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AMD XCZU19EG-L1FFVC1760I
XCZU19EG-L1FFVC1760I
- Manufacturer: AMD
- Origchip NO: XCZU19EG-L1FFVC1760I
- Package: 1760-BBGA, FCBGA
- Datasheet:
PDF - Stock: 2140
- Description: XCZU19EG-L1FFVC1760I(Kg)
Quantity:
In Stock
Please send RFQ , we will respond immediately.
Purchase
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can track your order in real time.
For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.
RFQ (Request for Quotations)It is recommended to request for quotations to get the latest
prices and inventories about the part.
Our sales will reply to
your request by email within 24 hours.
1. You'll receive an order information email in your inbox.
(Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some
extent, the sales manager is going to reconfirm the order and let you know if there
are any updates.
Shipping Cost
Shipping starts at $40, but some countries will exceed $40. For
example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time
zone and country.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
Delivery TimeOnce the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.| Parameters | |
|---|---|
| Mfr | AMD |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Package | Tray |
| Product Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 1760-BBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
| Number of I/O | 512 |
| Base Product Number | XCZU19 |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| REACH Status | REACH Unaffected |
| ECCN | 5A002A4 XIL |
| HTSUS | 8542.39.0001 |
| Standard Package | 1 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells 500MHz, 600MHz, 1.2GHz 1760-FCBGA (42.5x42.5)
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