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Embedded(154023)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Total RAM Bits | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
NXP USA Inc. SAF4000EL/101Z23CY | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tape & Reel (TR) | Active | ROHS3 Compliant | 568-SAF4000EL/101Z23CYTR | 1,000 | ||||||||||||||||||||||||||||||
|
NXP USA Inc. LPC5536JHI48/00MP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tape & Reel (TR) | Active | ROHS3 Compliant | 568-LPC5536JHI48/00MPTR | 4,000 | ||||||||||||||||||||||||||||||
|
NXP USA Inc. LPC55S69JBD64E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Active | ROHS3 Compliant | 568-LPC55S69JBD64E | 160 | ||||||||||||||||||||||||||||||
|
NXP USA Inc. S9S12GN32J1VTJR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tape & Reel (TR) | Active | ROHS3 Compliant | 568-S9S12GN32J1VTJRTR | 5,000 | ||||||||||||||||||||||||||||||
|
NXP USA Inc. S912ZVCA19A1WLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Active | ROHS3 Compliant | 568-S912ZVCA19A1WLF | 1,250 | ||||||||||||||||||||||||||||||
|
NXP USA Inc. SAF7770EL/101Z130Y | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tape & Reel (TR) | Active | ROHS3 Compliant | 568-SAF7770EL/101Z130YTR | 1,000 | ||||||||||||||||||||||||||||||
|
NXP USA Inc. SPC5668EF1AMMG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Active | ROHS3 Compliant | 568-SPC5668EF1AMMG | 450 | ||||||||||||||||||||||||||||||
|
NXP USA Inc. FH32K116LFT0MFMT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Active | ROHS3 Compliant | 568-FH32K116LFT0MFMT | 2,450 | ||||||||||||||||||||||||||||||
|
NXP USA Inc. S912ZVMA1F0WLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Active | ROHS3 Compliant | 568-S912ZVMA1F0WLF | 1,250 | ||||||||||||||||||||||||||||||
|
NXP USA Inc. MIMX8UX5FVOFZAC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Active | ROHS3 Compliant | 568-MIMX8UX5FVOFZAC | 90 | ||||||||||||||||||||||||||||||
|
NXP USA Inc. S9S12G96J0MLL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Active | ROHS3 Compliant | 568-S9S12G96J0MLL | 450 | ||||||||||||||||||||||||||||||
|
NXP USA Inc. SAF4000EL/102Z223K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Active | ROHS3 Compliant | 568-SAF4000EL/102Z223K | 630 | ||||||||||||||||||||||||||||||
|
Zilog Z86C0812SEG | Zilog |
Min: 1 Mult: 1 |
/image/Zilog | Z8® | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC | ROHS3 Compliant | REACH Unaffected | 269-Z86C0812SEG | 1 | 14 | Z8 | 8-Bit | 12MHz | - | POR, WDT | 2KB (2K x 8) | ROM | - | 125 x 8 | 3V ~ 5.5V | - | External, Internal | ||||||||||||
|
Zilog Z86L1608SSG | Zilog |
Min: 1 Mult: 1 |
/image/Zilog | Z8® | Bulk | Active | 0°C ~ 70°C (TA) | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC | download | ROHS3 Compliant | REACH Unaffected | 269-Z86L1608SSG | 1 | 14 | Z8 | 8-Bit | - | - | POR, WDT | 1KB (1K x 8) | ROM | - | 124 x 8 | 2V ~ 3.6V | - | External, Internal | |||||||||||
|
Zilog Z86C0404PEG | Zilog |
Min: 1 Mult: 1 |
/image/Zilog | Z8® | Bulk | Active | -40°C ~ 105°C (TA) | Through Hole | 18-DIP (0.300", 7.62mm) | 18-DIP | ROHS3 Compliant | REACH Unaffected | 269-Z86C0404PEG | 1 | 14 | Z8 | 8-Bit | 12MHz | - | POR, WDT | 1KB (1K x 8) | ROM | - | 125 x 8 | 3V ~ 5.5V | - | External, Internal | ||||||||||||
|
Zilog Z86C6516PSG | Zilog |
Min: 1 Mult: 1 |
/image/Zilog | Z8® | Bulk | Active | 0°C ~ 70°C (TA) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP | download | ROHS3 Compliant | REACH Unaffected | 269-Z86C6516PSG | 1 | 22 | Z8 | 8-Bit | 16MHz | - | - | 32KB (32K x 8) | ROM | - | 256 x 8 | 3V ~ 5.5V | - | External, Internal | |||||||||||
| AMD XCVE1752-1LLINSVG1369 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ AI Core | Tray | Active | -40°C ~ 100°C (TJ) | 1369-BFBGA | 1369-BGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVE1752-1LLINSVG1369 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ AI Core FPGA, 1M Logic Cells | |||||||||||||||
| AMD XCVM1302-1MSEVSVD1760 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | 0°C ~ 100°C (TJ) | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1302-1MSEVSVD1760 | 1 | MPU, FPGA | 402 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 70k Logic Cells | |||||||||||||||||
| AMD XCVM1302-1LSINBVB1024 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1024-BFBGA | 1024-BGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1302-1LSINBVB1024 | 1 | MPU, FPGA | 316 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 70k Logic Cells | |||||||||||||||||
| AMD XCVM1402-2HSINBVB1024 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1024-BFBGA | 1024-BGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1402-2HSINBVB1024 | 1 | MPU, FPGA | 424 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 800MHz, 1.65GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 1.2M Logic Cells | |||||||||||||||||
| AMD XCVM1302-2MSINBVB1024 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1024-BFBGA | 1024-BGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1302-2MSINBVB1024 | 1 | MPU, FPGA | 316 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 70k Logic Cells | |||||||||||||||||
| AMD XCVM1302-1MSENBVB1024 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | 0°C ~ 100°C (TJ) | 1024-BFBGA | 1024-BGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1302-1MSENBVB1024 | 1 | MPU, FPGA | 316 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 70k Logic Cells | |||||||||||||||||
| AMD XCZU57DR-1FFVE1156I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ RFSoC DR | Tray | Active | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU57DR-1FFVE1156I | 1 | MPU, FPGA | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe, WDT | - | - | Zynq® UltraScale+™ RFSoC | |||||||||||||||||
| AMD XCVC1702-2LSEVSVA2197 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ AI Core | Tray | Active | 0°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1702-2LSEVSVA2197 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 608 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ AI Core FPGA, 1M Logic Cells | |||||||||||||||
| AMD XCVM1402-2MSENSVF1369 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | 0°C ~ 100°C (TJ) | 1369-BFBGA | 1369-BGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1402-2MSENSVF1369 | 1 | MPU, FPGA | 424 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 1.2M Logic Cells | |||||||||||||||||
| AMD XCAU10P-2UBVA368E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Artix® UltraScale+ | Tray | Active | 0°C ~ 100°C (TJ) | Surface Mount | 368-WFBGA, FCBGA | Not Verified | 0.825V ~ 0.876V | 368-FCBGA (10.5x10.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCAU10P-2UBVA368E | EAR99 | 8542.39.0001 | 1 | 3670016 | 128 | 5500 | 96250 | |||||||||||||||||
| AMD XCAU10P-1SBVB484I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Artix® UltraScale+ | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 484-BFBGA, FCBGA | Not Verified | 0.698V ~ 0.742V | 484-FCBGA (19x19) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCAU10P-1SBVB484I | 3A991D | 8542.39.0001 | 1 | 3670016 | 204 | 5500 | 96250 | |||||||||||||||||
| AMD XCVM1302-1MSINSVF1369 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1369-BFBGA | 1369-BGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1302-1MSINSVF1369 | 1 | MPU, FPGA | 316 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 70k Logic Cells | |||||||||||||||||
| AMD XCVM1302-2HSINBVB1024 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1024-BFBGA | 1024-BGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1302-2HSINBVB1024 | 1 | MPU, FPGA | 424 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Prime FPGA, 70k Logic Cells | |||||||||||||||||
| AMD XCVC1502-1LSIVSVA2197 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ AI Core | Tray | Active | -40°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1502-1LSIVSVA2197 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 586 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 80k Logic Cells |
