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Microcontrollers, Microprocessor, FPGA Modules(1446)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Trenz Electronic GmbH 0712-02-71I01-M | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-71I01-M | 3A991D | 8471.50.0150 | 1 | - | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
|
Trenz Electronic GmbH 0712-02-72C36-C | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0712 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-72C36-C | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
|
Trenz Electronic GmbH 0712-02-100-2C2 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-100-2C2 | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
| MYIR Tech Limited MYC-C3354-256N256D-80-I-GW | MYIR Tech Limited |
Min: 1 Mult: 1 |
/image/MYIR Tech Limited | AM335x | Box | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Vendor Undefined | Vendor Undefined | 3309-MYC-C3354-256N256D-80-I-GW | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A8, AM3354 | 600MHz, 800MHz, 1GHz | 256KB | 256KB EPROM | MPU | - | 80 Pin | ||
|
Trenz Electronic GmbH 0729-02-62I63FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Bulk | Discontinued at Digi-Key | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0729-02-62I63FA | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 512MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | ||
|
Trenz Electronic GmbH 0729-02-62I65FM | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Bulk | Discontinued at Digi-Key | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0729-02-62I65FM | 1 | ARM Cortex-A9 | - | 512MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | |||||
| AMD SM-K26-XCL2GC-ED | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ Kria™ | Box | Active | 0°C ~ 85°C (TJ) | 3.030" L x 2.360" W (77.00mm x 60.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 122-SM-K26-XCL2GC-ED | EAR99 | 8471.50.0150 | 1 | ARM® Cortex®-A53 | 533MHz, 1.333GHz | 4GB | 16GB eMMC, 64MB QSPI | FPGA Core | Arm® Cortex®-R5F | 2 x 240 Pin | |||
|
Trenz Electronic GmbH 0782-02-92I33FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0782 | Bulk | Discontinued at Digi-Key | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0782-02-92I33FA | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ||||
|
Trenz Electronic GmbH 0782-02-045-2IC | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0782 | Bulk | Obsolete | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0782-02-045-2IC | OBSOLETE | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ||||
|
Trenz Electronic GmbH 0745-02-71I31-AK | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.990" L x 2.130" W (76.00mm x 54.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-71I31-AK | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | Board-to-Board (BTB) Socket - 480 | ||||
|
Trenz Electronic GmbH 0745-02-81C31-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-81C31-A | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7035) | Board-to-Board (BTB) Socket - 160 | ||
|
Trenz Electronic GmbH 0745-02-92I11-AK | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-92I11-AK | OBSOLETE | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ||||
| Beacon EmbeddedWorks SOMIMX8MNS-10-29C0DMCR | Beacon EmbeddedWorks |
Min: 1 Mult: 1 |
/image/Beacon EmbeddedWorks | i.MX 8M Nano | Bulk | Active | 0°C ~ 70°C | 1.100" L x 1.500" W (28.00mm x 38.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 460-SOMIMX8MNS-10-29C0DMCR | 1 | ARM® Cortex®-A53, ARM® Cortex™-M7 | 1.5GHz, 750MHz | 1GB | 8GB | MPU Core | - | 3 x 100 Pins HD Connectors | ||||
| MYIR Tech Limited MYC-C7Z015-4E1D-766-I | MYIR Tech Limited |
Min: 1 Mult: 1 |
/image/MYIR Tech Limited | Zynq®-7000 | Box | Active | -40°C ~ 85°C | 2.950" L x 2.170" W (75.00mm x 55.00mm) | download | ROHS3 Compliant | 3309-MYC-C7Z015-4E1D-766-I | EAR99 | 8473.30.1180 | 1 | ARM® Cortex®-A9 | 766MHz | 1GB | 4GB | MPU, FPGA Core | Zynq-7000 (Z-7015) | Board-to-Board (BTB) Socket | ||||
| MYIR Tech Limited MYC-Y6ULY2-V2-256N256D-50-C | MYIR Tech Limited |
Min: 1 Mult: 1 |
/image/MYIR Tech Limited | - | Box | Active | 0°C ~ 70°C | 1.540" L x 1.460" W (39.00mm x 37.00mm) | download | ROHS3 Compliant | 3309-MYC-Y6ULY2-V2-256N256D-50-C | 1 | MCIMX6Y2DVM05A | 528MHz | 256MB | 256MB | MPU Core | - | Header | ||||||
| MYIR Tech Limited MYC-Y6ULG2-V2-256N256D-50-I | MYIR Tech Limited |
Min: 1 Mult: 1 |
/image/MYIR Tech Limited | - | Box | Active | -40°C ~ 85°C | 1.540" L x 1.460" W (39.00mm x 37.00mm) | download | ROHS3 Compliant | 3309-MYC-Y6ULG2-V2-256N256D-50-I | 5A992C SC | 8471.50.0150 | 1 | MCIMX6G2CVM05A | 528MHz | 256MB | 256MB | MPU Core | - | Header | ||||
| iWave Systems IW-G24M-CU2F-4E002G-S008G-LEI | iWave Systems |
Min: 1 Mult: 1 |
/image/iWave Systems | Arria® 10 | Bulk | Active | -40°C ~ 85°C | 3.740" L x 2.950" W (95.00mm x 75.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 2503-IW-G24M-CU2F-4E002G-S008G-LEI | 8473.30.1180 | 1 | ARM® Cortex®-A9, Arria 10 SX | 1.5GHz | 4GB | 8GB | MPU, FPGA Core | - | 2 x 240 Pin | ||||
| iWave Systems IW-G35M-11EG-4E004G-E008G-BIA | iWave Systems |
Min: 1 Mult: 1 |
/image/iWave Systems | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 4.330" L x 2.950" W (110.00mm x 75.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 2503-IW-G35M-11EG-4E004G-E008G-BIA | 8473.30.1180 | 1 | ARM® Cortex®-A53 (x4), ARM® Cortex™-M7(x1) | 1.5GHz, 600MHz | 4GB from PS, 4GB from PL | 8GB eMMC | MPU, FPGA | ARM® Mali 400 MP2 | 2 x 240 Pin, 2 x 240 Pin | ||||
| iWave Systems IW-G30M-C7EV-4E004G-E008G-BEA | iWave Systems |
Min: 1 Mult: 1 |
/image/iWave Systems | - | Bulk | Active | -20°C ~ 85°C | 3.740" x 2.950" (94.99mm x 74.93mm) | download | ROHS3 Compliant | 1 (Unlimited) | 2503-IW-G30M-C7EV-4E004G-E008G-BEA | 8473.30.1180 | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5, ARM Mali 400 MP2, ZU7EV | 1.5GHz | |||||||||
| iWave Systems IW-G35M-19EG-4E004G-E008G-BIA | iWave Systems |
Min: 1 Mult: 1 |
/image/iWave Systems | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 4.330" L x 2.950" W (110.00mm x 75.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 2503-IW-G35M-19EG-4E004G-E008G-BIA | 3A001A3 | 8473.30.9900 | 1 | ARM® Cortex®-A53(x4), ARM® Cortex™-M7(x1) | 1.5GHz, 600MHz | 4GB from PS, 4GB from PL | 8GB eMMC | MPU, FPGA | ARM® Mali 400 MP2 | 2 x 240 Pin, 2 x 240 Pin | |||
|
Critical Link LLC L138-DG-325-RI-1 | Critical Link LLC |
Min: 1 Mult: 1 |
/image/Critical Link LLC | MityDSP-L138F | Bulk | Active | -40°C ~ 85°C | 2.660" L x 2.000" W (67.60mm x 50.80mm) | L138-DG | download | 1057-L138-DG-325-RI-1 | 1 | ARM926EJ-S, OMAP-L138 | 375MHz | 8kB (Internal), 128MB (External) | 256MB (NAND), 16MB (NOR) | MPU, DSP, FPGA Core | TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA) | SO-DIMM-200 | |||||
|
Critical Link LLC L138-DG-325-RI-CR | Critical Link LLC |
Min: 1 Mult: 1 |
/image/Critical Link LLC | MityDSP-L138F | Bulk | Active | -40°C ~ 85°C | 2.660" L x 2.000" W (67.60mm x 50.80mm) | L138-DG | 1057-L138-DG-325-RI-CR | 1 | ARM926EJ-S, OMAP-L138 | 375MHz | 8kB (Internal), 128MB (External) | 256MB (NAND), 16MB (NOR) | MPU, DSP, FPGA Core | TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA) | SO-DIMM-200 | ||||||
|
Critical Link LLC L138-DG-225-RI-CR | Critical Link LLC |
Min: 1 Mult: 1 |
/image/Critical Link LLC | MityDSP-L138F | Bulk | Obsolete | -40°C ~ 85°C | 2.660" L x 2.000" W (67.60mm x 50.80mm) | 1057-L138-DG-225-RI-CR | OBSOLETE | 1 | ARM926EJ-S, OMAP-L138 | 375MHz | 8kB (Internal), 128MB (External) | 256MB (NAND), 8MB (NOR) | MPU, DSP, FPGA Core | TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA) | SO-DIMM-200 | ||||||
| iWave Systems IW-G30M-C4EV-4E002G-E008G-BIA | iWave Systems |
Min: 1 Mult: 1 |
/image/iWave Systems | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 4.330" L x 2.950" W (110.00mm x 75.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 2503-IW-G30M-C4EV-4E002G-E008G-BIA | 8473.30.1180 | 1 | ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2) | 1.5GHz, 600MHz | 4GB, 1GB | 8GB eMMC | MPU, FPGA | ARM® Mali 400 MP2 | 2 x 240 Pin | ||||
| GHI Electronics, LLC SCM-20260N-C | GHI Electronics, LLC |
Min: 1 Mult: 1 |
/image/GHI Electronics, LLC | - | Box | Active | -40°C ~ 85°C | - | SCM-20260 | download | ROHS3 Compliant | REACH Unaffected | 1711-SCM-20260N-C | 3A991A2 | 8473.30.1180 | 1 | SITCore | 480MHz | 32MB | 16MB | MPU Core | - | - | ||
| GHI Electronics, LLC SCM-20260D-C | GHI Electronics, LLC |
Min: 1 Mult: 1 |
/image/GHI Electronics, LLC | - | Box | Active | -40°C ~ 85°C | - | SCM-20260 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 1711-SCM-20260D-C | 3A991A2 | 8473.30.1180 | 1 | SITCore | 480MHz | 32MB | 16MB | MPU Core | - | - | |
|
Intel DG8065101274708 | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Bulk | Active | Not applicable | 3 (168 Hours) | Vendor Undefined | 0000.00.0000 | 1 | |||||||||||||
|
Motorola KXC705JJ7CS | Motorola |
Min: 1 Mult: 1 |
/image/Motorola | * | Bulk | Active | Not applicable | 3 (168 Hours) | Vendor Undefined | 1 | ||||||||||||||
| Octavo Systems LLC D32MP153C-512M-BAA | Octavo Systems LLC |
Min: 1 Mult: 1 |
/image/Octavo Systems LLC | - | Tray | Active | 0°C ~ 85°C | 0.710" L x 0.710" W (18.00mm x 18.00mm) | download | 4 (72 Hours) | 1676-OSD32MP153C-512M-BAA | 5A992C 23 | 8542.31.0001 | 65 | Arm® Dual Cortex®-A7, Arm® Cortex®-M4 | 650MHz | 512MB | - | MPU Core | NEON™ SIMD | 302-BGA | ||||
| Octavo Systems LLC D32MP153A-512M-BAA | Octavo Systems LLC |
Min: 1 Mult: 1 |
/image/Octavo Systems LLC | - | Tray | Active | 0°C ~ 85°C | 0.710" L x 0.710" W (18.00mm x 18.00mm) | download | 1676-OSD32MP153A-512M-BAA | 65 | Arm® Dual Cortex®-A7, Arm® Cortex®-M4 | 650MHz | 512MB | - | MPU Core | NEON™ SIMD | 302-BGA |
