Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. MKL36Z256VLL4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL3 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MKL36Z256 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,000 | 84 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, I²S, LCD, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 1.71V ~ 3.6V | A/D - 16bit; D/A - 12bit | Internal | ||
NXP USA Inc. S9S08RNA32W0MLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | S9S08 | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 26 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | |||
NXP USA Inc. MK11DX128AVMC5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK11DX128 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323519557 | 5A002A1 | 8542.31.0001 | 348 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 24x16b; D/A 1x12b | Internal | |
NXP USA Inc. MK11DX256AVLK5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK11DX256 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324828557 | 5A002A1 | 8542.31.0001 | 480 | 60 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 24x16b | Internal | |
NXP USA Inc. MK21DN512AVLK5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK21DN512 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.31.0001 | 96 | 60 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 20x16b | Internal | ||
NXP USA Inc. MK21DN512AVMC5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK21DN512 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.31.0001 | 348 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 20x16b; D/A 1x12b | Internal | ||
NXP USA Inc. MK21DX128AVLK5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK21DX128 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312075557 | 5A002A1 | 8542.31.0001 | 480 | 60 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 20x16b | Internal | |
NXP USA Inc. MKE02Z32VLD4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 44-LQFP | MKE02Z32 | 44-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311563557 | 3A991A2 | 8542.31.0001 | 160 | 37 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | ||
NXP USA Inc. MKE04Z128VLH4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE04 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MKE04Z128 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 58 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | ||
NXP USA Inc. MKE04Z128VQH4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE04 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-QFP | MKE04Z128 | 64-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324775557 | 3A991A2 | 8542.31.0001 | 84 | 58 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | |
NXP USA Inc. MKE04Z64VLK4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE04 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MKE04Z64 | 80-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 71 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | ||
NXP USA Inc. MKE06Z128VLH4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE06 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MKE06Z128 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311879557 | 3A991A2 | 8542.31.0001 | 160 | 58 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | CANbus, I²C, SPI, UART/USART | LVD, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | |
NXP USA Inc. MKE06Z128VLK4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE06 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MKE06Z128 | 80-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315176557 | 3A991A2 | 8542.31.0001 | 450 | 71 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | CANbus, I²C, SPI, UART/USART | LVD, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | |
NXP USA Inc. MKE06Z128VQH4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE06 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-QFP | MKE06Z128 | 64-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311249557 | 3A991A2 | 8542.31.0001 | 84 | 58 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | CANbus, I²C, SPI, UART/USART | LVD, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | |
NXP USA Inc. S912XEP100W1MAG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 300 | 119 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | 4K x 8 | 64K x 8 | 1.72V ~ 5.5V | A/D 24x12b | External | |||
NXP USA Inc. S912XEQ512BMAL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321822557 | 3A991A2 | 8542.31.0001 | 300 | 91 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.72V ~ 5.5V | A/D 16x12b | External | ||
NXP USA Inc. S912XEQ512J3CAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 85°C | Surface Mount | 80-QFP | S912 | 80-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314665557 | EAR99 | 8542.31.0001 | 420 | 59 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.72V ~ 5.5V | A/D 12x12b | External | ||
NXP USA Inc. S912XHY256F0MLM | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 300 | 88 | HCS12X | 16-Bit | 40MHz | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | LCD, Motor control PWM, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 8K x 8 | 12K x 8 | 4.5V ~ 5.5V | A/D 12x10b | External | |||
NXP USA Inc. S9S08AW60E7VPUE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | S9S08 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317721557 | 3A991A2 | 8542.31.0001 | 160 | 54 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | |
NXP USA Inc. S9S08DN60F2VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S9S08 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 39 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | 2K x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | ||
NXP USA Inc. S9S08DN60F2VLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | S9S08 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317668557 | 3A991A2 | 8542.31.0001 | 800 | 53 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | 2K x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | |
NXP USA Inc. S9S08DV128F2CLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | S9S08 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321723557 | 3A991A2 | 8542.31.0001 | 250 | 39 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 6K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | |
NXP USA Inc. S9S08DV60F2MLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | S9S08 | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320225557 | 3A991A2 | 8542.31.0001 | 1,250 | 25 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | - | 3K x 8 | 2.7V ~ 5.5V | A/D 10x12b | External | ||
NXP USA Inc. S9S12VR48AF0MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317776557 | 3A991A2 | 8542.31.0001 | 1,250 | 28 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | 512 x 8 | 2K x 8 | 3.13V ~ 5.5V | A/D 6x10b | Internal | |
NXP USA Inc. S9S12VR64AF0MLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | S9S12 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 16 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 2K x 8 | 3.13V ~ 5.5V | A/D 2x10b | Internal | ||
NXP USA Inc. S9S12XS128J1VAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-QFP | S9S12 | 80-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 420 | 59 | HCS12X | 16-Bit | 40MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 8K x 8 | 1.72V ~ 5.5V | A/D 8x12b | External | ||
NXP USA Inc. S9S12XS256J0MAL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 112-LQFP | S9S12 | 112-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318771557 | 3A991A2 | 8542.31.0001 | 300 | 91 | HCS12X | 16-Bit | 40MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 12K x 8 | 1.72V ~ 5.5V | A/D 16x12b | External | |
NXP USA Inc. SPC5676RDK3MVU1 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 416-BBGA | SPC5676 | 416-PBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314707557 | 3A991A2 | 8542.31.0001 | 200 | e200z7 | 32-Bit Dual-Core | 180MHz | CANbus, EBI/EMI, SCI, SPI | DMA, POR, PWM | 6MB (6M x 8) | FLASH | - | 384K x 8 | 1.14V ~ 1.32V | A/D 64x12b | Internal | ||
Microchip Technology ATSAM4S4BA-AN | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM4S | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | ATSAM4S | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 47 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | I²C, IrDA, Memory Card, SPI, SSC, UART/USART, USB | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 64K x 8 | 1.62V ~ 3.6V | A/D 11x12b; D/A 2x12b | Internal | ||
Microchip Technology ATSAM4S4CA-AU | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM4S | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | ATSAM4S | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 79 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | EBI/EMI, I²C, IrDA, Memory Card, SPI, SSC, UART/USART, USB | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 64K x 8 | 1.62V ~ 3.6V | A/D 16x12b; D/A 2x12b | Internal |
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