Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology DSPIC33EP64MC504-E/PT | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, dsPIC™ 33EP | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 44-TQFP | DSPIC33EP64MC504 | 44-TQFP (10x10) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 35 | dsPIC | 16-Bit | 60 MIPs | CANbus, I²C, IrDA, LINbus, QEI, SPI, UART/USART | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT | 64KB (22K x 24) | FLASH | - | 4K x 16 | 3V ~ 3.6V | A/D 9x10b/12b | Internal | ||
Microchip Technology PIC32MX210F016DT-I/ML | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 32MX | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-VQFN Exposed Pad | PIC32MX210 | 44-QFN (8x8) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,600 | 33 | MIPS32® M4K™ | 32-Bit Single-Core | 40MHz | I²C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 4K x 8 | 2.3V ~ 3.6V | A/D 13x10b | Internal | ||
Microchip Technology DSPIC33EP64MC202-E/SO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, dsPIC™ 33EP | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | DSPIC33EP64MC202 | 28-SOIC | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 27 | 21 | dsPIC | 16-Bit | 60 MIPs | I²C, IrDA, LINbus, QEI, SPI, UART/USART | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT | 64KB (22K x 24) | FLASH | - | 4K x 16 | 3V ~ 3.6V | A/D 6x10b/12b | Internal | ||
Microchip Technology DSPIC33EP64MC502-E/SO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, dsPIC™ 33EP | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | DSPIC33EP64MC502 | 28-SOIC | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 27 | 21 | dsPIC | 16-Bit | 60 MIPs | CANbus, I²C, IrDA, LINbus, QEI, SPI, UART/USART | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT | 64KB (22K x 24) | FLASH | - | 4K x 16 | 3V ~ 3.6V | A/D 6x10b/12b | Internal | ||
Microchip Technology PIC24EP64GP202-E/SP | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, PIC® 24EP | Tube | Active | -40°C ~ 125°C (TA) | Through Hole | 28-DIP (0.300", 7.62mm) | PIC24EP64GP202 | 28-SPDIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 15 | 21 | PIC | 16-Bit | 60 MIPs | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 64KB (22K x 24) | FLASH | - | 4K x 16 | 3V ~ 3.6V | A/D 6x10b/12b | Internal | ||
Microchip Technology PIC24EP64GP202-E/SS | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, PIC® 24EP | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | PIC24EP64GP202 | 28-SSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 47 | 21 | PIC | 16-Bit | 60 MIPs | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 64KB (22K x 24) | FLASH | - | 4K x 16 | 3V ~ 3.6V | A/D 6x10b/12b | Internal | ||
Microchip Technology PIC24EP64GP204-E/ML | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, PIC® 24EP | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 44-VQFN Exposed Pad | PIC24EP64GP204 | 44-QFN (8x8) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 45 | 35 | PIC | 16-Bit | 60 MIPs | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 64KB (22K x 24) | FLASH | - | 4K x 16 | 3V ~ 3.6V | A/D 9x10b/12b | Internal | ||
Microchip Technology PIC24EP64MC202-E/MM | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, PIC® 24EP | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 28-VQFN Exposed Pad | PIC24EP64MC202 | 28-QFN-S (6x6) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 61 | 21 | PIC | 16-Bit | 60 MIPs | I²C, IrDA, LINbus, QEI, SPI, UART/USART | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT | 64KB (22K x 24) | FLASH | - | 4K x 16 | 3V ~ 3.6V | A/D 6x10b/12b | Internal | ||
Microchip Technology PIC24EP64MC206-E/MR | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, PIC® 24EP | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-VFQFN Exposed Pad | PIC24EP64MC206 | 64-VQFN (9x9) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 40 | 53 | PIC | 16-Bit | 60 MIPs | I²C, IrDA, LINbus, QEI, SPI, UART/USART | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT | 64KB (22K x 24) | FLASH | - | 4K x 16 | 3V ~ 3.6V | A/D 16x10b/12b | Internal | ||
Texas Instruments MSP430F2618TPMR-NM | Texas Instruments |
Min: 1 Mult: 1 |
/image/Texas Instruments | MSP430F2xx | Tape & Reel (TR) | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MSP430F2618 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 1,000 | 48 | MSP430 CPU16 | 16-Bit | 16MHz | I²C, IrDA, LINbus, SCI, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 116KB (116K x 8 + 256B) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 8x12b; D/A 2x12b | Internal | ||
NXP USA Inc. MC56F8037MLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP | MC56F80 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 800 | 53 | 56800E | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | POR, PWM, WDT | 64KB (32K x 16) | FLASH | - | 4K x 16 | 3V ~ 3.6V | A/D 16x12b; D/A 2x12b | Internal | ||
NXP USA Inc. MC9RS08KA4CTGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RS08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9RS08 | 16-TSSOP | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324267534 | EAR99 | 8542.31.0001 | 5,000 | 14 | RS08 | 8-Bit | 20MHz | I²C | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | - | 126 x 8 | 1.8V ~ 5.5V | A/D 12x10b | Internal | ||
NXP USA Inc. MC9S08DV60ACLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | MC9S08 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 39 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | - | 3K x 8 | 2.7V ~ 5.5V | A/D 16x12b | External | |||
NXP USA Inc. MC9S08SH32CWLR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | MC9S08 | 28-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315663518 | 3A991A2 | 8542.31.0001 | 1,000 | 23 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | |
NXP USA Inc. MC9S12P64VLHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MC9S12 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,500 | 49 | HCS12 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 4K x 8 | 4K x 8 | 1.72V ~ 5.5V | A/D 10x12b | Internal | ||
NXP USA Inc. MC9S12P96MFTR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 48-TFQFN Exposed Pad | MC9S12 | 48-QFN-EP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 34 | HCS12 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 4K x 8 | 6K x 8 | 1.72V ~ 5.5V | A/D 10x12b | Internal | ||
NXP USA Inc. MC9S12XEG128CAL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | MC9S12 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324313557 | 3A991A2 | 8542.31.0001 | 300 | 91 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 12K x 8 | 1.72V ~ 5.5V | A/D 16x12b | External | ||
NXP USA Inc. MC9S12XEP100MVL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 208-BGA | MC9S12 | 208-BGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 450 | 152 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | 4K x 8 | 64K x 8 | 1.72V ~ 5.5V | A/D 32x12b | External | ||
NXP USA Inc. MCF51JM128VLHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF51JM | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MCF51 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,500 | 51 | Coldfire V1 | 32-Bit Single-Core | 50MHz | CANbus, I²C, SCI, SPI, USB OTG | LVD, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 2.7V ~ 5.5V | A/D 12x12b | External | ||
NXP USA Inc. MCF51JM128VLKR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF51JM | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MCF51 | 80-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313989528 | 3A991A2 | 8542.31.0001 | 1,000 | 66 | Coldfire V1 | 32-Bit Single-Core | 50MHz | CANbus, I²C, SCI, SPI, USB OTG | LVD, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 2.7V ~ 5.5V | A/D 12x12b | External | |
NXP USA Inc. MK10DN512ZVLL10R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MK10DN512 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325624528 | 3A991A2 | 8542.31.0001 | 1,000 | 70 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 37x16b; D/A 2x12b | Internal | |
NXP USA Inc. MPXD1005VLQ64 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | PX | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MPXD1005 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 60 | 105 | e200z0h | 32-Bit Single-Core | 64MHz | CANbus, I²C, LINbus, SCI, SPI, UART/USART | DMA, LCD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 48K x 8 | 3V ~ 3.6V | A/D 16x10b | Internal | ||
NXP USA Inc. MPXD1010VLQ64 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | PX | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MPXD1010 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 60 | 105 | e200z0h | 32-Bit Single-Core | 64MHz | CANbus, I²C, LINbus, SCI, SPI, UART/USART | DMA, LCD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 48K x 8 | 3V ~ 3.6V | A/D 16x10b | Internal | ||
NXP USA Inc. MPXR4030VVU264 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | PX | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 416-BBGA | MPXR4030 | 416-PBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 40 | 198 | e200z7 | 32-Bit Single-Core | 264MHz | CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART | DMA, POR, PWM, WDT | 3MB (3M x 8) | FLASH | - | 192K x 8 | 3V ~ 5.5V | A/D 64x12b | Internal | ||
NXP USA Inc. MPXS2010VMM120 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | PX | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 257-LFBGA | MPXS2010 | 257-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 450 | e200z4d | 32-Bit Single-Core | 120MHz | CANbus, LINbus, SPI, UART/USART | DMA, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 3V ~ 5.5V | A/D 32x12b | Internal | |||
NXP USA Inc. PK20FX512VLQ12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Box | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | PK20 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 8542.31.0001 | 1 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 16K x 8 | 128K x 8 | 1.71V ~ 3.6V | A/D 45x16b; D/A 2x12b | Internal | ||
NXP USA Inc. PK50N512CLQ100 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Box | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | PK50 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1 | 96 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 25x16b; D/A 2x12b | Internal | |||
NXP USA Inc. PK50N512CMC100 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Box | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 121-LFBGA | PK50 | 121-MAPBGA (8x8) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1 | 78 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 20x16b; D/A 2x12b | Internal | |||
NXP USA Inc. PK50N512CMD100 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Box | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 144-LBGA | PK50 | 144-MAPBGA (13x13) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1 | 96 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 25x16b; D/A 2x12b | Internal | |||
NXP USA Inc. PK50X256CLL100 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Box | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | PK50 | 100-LQFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1 | 59 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 64K x 8 | 1.71V ~ 3.6V | A/D 18x16b; D/A 2x12b | Internal |
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