLETE | 2,500 | 3.2 GHz | Volatile | 64Gbit | DRAM | 1G x 64 | - | - |
