Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Flash Size | Module/Board Type | Co-Processor | Connector Type |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. S912ZVHY64F1VLQ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317768557 | 3A991A2 | 8542.31.0001 | 300 | 100 | S12Z | 16-Bit | 32MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, LCD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 2K x 8 | 4K x 8 | 4.5V ~ 5.5V | A/D 8x10b | Internal | ||||||
NXP USA Inc. S912ZVMC12F1WKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316283557 | 3A991A2 | 8542.31.0001 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, SCI, SPI | DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 8K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | |||||
NXP USA Inc. S9S08DZ48F2MLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP | S9S08 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311132557 | 3A991A2 | 8542.31.0001 | 800 | 53 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | 1.5K x 8 | 3K x 8 | 2.7V ~ 5.5V | A/D 24x12b | External | |||||
NXP USA Inc. S9S12GA48F0MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 1,250 | 40 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | 1.5K x 8 | 4K x 8 | 3.13V ~ 5.5V | A/D 12x12b | Internal | ||||||
NXP USA Inc. S9S12HY32J0CLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | S9S12 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317888557 | 3A991A2 | 8542.31.0001 | 800 | 50 | HCS12 | 16-Bit | 32MHz | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | LCD, Motor control PWM, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 4K x 8 | 2K x 8 | 4.5V ~ 5.5V | A/D 6x10b | Internal | |||||
STMicroelectronics STM32L152VET6 | STMicroelectronics |
Min: 1 Mult: 1 |
/image/STMicroelectronics | STM32L1 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | STM32L152 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 497-14641 | 3A991A2 | 8542.31.0001 | 90 | 83 | ARM® Cortex®-M3 | 32-Bit Single-Core | 32MHz | I²C, IrDA, LINbus, SPI, UART/USART, USB | Brown-out Detect/Reset, Cap Sense, DMA, I²S, LCD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 16K x 8 | 80K x 8 | 1.8V ~ 3.6V | A/D 25x12b; D/A 2x12b | Internal | |||||
STMicroelectronics STM32F072VBT6 | STMicroelectronics |
Min: 1 Mult: 1 |
/image/STMicroelectronics | STM32F0 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | STM32F072 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 497-14643 | 3A991A2 | 8542.31.0001 | 90 | 87 | ARM® Cortex®-M0 | 32-Bit Single-Core | 48MHz | CANbus, HDMI-CEC, I²C, IrDA, LINbus, SPI, UART/USART, USB | DMA, I²S, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 1.65V ~ 3.6V | A/D 16x12b; D/A 2x12b | Internal | |||||
STMicroelectronics STM32F072CBU6 | STMicroelectronics |
Min: 1 Mult: 1 |
/image/STMicroelectronics | STM32F0 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-UFQFN Exposed Pad | STM32F072 | 48-UFQFPN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 497-14646 | 3A991A2 | 8542.31.0001 | 260 | 37 | ARM® Cortex®-M0 | 32-Bit Single-Core | 48MHz | CANbus, HDMI-CEC, I²C, IrDA, LINbus, SPI, UART/USART, USB | DMA, I²S, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 1.65V ~ 3.6V | A/D 10x12b; D/A 2x12b | Internal | |||||
STMicroelectronics STM32F042K6T6 | STMicroelectronics |
Min: 1 Mult: 1 |
/image/STMicroelectronics | STM32F0 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | STM32F042 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 497-14647 | 3A991A2 | 8542.31.0001 | 250 | 26 | ARM® Cortex®-M0 | 32-Bit Single-Core | 48MHz | CANbus, HDMI-CEC, I²C, IrDA, LINbus, SPI, UART/USART, USB | DMA, I²S, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 6K x 8 | 1.65V ~ 3.6V | A/D 13x12b | Internal | |||||
XMOS XS1-U10A-128-FB217-C10 | XMOS |
Min: 1 Mult: 1 |
/image/XMOS | XS1 | Tray | Last Time Buy | 0°C ~ 70°C (TA) | Surface Mount | 217-LFBGA | XS1-U10 | 217-FBGA (16x16) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 880-1082 | 3A991A2 | 8542.31.0001 | 84 | 73 | XCore | 32-Bit 10-Core | 1000MIPS | Configurable | - | 128KB (32K x 32) | SRAM | - | - | 3V ~ 3.6V | A/D 8x12b | Internal | |||||
XMOS XS1-U12A-128-FB217-C10 | XMOS |
Min: 1 Mult: 1 |
/image/XMOS | XS1 | Tray | Last Time Buy | 0°C ~ 70°C (TA) | Surface Mount | 217-LFBGA | XS1-U12 | 217-FBGA (16x16) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 880-1083 | 3A991A2 | 8542.31.0001 | 84 | 73 | XCore | 32-Bit 12-Core | 1000MIPS | Configurable | - | 128KB (32K x 32) | SRAM | - | - | 3V ~ 3.6V | A/D 8x12b | Internal | |||||
Texas Instruments MSP430F5247IRGCT | Texas Instruments |
Min: 1 Mult: 1 |
/image/Texas Instruments | MSP430F5xx | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-VFQFN Exposed Pad | MSP430F5247 | 64-VQFN (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 250 | 53 | MSP430 CPUXV2 | 16-Bit | 25MHz | I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 12x10b | Internal | ||||||
Infineon Technologies XMC1202T028X0032AAXUMA1 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | XMC1000 | Tape & Reel (TR) | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | XMC1202 | PG-TSSOP-28-16 | download | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 3,000 | 20 | ARM® Cortex®-M0 | 32-Bit Single-Core | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, I²S, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 16K x 8 | 1.8V ~ 5.5V | A/D 14x12b | Internal | |||||||
Microchip Technology PIC16F1718-I/SS | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | PIC16F1718 | 28-SSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 47 | 24 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (16K x 14) | FLASH | - | 2K x 8 | 2.3V ~ 5.5V | A/D 17x10b; D/A 1x5b, 1x8b | Internal | ||||||
Microchip Technology PIC16F1719-I/MV | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 40-UFQFN Exposed Pad | PIC16F1719 | 40-UQFN (5x5) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 73 | 35 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (16K x 14) | FLASH | - | 2K x 8 | 2.3V ~ 5.5V | A/D 28x10b; D/A 1x5b, 1x8b | Internal | ||||||
Microchip Technology PIC16F1719-I/P | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 85°C (TA) | Through Hole | 40-DIP (0.600", 15.24mm) | PIC16F1719 | 40-PDIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 10 | 35 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (16K x 14) | FLASH | - | 2K x 8 | 2.3V ~ 5.5V | A/D 28x10b; D/A 1x5b, 1x8b | Internal | ||||||
Infineon Technologies CY8C4013LQI-411 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | PSOC® 4 CY8C4000 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-UFQFN Exposed Pad | CY8C4013 | 16-QFN (3x3) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 490 | 12 | ARM® Cortex®-M0 | 32-Bit Single-Core | 16MHz | I²C | Brown-out Detect/Reset, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 5.5V | D/A 1x7b, 1x8b | Internal | ||||||
Infineon Technologies CY8C4013SXI-400 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | PSOC® 4 CY8C4000 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | CY8C4013 | 8-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,910 | 5 | ARM® Cortex®-M0 | 32-Bit Single-Core | 16MHz | I²C | Brown-out Detect/Reset, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 5.5V | - | Internal | ||||||
Infineon Technologies CY8C4014LQI-412 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | PSOC® 4 CY8C4000 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 24-UFQFN Exposed Pad | CY8C4014 | 24-QFN (4x4) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 490 | 20 | ARM® Cortex®-M0 | 32-Bit Single-Core | 16MHz | I²C | Brown-out Detect/Reset, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 5.5V | D/A 1x7b, 1x8b | Internal | ||||||
Infineon Technologies CY8C4014SXI-411 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | PSOC® 4 CY8C4000 | Tube | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | CY8C4014 | 16-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 720 | 13 | ARM® Cortex®-M0 | 32-Bit Single-Core | 16MHz | I²C | Brown-out Detect/Reset, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 5.5V | D/A 1x7b, 1x8b | Internal | ||||||
NXP USA Inc. LPC1112JHN33/103E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC1100XL | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-VQFN Exposed Pad | LPC1112 | 32-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 260 | 28 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 16KB (16K x 8) | FLASH | - | 4K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | ||||||
NXP USA Inc. LPC1114JHN33/203E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC1100XL | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-VQFN Exposed Pad | LPC1114 | 32-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 260 | 28 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 32KB (32K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | ||||||
NXP USA Inc. LPC1115FET48/303QL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC1100XL | Tray | Discontinued at Digi-Key | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | LPC1115 | 48-TFBGA (4.5x4.5) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 490 | 42 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | ||||||
NXP USA Inc. LPC812M101JDH16J | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC81xM | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | LPC812 | 16-TSSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,500 | 14 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 30MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 4K x 8 | 1.8V ~ 3.6V | - | Internal | ||||||
NXP USA Inc. LPC812M101JDH20J | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC81xM | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | LPC812 | 20-TSSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,500 | 18 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 30MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 4K x 8 | 1.8V ~ 3.6V | - | Internal | ||||||
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Dave Embedded Systems DDF59100I | Dave Embedded Systems |
Min: 1 Mult: 1 |
/image/Dave Embedded Systems | DIVA | Box | Active | -40°C ~ 85°C | DDF59100 | download | ROHS3 Compliant | 1 (Unlimited) | 5A002A1 | 8473.30.1180 | 1 | ARM® Cortex®-A8, AM3359 | 720MHz | 512MB | 1GB (NAND), 32MB (NOR) | MPU Core | PowerVR SGX530 | SO-DIMM-204 | |||||||||||||||
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Dave Embedded Systems DOH5210C | Dave Embedded Systems |
Min: 1 Mult: 1 |
/image/Dave Embedded Systems | DIDO | Box | Active | DOH5210 | download | ROHS3 Compliant | 1 (Unlimited) | 5A002A1 | 8473.30.1180 | 1 | ARM® Cortex®-A8, DM8148 | 1GHz | 1GB (NAND), 32MB (NOR) | MPU, DSP Core | TMS320C674x (DSP) | 2 x 140 Pins 0.6mm Pitch | |||||||||||||||||
Microchip Technology PIC16F1717-I/PT | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-TQFP | PIC16F1717 | 44-TQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 2266-PIC16F1717-I/PT | 3A991A2 | 8542.31.0001 | 160 | 35 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (8K x 14) | FLASH | - | 1K x 8 | 2.3V ~ 5.5V | A/D 28x10b; D/A 1x5b, 1x8b | Internal | |||||
Microchip Technology PIC16F1717T-I/PT | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-TQFP | PIC16F1717 | 44-TQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,200 | 35 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (8K x 14) | FLASH | - | 1K x 8 | 2.3V ~ 5.5V | A/D 28x10b; D/A 1x5b, 1x8b | Internal | ||||||
Microchip Technology PIC16F1719T-I/MV | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 40-UFQFN Exposed Pad | PIC16F1719 | 40-UQFN (5x5) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 3,300 | 35 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (16K x 14) | FLASH | - | 2K x 8 | 2.3V ~ 5.5V | A/D 28x10b; D/A 1x5b, 1x8b | Internal |
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