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Memory(66694)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Technology | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Clock Frequency | Memory Type | Memory Size | Access Time | Memory Format | Memory Organization | Memory Interface | Write Cycle Time - Word, Page |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Alliance Memory, Inc. AS4C512M16D3LA-10BINTR | Alliance Memory, Inc. |
Min: 1 Mult: 1 |
/image/Alliance Memory, Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | AS4C512 | SDRAM - DDR3L | 1.283V ~ 1.45V | 96-FBGA (13.5x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1450-AS4C512M16D3LA-10BINTR | EAR99 | 8542.32.0036 | 2,000 | 933 MHz | Volatile | 8Gbit | 20 ns | DRAM | 512M x 16 | Parallel | 15ns | |
| Alliance Memory, Inc. AS4C512M16D3LB-12BINTR | Alliance Memory, Inc. |
Min: 1 Mult: 1 |
/image/Alliance Memory, Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | AS4C512 | SDRAM - DDR3L | 1.283V ~ 1.45V | 96-FBGA (13.5x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1450-AS4C512M16D3LB-12BINTR | EAR99 | 8542.32.0032 | 2,000 | 800 MHz | Volatile | 8Gbit | 20 ns | DRAM | 512M x 16 | Parallel | 15ns | |
| Alliance Memory, Inc. AS4C512M16D3LB-12BCNTR | Alliance Memory, Inc. |
Min: 1 Mult: 1 |
/image/Alliance Memory, Inc. | - | Tape & Reel (TR) | Active | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | AS4C512 | SDRAM - DDR3L | 1.283V ~ 1.45V | 96-FBGA (13.5x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1450-AS4C512M16D3LB-12BCNTR | EAR99 | 8542.32.0036 | 2,000 | 800 MHz | Volatile | 8Gbit | 20 ns | DRAM | 512M x 16 | Parallel | 15ns | |
| Alliance Memory, Inc. AS4C512M16D3LB-12BIN | Alliance Memory, Inc. |
Min: 1 Mult: 1 |
/image/Alliance Memory, Inc. | - | Tray | Active | -40°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | AS4C512 | SDRAM - DDR3L | 1.283V ~ 1.45V | 96-FBGA (13.5x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1450-AS4C512M16D3LB-12BIN | EAR99 | 8542.32.0032 | 180 | 800 MHz | Volatile | 8Gbit | 20 ns | DRAM | 512M x 16 | Parallel | 15ns | |
| Cypress Semiconductor Corp S29GL512N10FAI010 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
/image/Cypress Semiconductor Corp | GL-N | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | S29GL512 | FLASH - NOR | 2.7V ~ 3.6V | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 2832-S29GL512N10FAI010 | 3A991B1A | 8542.32.0051 | 28 | Non-Volatile | 512Mbit | 100 ns | FLASH | 64M x 8, 32M x 16 | Parallel | ||||||
| Microchip Technology AT24HC04BN-SP25-T | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100 | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | AT24HC04 | EEPROM | 2.5V ~ 5.5V | 8-SOIC | 150-AT24HC04BN-SP25-TTR | OBSOLETE | 1,000 | 400 kHz | Non-Volatile | 4Kbit | 900 ns | EEPROM | 512 x 8 | I²C | 5ms | ||||||
 |
Kaga FEI America, Inc. MB85RS256APNF-G-JNERE1 | Kaga FEI America, Inc. |
Min: 1 Mult: 1 |
/image/Kaga FEI America, Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | MB85RS256 | FRAM (Ferroelectric RAM) | 3V ~ 3.6V | 8-SOP | download | ROHS3 Compliant | 3 (168 Hours) | 865-MB85RS256APNF-G-JNERE1TR | EAR99 | 8542.32.0071 | 1,500 | 25 MHz | Non-Volatile | 256Kbit | FRAM | 32K x 8 | SPI | - | ||
|
Microchip Technology AT28HC64B-70TU-T | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | AT28HC64 | EEPROM | 4.5V ~ 5.5V | 28-TSOP | download | ROHS3 Compliant | 3 (168 Hours) | 150-AT28HC64B-70TU-TTR | OBSOLETE | 2,000 | Non-Volatile | 64Kbit | 70 ns | EEPROM | 8K x 8 | Parallel | 10ms | |||
|
Analog Devices Inc./Maxim Integrated DS2501P+ | Analog Devices Inc./Maxim Integrated |
Min: 1 Mult: 1 |
/image/Analog Devices Inc./Maxim Integrated | - | Bulk | Obsolete | ROHS3 Compliant | 175-DS2501P+ | OBSOLETE | 1 | |||||||||||||||||||
|
GigaDevice Semiconductor (HK) Limited GD25LQ128EWIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | GD25LQ128 | FLASH - NOR | 1.65V ~ 2V | 8-WSON (5x6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 3,000 | 120 MHz | Non-Volatile | 128Mbit | 7 ns | FLASH | 16M x 8 | SPI - Quad I/O | 60µs, 2.4ms | |
|
GigaDevice Semiconductor (HK) Limited GD25LQ32ENIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-UDFN Exposed Pad | GD25LQ32 | FLASH - NOR | 1.65V ~ 2V | 8-USON (4x3) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 3,000 | 133 MHz | Non-Volatile | 32Mbit | 7 ns | FLASH | 4M x 8 | SPI - Quad I/O, QPI | 60µs, 2.4ms | |
| GigaDevice Semiconductor (HK) Limited GD25Q16ENIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-UDFN Exposed Pad | GD25Q16 | FLASH - NOR | 2.7V ~ 3.6V | 8-USON (4x3) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.32.0071 | 3,000 | 133 MHz | Non-Volatile | 16Mbit | 7 ns | FLASH | 2M x 8 | SPI - Quad I/O | 70µs, 2ms | ||
| GigaDevice Semiconductor (HK) Limited GD25Q16ETIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | GD25Q16 | FLASH - NOR | 2.7V ~ 3.6V | 8-SOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.32.0071 | 3,000 | 133 MHz | Non-Volatile | 16Mbit | 7 ns | FLASH | 2M x 8 | SPI - Quad I/O | 70µs, 2ms | ||
|
GigaDevice Semiconductor (HK) Limited GD25Q64ESIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | GD25Q64 | FLASH - NOR | 2.7V ~ 3.6V | 8-SOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1970-GD25Q64ESIGRTR | 3A991B2A | 8542.32.0071 | 2,000 | 133 MHz | Non-Volatile | 64Mbit | 7 ns | FLASH | 8M x 8 | SPI - Quad I/O | 70µs, 2.4ms |
|
GigaDevice Semiconductor (HK) Limited GD25Q32ESIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | GD25Q32 | FLASH - NOR | 2.7V ~ 3.6V | 8-SOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 2,000 | 133 MHz | Non-Volatile | 32Mbit | 7 ns | FLASH | 4M x 8 | SPI - Quad I/O | 70µs, 2.4ms | |
|
GigaDevice Semiconductor (HK) Limited GD25LQ32ESIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | GD25LQ32 | FLASH - NOR | 1.65V ~ 2V | 8-SOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 2,000 | 133 MHz | Non-Volatile | 32Mbit | 7 ns | FLASH | 4M x 8 | SPI - Quad I/O, QPI | 60µs, 2.4ms | |
| GigaDevice Semiconductor (HK) Limited GD25Q16ESIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | GD25Q16 | FLASH - NOR | 2.7V ~ 3.6V | 8-SOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.32.0071 | 2,000 | 133 MHz | Non-Volatile | 16Mbit | 7 ns | FLASH | 2M x 8 | SPI - Quad I/O | 70µs, 2ms | ||
| Winbond Electronics W971GG6NB-25 TR | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | - | Tape & Reel (TR) | Active | 0°C ~ 85°C (TC) | Surface Mount | 84-TFBGA | W971GG6 | SDRAM - DDR2 | 1.7V ~ 1.9V | 84-TFBGA (8x12.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.32.0032 | 2,500 | 400 MHz | Volatile | 1Gbit | 400 ps | DRAM | 64M x 16 | SSTL_18 | 15ns | ||
| Winbond Electronics W971GG6NB25I | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | - | Tray | Active | -40°C ~ 95°C (TC) | Surface Mount | 84-TFBGA | W971GG6 | SDRAM - DDR2 | 1.7V ~ 1.9V | 84-TFBGA (8x12.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 256-W971GG6NB25I | EAR99 | 8542.32.0032 | 209 | 800 MHz | Volatile | 1Gbit | 400 ps | DRAM | 64M x 16 | SSTL_18 | 15ns | |
| Winbond Electronics W971GG6NB-18 TR | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | - | Tape & Reel (TR) | Active | 0°C ~ 85°C (TC) | Surface Mount | 84-TFBGA | W971GG6 | SDRAM - DDR2 | 1.7V ~ 1.9V | 84-TFBGA (8x12.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 256-W971GG6NB-18TR | EAR99 | 8542.32.0032 | 2,500 | 533 MHz | Volatile | 1Gbit | 350 ps | DRAM | 64M x 16 | SSTL_18 | 15ns | |
| Winbond Electronics W971GG6NB25I TR | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | - | Tape & Reel (TR) | Active | -40°C ~ 95°C (TC) | Surface Mount | 84-TFBGA | W971GG6 | SDRAM - DDR2 | 1.7V ~ 1.9V | 84-TFBGA (8x12.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 256-W971GG6NB25ITR | EAR99 | 8542.32.0032 | 2,500 | 800 MHz | Volatile | 1Gbit | 400 ps | DRAM | 64M x 16 | SSTL_18 | 15ns | |
| Micron Technology Inc. FC32GASAQHD-AAT TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 153-VFBGA | MTFC32G | FLASH - NAND | 2.7V ~ 3.6V | 153-VFBGA (11.5x13) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 557-MTFC32GASAQHD-AATTR | 2,000 | 200 MHz | Non-Volatile | 256Gbit | FLASH | 32G x 8 | eMMC | - | |||||
| Micron Technology Inc. FC32GASAQHD-AIT TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 153-VFBGA | MTFC32G | FLASH - NAND | 2.7V ~ 3.6V | 153-VFBGA (11.5x13) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 557-MTFC32GASAQHD-AITTR | 2,000 | 200 MHz | Non-Volatile | 256Gbit | FLASH | 32G x 8 | eMMC | - | |||||
| Micron Technology Inc. FC32GAZAQHD-AIT | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 153-VFBGA | MTFC32G | FLASH - NAND | 2.7V ~ 3.6V | 153-VFBGA (11.5x13) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,520 | 200 MHz | Non-Volatile | 256Gbit | FLASH | 32G x 8 | MMC | - | ||||||
| Micron Technology Inc. FC32GAZAQHD-AAT | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 153-VFBGA | MTFC32G | FLASH - NAND | 2.7V ~ 3.6V | 153-VFBGA (11.5x13) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,520 | 200 MHz | Non-Volatile | 256Gbit | FLASH | 32G x 8 | MMC | - | ||||||
| Micron Technology Inc. FC128GASAQJP-AIT | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 153-VFBGA | MTFC128 | FLASH - NAND | 2.7V ~ 3.6V | 153-VFBGA (11.5x13) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,520 | 200 MHz | Non-Volatile | 1Tbit | FLASH | 128G x 8 | eMMC | - | ||||||
|
Delkin Devices, Inc. EM08APGCJ-AC000-2 | Delkin Devices, Inc. |
Min: 1 Mult: 1 |
/image/Delkin Devices, Inc. | - | Tray | Obsolete | -40°C ~ 85°C | Surface Mount | 153-VFBGA | EM08APG | FLASH - NAND | 2.7V ~ 3.6V | 153-FBGA (11.5x13) | RoHS Compliant | 3 (168 Hours) | 3247-EM08APGCJ-AC000-2 | OBSOLETE | 1,520 | 200 MHz | Non-Volatile | 64Gbit | FLASH | 8G x 8 | eMMC | - | ||||
|
Delkin Devices, Inc. EM02APYD4-AC000-2 | Delkin Devices, Inc. |
Min: 1 Mult: 1 |
/image/Delkin Devices, Inc. | - | Tray | Obsolete | -40°C ~ 85°C | Surface Mount | 153-VFBGA | EM02APY | FLASH - NAND (pSLC) | 2.7V ~ 3.6V | 153-FBGA (11.5x13) | RoHS Compliant | 3 (168 Hours) | 3247-EM02APYD4-AC000-2 | OBSOLETE | 1,520 | 200 MHz | Non-Volatile | 16Gbit | FLASH | 2G x 8 | eMMC | - | ||||
|
Delkin Devices, Inc. EM08APGCG-BA000-2 | Delkin Devices, Inc. |
Min: 1 Mult: 1 |
/image/Delkin Devices, Inc. | - | Tray | Obsolete | -40°C ~ 85°C | Surface Mount | 153-VFBGA | EM08APG | FLASH - NAND | 2.7V ~ 3.6V | 153-FBGA (11.5x13) | RoHS Compliant | 3 (168 Hours) | 3247-EM08APGCG-BA000-2 | OBSOLETE | 1,520 | 200 MHz | Non-Volatile | 64Gbit | FLASH | 8G x 8 | eMMC | - | ||||
|
Delkin Devices, Inc. EM04APGCL-AC000-2 | Delkin Devices, Inc. |
Min: 1 Mult: 1 |
/image/Delkin Devices, Inc. | - | Tray | Obsolete | -40°C ~ 85°C | Surface Mount | 153-VFBGA | EM04APG | FLASH - NAND | 2.7V ~ 3.6V | 153-FBGA (11.5x13) | RoHS Compliant | 3 (168 Hours) | 3247-EM04APGCL-AC000-2 | OBSOLETE | 1,520 | 200 MHz | Non-Volatile | 32Gbit | FLASH | 4G x 8 | eMMC | - |
