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Microcontrollers(99682)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. S9S12GN16F1VLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | S9S12 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 26 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 512 x 8 | 1K x 8 | 3.13V ~ 5.5V | A/D 8x10b | Internal | ||
| NXP USA Inc. S9S12GN32F0CLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 40 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 1K x 8 | 2K x 8 | 3.13V ~ 5.5V | A/D 8x10b | Internal | ||
| NXP USA Inc. S912XHY256F0CLM | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 300 | 88 | HCS12X | 16-Bit | 40MHz | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | LCD, Motor control PWM, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 8K x 8 | 12K x 8 | 4.5V ~ 5.5V | A/D 12x10b | External | |||
| NXP USA Inc. MK20DX256VLL10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MK20DX256 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311568557 | 3A991A2 | 8542.31.0001 | 90 | 66 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 64K x 8 | 1.71V ~ 3.6V | A/D 33x16b; D/A 1x12b | Internal | |
| NXP USA Inc. MK52DN512CMD10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LBGA | MK52DN512 | 144-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 96 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal | ||
| NXP USA Inc. MK63FN1M0VLQ12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK63FN1M0 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.31.0001 | 60 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal | ||
| NXP USA Inc. MK64FN1M0VDC12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-XFBGA | MK64FN1M0 | 121-XFBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318682557 | 3A991A2 | 8542.31.0001 | 348 | 83 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 37x16b; D/A 2x12b | Internal | |
| NXP USA Inc. MK64FN1M0VLL12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MK64FN1M0 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315207557 | 3A991A2 | 8542.31.0001 | 90 | 66 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 32x16b; D/A 1x12b | Internal | |
| NXP USA Inc. MK64FN1M0VLQ12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK64FN1M0 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324728557 | 3A991A2 | 8542.31.0001 | 60 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal | |
| NXP USA Inc. MK64FN1M0VMD12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | MK64FN1M0 | 144-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315206557 | 3A991A2 | 8542.31.0001 | 160 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal | |
| NXP USA Inc. MK64FX512VMD12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | MK64FX512 | 144-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324731557 | 3A991A2 | 8542.31.0001 | 160 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 192K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal | |
| NXP USA Inc. MKE02Z32VLC2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MKE02Z32 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315854557 | 3A991A2 | 8542.31.0001 | 250 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 20MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | |
| NXP USA Inc. MKE02Z32VQH2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-QFP | MKE02Z32 | 64-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 84 | 57 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 20MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | ||
| NXP USA Inc. MKE02Z64VLH2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MKE02Z64 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 57 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 20MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 64KB (64K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | ||
| NXP USA Inc. MKE04Z8VWJ4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE04 | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | MKE04Z8 | 20-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317919574 | 3A991A2 | 8542.31.0001 | 38 | 18 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 8KB (8K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 10x12b; D/A 2x6b | Internal | |
| NXP USA Inc. MKM14Z64CHH5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KM | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 44-VFLGA Exposed Pad | MKM14Z64 | 44-MAPLGA (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324716557 | 3A991A2 | 8542.31.0001 | 2,450 | 20 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | DMA, WDT | 64KB (64K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 5x16b, 4x24b | Internal | |
| NXP USA Inc. S9S08AW16AE0VFT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | S9S08 | 48-QFN-EP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318571557 | 3A991A2 | 8542.31.0001 | 1,300 | 38 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |
| NXP USA Inc. S9S08DZ16F2VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S9S08 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314798557 | 3A991A2 | 8542.31.0001 | 1,250 | 39 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 512 x 8 | 1K x 8 | 2.7V ~ 5.5V | A/D 16x12b | External | |
| NXP USA Inc. S9S12GN32F0CFT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-TFQFN Exposed Pad | S9S12 | 48-QFN-EP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323289557 | 3A991A2 | 8542.31.0001 | 1,300 | 40 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 1K x 8 | 2K x 8 | 3.13V ~ 5.5V | A/D 8x10b | Internal | |
| NXP USA Inc. S9S12P128J0VFT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-TFQFN Exposed Pad | S9S12 | 48-QFN-EP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315565557 | 3A991A2 | 8542.31.0001 | 1,300 | 34 | HCS12 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 6K x 8 | 1.72V ~ 5.5V | A/D 10x12b | Internal | ||
| NXP USA Inc. S9S12P96J0CFT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-TFQFN Exposed Pad | S9S12 | 48-QFN-EP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,300 | 34 | HCS12 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 4K x 8 | 6K x 8 | 1.72V ~ 5.5V | A/D 10x12b | Internal | |||
| NXP USA Inc. S9S12P96J0CFTR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-TFQFN Exposed Pad | S9S12 | 48-QFN-EP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 34 | HCS12 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 4K x 8 | 6K x 8 | 1.72V ~ 5.5V | A/D 10x12b | Internal | |||
| Microchip Technology ATSAM3N00AA-MUR | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM3N | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | ATSAM3N | 48-QFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 3,500 | 34 | ARM® Cortex®-M3 | 32-Bit Single-Core | 48MHz | I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 4K x 8 | 1.62V ~ 3.6V | A/D 8x10b | Internal | ||
| Microchip Technology ATSAM3N0AA-AUR | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM3N | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | ATSAM3N | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 34 | ARM® Cortex®-M3 | 32-Bit Single-Core | 48MHz | I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 8K x 8 | 1.62V ~ 3.6V | A/D 8x10b | Internal | ||
| Microchip Technology ATSAM3N0BA-AUR | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM3N | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | ATSAM3N | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,500 | 47 | ARM® Cortex®-M3 | 32-Bit Single-Core | 48MHz | I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 8K x 8 | 1.62V ~ 3.6V | A/D 10x10b; D/A 1x10b | Internal | ||
| Microchip Technology ATSAM3N0BA-MUR | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM3N | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-VFQFN Exposed Pad | ATSAM3N | 64-QFN (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 3,500 | 47 | ARM® Cortex®-M3 | 32-Bit Single-Core | 48MHz | I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 8K x 8 | 1.62V ~ 3.6V | A/D 10x10b; D/A 1x10b | Internal | ||
| Microchip Technology ATSAM3N0CA-CUR | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM3N | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-TFBGA | ATSAM3N | 100-TFBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 79 | ARM® Cortex®-M3 | 32-Bit Single-Core | 48MHz | I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 8K x 8 | 1.62V ~ 3.6V | A/D 16x10b; D/A 1x10b | Internal | ||
| Microchip Technology ATSAM3N1AB-MUR | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM3N | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | ATSAM3N | 48-QFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 3,500 | 34 | ARM® Cortex®-M3 | 32-Bit Single-Core | 48MHz | I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 1.62V ~ 3.6V | A/D 8x10b | Internal | ||
| Microchip Technology ATXMEGA128D4-AUR | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | AVR® XMEGA® D4 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-TQFP | ATXMEGA128 | 44-TQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 1,500 | 34 | AVR | 8/16-Bit | 32MHz | I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 128KB (64K x 16) | FLASH | 2K x 8 | 8K x 8 | 1.6V ~ 3.6V | A/D 12x12b | Internal | ||
| Microchip Technology ATXMEGA256C3-AUR | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | AVR® XMEGA® C3 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-TQFP | ATXMEGA256 | 64-TQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 1,000 | 50 | AVR | 8/16-Bit | 32MHz | I²C, IrDA, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 256KB (128K x 16) | FLASH | 4K x 8 | 16K x 8 | 1.6V ~ 3.6V | A/D 16x12b | Internal |
