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Embedded(154023)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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NXP USA Inc. LPC5526JBD100E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Active | ROHS3 Compliant | 568-LPC5526JBD100E | 90 | |||||||||||||||||||||||||||||||||
|
NXP USA Inc. MIMX8QX2FVOFZAC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Active | ROHS3 Compliant | 568-MIMX8QX2FVOFZAC | 90 | |||||||||||||||||||||||||||||||||
|
NXP USA Inc. FH32K148UAT0VLQT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Active | ROHS3 Compliant | 568-FH32K148UAT0VLQT | 300 | |||||||||||||||||||||||||||||||||
|
NXP USA Inc. LPC55S16JBD64K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Active | ROHS3 Compliant | 568-LPC55S16JBD64K | 800 | |||||||||||||||||||||||||||||||||
|
NXP USA Inc. S9S12VR48AACLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Active | ROHS3 Compliant | 568-S9S12VR48AACLF | 1,250 | |||||||||||||||||||||||||||||||||
|
NXP USA Inc. FH32K144HRT0VLLR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tape & Reel (TR) | Active | ROHS3 Compliant | 568-FH32K144HRT0VLLRTR | 1,000 | |||||||||||||||||||||||||||||||||
|
NXP USA Inc. MC56F81746MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Active | ROHS3 Compliant | 568-MC56F81746MLF | 250 | |||||||||||||||||||||||||||||||||
|
NXP USA Inc. FS32K148UAT0VMHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tape & Reel (TR) | Active | ROHS3 Compliant | 568-FS32K148UAT0VMHRTR | 1,500 | |||||||||||||||||||||||||||||||||
|
NXP USA Inc. FD32K116BRT0VFMR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tape & Reel (TR) | Active | ROHS3 Compliant | 568-FD32K116BRT0VFMRTR | 2,500 | |||||||||||||||||||||||||||||||||
|
NXP USA Inc. S912ZVL64ACLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Active | ROHS3 Compliant | 568-S912ZVL64ACLF | 1,250 | |||||||||||||||||||||||||||||||||
|
NXP USA Inc. S9S12G48J1MLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Active | ROHS3 Compliant | 568-S9S12G48J1MLC | 1,250 | |||||||||||||||||||||||||||||||||
| Renesas Electronics America Inc R5F56609BGFM#10 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RX600 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | R5F56609 | 64-LFQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,280 | 55 | RXv3 | 32-Bit | 120MHz | CANbus, EBI/EMI, I²C, LINbus, SCI, SPI | DMA, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | 32K x 8 | 128K x 8 | 2.7V ~ 5.5V | A/D 14x12b; D/A 2x12b | External, Internal | ||||||||||||||
|
NXP USA Inc. LPC845M301JHI33K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC84x | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | LPC845 | 32-HVQFN (5x5) | download | REACH Unaffected | 568-LPC845M301JHI33K | 1 | 29 | ARM® Cortex®-M0+ | 32-Bit | 30MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 16K x 8 | 1.8V ~ 3.6V | A/D 12x12b SAR; D/A 1x10b | External, Internal | ||||||||||||||
|
NXP USA Inc. LPC3220FET296/01K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC3200 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 296-TFBGA | LPC3220 | 296-TFBGA (15x15) | download | REACH Unaffected | 568-LPC3220FET296/01K | 1 | 51 | ARM926EJ-S | 16/32-Bit | 266MHz | EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG | DMA, I²S, LCD, Motor Control PWM, PWM, WDT | - | ROMless | - | 128K x 8 | 0.9V ~ 3.6V | A/D 3x10b SAR | Internal | ||||||||||||||
|
NXP USA Inc. LPC1830FET256K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC18xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 256-LBGA | LPC1830 | 256-LBGA (17x17) | download | REACH Unaffected | 568-LPC1830FET256K | 1 | 164 | ARM® Cortex®-M3 | 32-Bit | 180MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT | - | ROMless | - | 200K x 8 | 2.2V ~ 3.6V | A/D 8x10b SAR; D/A 1x10b | Internal | ||||||||||||||
|
Renesas Electronics America Inc R9A07G075M28GBA#AC0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RZ/T2M | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 225-LFBGA | R9A07 | 225-FBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 800-R9A07G075M28GBA#AC0 | 119 | ARM® Cortex®-R52 | 600MHz, 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | - | No | - | 10/100/1000Mbps (2) | - | USB 2.0 (1) | 1.8V, 3.3V | Boot Security, Crypto Accelerator, JTAG, TRNG | CANbus, I²C, SCI, SPI, WDT | ||||||||||||
|
Renesas Electronics America Inc R9A07G075M28GBG#AC0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RZ/T2M | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 320-LFBGA | R9A07 | 320-FBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 800-R9A07G075M28GBG#AC0 | 90 | ARM® Cortex®-R52 | 600MHz, 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | - | No | - | 10/100/1000Mbps (2) | - | USB 2.0 (1) | 1.8V, 3.3V | Boot Security, Crypto Accelerator, JTAG, TRNG | CANbus, I²C, SCI, SPI, WDT | ||||||||||||
|
Renesas Electronics America Inc R9A07G075M01GFP#AA0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RZ/T2M | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 176-LQFP Exposed Pad | R9A07 | 176-LFQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 800-R9A07G075M01GFP#AA0 | 40 | ARM® Cortex®-R52 | 600MHz, 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | - | No | - | 10/100/1000Mbps (2) | - | USB 2.0 (1) | 1.8V, 3.3V | - | CANbus, I²C, SCI, SPI, WDT | ||||||||||||
|
Renesas Electronics America Inc R9A07G075M26GBG#AC0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RZ/T2M | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 320-LFBGA | R9A07 | 320-FBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 800-R9A07G075M26GBG#AC0 | 90 | ARM® Cortex®-R52 | 600MHz, 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | - | No | - | 10/100/1000Mbps (2) | - | USB 2.0 (1) | 1.8V, 3.3V | Boot Security, Crypto Accelerator, JTAG, TRNG | CANbus, I²C, SCI, SPI, WDT | ||||||||||||
|
Microchip Technology DSPIC33EP256MC202T-H/SO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, dsPIC™ 33EP | Bulk | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC | 150-DSPIC33EP256MC202T-H/SO | OBSOLETE | 1 | 21 | dsPIC | 16-Bit | 40 MIPs | I²C, IrDA, LINbus, QEI, SPI, UART/USART | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT | 256KB (85.5K x 24) | FLASH | - | 32K x 8 | 3V ~ 3.6V | A/D 6x10/12b SAR | External, Internal | ||||||||||||||||
|
Microchip Technology PIC24EP256GP202T-H/SO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, PIC® 24EP | Bulk | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC | 150-PIC24EP256GP202T-H/SO | OBSOLETE | 1 | 21 | PIC | 16-Bit | 40 MIPs | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, WDT | 256KB (85.5K x 24) | FLASH | - | 32K x 8 | 3V ~ 3.6V | A/D 6x10/12b SAR | External, Internal | ||||||||||||||||
|
Microchip Technology DSPIC33EP256MC502T-H/SO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, dsPIC™ 33EP | Bulk | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC | 150-DSPIC33EP256MC502T-H/SO | OBSOLETE | 1 | 21 | dsPIC | 16-Bit | 40 MIPs | CANbus, I²C, IrDA, LINbus, QEI, SPI, UART/USART | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT | 256KB (85.5K x 24) | FLASH | - | 32K x 8 | 3V ~ 3.6V | A/D 6x10/12b SAR | External, Internal | ||||||||||||||||
|
Microchip Technology PIC24EP256GP202T-H/MM | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, PIC® 24EP | Bulk | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 28-VQFN Exposed Pad | 28-QFN-S (6x6) | 150-PIC24EP256GP202T-H/MM | OBSOLETE | 1 | 21 | PIC | 16-Bit | 40 MIPs | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, WDT | 256KB (85.5K x 24) | FLASH | - | 32K x 8 | 3V ~ 3.6V | A/D 6x10/12b SAR | External, Internal | ||||||||||||||||
|
Microchip Technology DSPIC33EP256MC502T-H/SS | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, dsPIC™ 33EP | Bulk | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP | 150-DSPIC33EP256MC502T-H/SS | OBSOLETE | 1 | 21 | dsPIC | 16-Bit | 40 MIPs | CANbus, I²C, IrDA, LINbus, QEI, SPI, UART/USART | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT | 256KB (85.5K x 24) | FLASH | - | 32K x 8 | 3V ~ 3.6V | A/D 6x10/12b SAR | External, Internal | ||||||||||||||||
|
Microchip Technology DSPIC33EP256GP502T-H/SS | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, dsPIC™ 33EP | Bulk | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP | 150-DSPIC33EP256GP502T-H/SS | OBSOLETE | 1 | 21 | dsPIC | 16-Bit | 40 MIPs | CANbus, I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, WDT | 256KB (85.5K x 24) | FLASH | - | 32K x 8 | 3V ~ 3.6V | A/D 6x10/12b SAR | External, Internal | ||||||||||||||||
|
Epson Electronics America Inc-Semiconductor Div S1C17M25F001100 | Epson Electronics America Inc-Semiconductor Div |
Min: 1 Mult: 1 |
/image/Epson Electronics America Inc-Semiconductor Div | - | Tray | Active | -40°C ~ 85°C | Surface Mount | 48-TQFP | 48-TQFP12 (7x7) | download | 502-S1C17M25F001100 | 250 | 39 | S1C17 | 16-Bit | 21MHz | I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 5.5V | A/D 8x12b SAR | External, Internal | ||||||||||||||||
|
Epson Electronics America Inc-Semiconductor Div S1C31D01D101000 | Epson Electronics America Inc-Semiconductor Div |
Min: 1 Mult: 1 |
/image/Epson Electronics America Inc-Semiconductor Div | - | Tray | Active | -40°C ~ 85°C | Surface Mount | Die | Chip | download | 502-S1C31D01D101000 | 1,320 | 57 | ARM® Cortex®-M0+ | 32-Bit | 21MHz | I²C, IrDA, QSPI, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, Voltage Detect, WDT | 256KB (256K x 8) | FLASH | - | 96K x 8 | 1.8V ~ 5.5V | A/D 8x12b SAR | External, Internal | ||||||||||||||||
|
Epson Electronics America Inc-Semiconductor Div S1C17M32F001100-160 | Epson Electronics America Inc-Semiconductor Div |
Min: 1 Mult: 1 |
/image/Epson Electronics America Inc-Semiconductor Div | - | Tray | Active | -40°C ~ 85°C | Surface Mount | 64-TQFP | 64-TQFP13 (10x10) | download | 502-S1C17M32F001100-160 | 160 | 53 | S1C17 | 16-Bit | 17.12MHz | I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT | 64KB (64K x 8) | FLASH | - | 4K x 8 | 1.8V ~ 5.5V | A/D 3x12b SAR | External, Internal | ||||||||||||||||
|
Epson Electronics America Inc-Semiconductor Div S1C17M33F001100 | Epson Electronics America Inc-Semiconductor Div |
Min: 1 Mult: 1 |
/image/Epson Electronics America Inc-Semiconductor Div | - | Tray | Active | -40°C ~ 85°C | Surface Mount | 80-TQFP | 80-TQFP14 (12x12) | download | 502-S1C17M33F001100 | 119 | 65 | S1C17 | 16-Bit | 17.12MHz | I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT | 96KB (96K x 8) | FLASH | - | 4K x 8 | 1.8V ~ 5.5V | A/D 6x12b SAR | External, Internal | ||||||||||||||||
|
Epson Electronics America Inc-Semiconductor Div S1C31D01B10210B | Epson Electronics America Inc-Semiconductor Div |
Min: 1 Mult: 1 |
/image/Epson Electronics America Inc-Semiconductor Div | - | Tray | Active | -40°C ~ 85°C | Surface Mount | 96-WFBGA, WLCSP | 96-WLCSP (4.45x4.45) | download | 502-S1C31D01B10210B | 3,000 | 57 | ARM® Cortex®-M0+ | 32-Bit | 21MHz | I²C, IrDA, QSPI, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, Voltage Detect, WDT | 256KB (256K x 8) | FLASH | - | 96K x 8 | 1.8V ~ 5.5V | A/D 8x12b SAR | External, Internal |
