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System On Chip (SoC)(4272)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Microchip Technology M2S150T-FCG1152I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | M2S150 | 1152-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 3A001A7A | 8542.39.0001 | 24 | MCU, FPGA | 574 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||
| Microchip Technology M2S150T-FCV484 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 484-BFBGA | M2S150 | 484-FBGA (19x19) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 84 | MCU, FPGA | 273 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||
| Microchip Technology M2S150T-FCVG484I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 484-BFBGA | M2S150 | 484-FBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 84 | MCU, FPGA | 273 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||
| Microchip Technology M2S150TS-1FCS536 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 536-LFBGA, CSPBGA | M2S150 | 536-CSPBGA (16x16) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 293 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||
| Microchip Technology M2S150TS-1FCSG536 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 536-LFBGA, CSPBGA | M2S150 | 536-CSPBGA (16x16) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 293 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||
| Microchip Technology M2S150TS-FC1152I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | M2S150 | 1152-FCBGA (35x35) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 24 | MCU, FPGA | 574 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||
| Microchip Technology M2S150TS-FCG1152 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 1152-BBGA, FCBGA | M2S150 | 1152-FCBGA (35x35) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A001A7A | 8542.39.0001 | 24 | MCU, FPGA | 574 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||
| Microchip Technology M2S150TS-FCS536I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 536-LFBGA, CSPBGA | M2S150 | 536-CSPBGA (16x16) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 293 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||
| Microchip Technology M2S150TS-FCSG536 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 536-LFBGA, CSPBGA | M2S150 | 536-CSPBGA (16x16) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 293 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||
| Microchip Technology M2S150TS-FCV484 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 484-BFBGA | M2S150 | 484-FBGA (19x19) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 84 | MCU, FPGA | 273 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||
| AMD XAZU2EG-1SFVC784Q | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 125°C (TJ) | 784-BFBGA, FCBGA | XAZU2 | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | 5A002A4 XIL | 8542.39.0001 | 1 | MPU, FPGA | 128 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 1.2GHz | CANbus, I²C, SPI, UART/USART, USB | DMA, WDT | 1.2MB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | |||
| AMD XAZU3EG-1SFVC784I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 784-BFBGA, FCBGA | XAZU3 | 784-FCBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | 122-2067 | 5A002A4 XIL | 8542.39.0001 | 1 | MPU, FPGA | 128 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 1.2GHz | CANbus, I²C, SPI, UART/USART, USB | DMA, WDT | 1.8MB | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ||
 |
Broadcom Limited BCM58101LB0KFBG | Broadcom Limited |
Min: 1 Mult: 1 |
/image/Broadcom Limited | * | Bulk | Active | BCM58101 | ROHS3 Compliant | REACH Unaffected | 0000.00.0000 | 1 | ||||||||||||||||
| Intel 5CSEBA4U19I7LN | Intel |
Min: 1 Mult: 1 |
/image/Intel | Cyclone® V SE | Tray | Active | -40°C ~ 100°C (TJ) | 484-FBGA | 484-UBGA (19x19) | download | REACH Unaffected | 0000.00.0000 | 84 | MCU, FPGA | MCU - 151, FPGA - 66 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 925MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 40K Logic Elements | ||||||
| Intel 5CSEBA4U23I7LN | Intel |
Min: 1 Mult: 1 |
/image/Intel | Cyclone® V SE | Tray | Active | -40°C ~ 100°C (TJ) | 672-FBGA | 672-UBGA (23x23) | download | REACH Unaffected | 0000.00.0000 | 60 | MCU, FPGA | MCU - 181, FPGA - 145 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 925MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 40K Logic Elements | ||||||
| Intel 5CSEBA6U19I7LN | Intel |
Min: 1 Mult: 1 |
/image/Intel | Cyclone® V SE | Tray | Active | -40°C ~ 100°C (TJ) | 484-FBGA | 484-UBGA (19x19) | download | REACH Unaffected | 0000.00.0000 | 84 | MCU, FPGA | MCU - 151, FPGA - 66 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 925MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 110K Logic Elements | ||||||
| Intel 5CSEBA6U19I7NTS | Intel |
Min: 1 Mult: 1 |
/image/Intel | Cyclone® V SE | Tray | Active | -40°C ~ 100°C (TJ) | 484-FBGA | 484-UBGA (19x19) | download | 3 (168 Hours) | REACH Unaffected | 966127 | 3A991D | 8542.39.0001 | 84 | MCU, FPGA | MCU - 151, FPGA - 66 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 925MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 110K Logic Elements | |||
| Intel 5CSEBA6U23I7LN | Intel |
Min: 1 Mult: 1 |
/image/Intel | Cyclone® V SE | Tray | Active | -40°C ~ 100°C (TJ) | 672-FBGA | 672-UBGA (23x23) | download | REACH Unaffected | 0000.00.0000 | 60 | MCU, FPGA | MCU - 181, FPGA - 145 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 925MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 110K Logic Elements | ||||||
| Intel 5CSXFC4C6U23I7LN | Intel |
Min: 1 Mult: 1 |
/image/Intel | Cyclone® V SX | Tray | Active | -40°C ~ 100°C (TJ) | 672-FBGA | 672-UBGA (23x23) | download | REACH Unaffected | 978998 | 0000.00.0000 | 60 | MCU, FPGA | MCU - 181, FPGA - 145 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 925MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 40K Logic Elements | |||||
| Intel 5CSEBA2U19I7LN | Intel |
Min: 1 Mult: 1 |
/image/Intel | Cyclone® V SE | Tray | Active | -40°C ~ 100°C (TJ) | 484-FBGA | 484-UBGA (19x19) | 3 (168 Hours) | REACH Unaffected | 544-3473 | 0000.00.0000 | 84 | MCU, FPGA | MCU - 151, FPGA - 66 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 925MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 25K Logic Elements | |||||
| Microchip Technology M2S005S-1TQG144T2 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 144-LQFP | M2S005 | 144-TQFP (20x20) | download | REACH Unaffected | 0000.00.0000 | 60 | MCU, FPGA | 213 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | 64KB | 128KB | FPGA - 5K Logic Modules | |||||
|
onsemi 0W635-006-XTP | onsemi |
Min: 1 Mult: 1 |
/image/onsemi | - | Tape & Reel (TR) | Not For New Designs | - | - | 0W635 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 0000.00.0000 | 250 | - | - | - | - | - | - | - | - | |||||
|
Broadcom Limited BCM3383DUIFEBG | Broadcom Limited |
Min: 1 Mult: 1 |
/image/Broadcom Limited | - | Tray | Obsolete | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | OBSOLETE | 1 | ||||||||||||||||
|
Broadcom Limited BCM3383DUKFEBG | Broadcom Limited |
Min: 1 Mult: 1 |
/image/Broadcom Limited | - | Tray | Obsolete | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | OBSOLETE | 1 | ||||||||||||||||
| AMD XC7Z014S-1CLG484C | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq®-7000 | Tray | Active | 0°C ~ 85°C (TJ) | 484-LFBGA, CSPBGA | XC7Z014 | 484-CSPBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 122-2027 | 3A991D | 8542.39.0001 | 84 | MCU, FPGA | 200 | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 667MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 256KB | - | Artix™-7 FPGA, 65K Logic Cells | |
| AMD XC7Z014S-2CLG484E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq®-7000 | Tray | Active | 0°C ~ 100°C (TJ) | 484-LFBGA, CSPBGA | XC7Z014 | 484-CSPBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 122-2029 | 3A991D | 8542.39.0001 | 84 | MCU, FPGA | 200 | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 766MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 256KB | - | Artix™-7 FPGA, 65K Logic Cells | |
| AMD XCZU9CG-2FFVB1156I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | XCZU9 | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 328 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||
| AMD XCZU9CG-2FFVC900E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | 0°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU9 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 204 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||
| AMD XCZU9EG-1FFVC900I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU9 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 204 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||
| AMD XCZU9EG-2FFVB1156I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | XCZU9 | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 328 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
