Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
XMOS XS1-U16A-128-FB217-C10 | XMOS |
Min: 1 Mult: 1 |
/image/XMOS | XS1 | Tray | Last Time Buy | 0°C ~ 70°C (TA) | Surface Mount | 217-LFBGA | XS1-U16 | 217-FBGA (16x16) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 880-1080 | 3A991A2 | 8542.31.0001 | 84 | 73 | XCore | 32-Bit 16-Core | 1000MIPS | Configurable | - | 128KB (32K x 32) | SRAM | - | - | 3V ~ 3.6V | A/D 8x12b | Internal | |
NXP USA Inc. MK22FN256VDC12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-XFBGA | MK22FN256 | 121-BGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318267557 | 3A991A2 | 8542.31.0001 | 348 | 70 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 48K x 8 | 1.71V ~ 3.6V | A/D 36x16b; D/A 1x12b | Internal | |
NXP USA Inc. MKL03Z32VFK4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL03 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 24-VFQFN Exposed Pad | MKL03Z32 | 24-QFN (4x4) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312952557 | 3A991A2 | 8542.31.0001 | 490 | 22 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 3.6V | A/D 7x12b | Internal | |
NXP USA Inc. MK22FN1M0VMC12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK22FN1M0 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 38x16b; D/A 2x12b | Internal | ||
NXP USA Inc. LPC11A13JHI33/201E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC11Axx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | LPC11 | 32-HVQFN (5x5) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 490 | 28 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART | Brown-out Detect/Reset, POR, WDT | 24KB (24K x 8) | FLASH | 2K x 8 | 6K x 8 | 2.6V ~ 3.6V | A/D 8x10b; D/A 1x10b | Internal | |||
NXP USA Inc. LPC1112JHN33/203E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC1100XL | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-VQFN Exposed Pad | LPC1112 | 32-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 260 | 28 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 16KB (16K x 8) | FLASH | - | 4K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | ||
NXP USA Inc. LPC1113JHN33/203E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC1100XL | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-VQFN Exposed Pad | LPC1113 | 32-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 260 | 28 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 24KB (24K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | ||
NXP USA Inc. LPC1115JBD48/303QL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC1100XL | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | LPC1115 | 48-LQFP (7x7) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 42 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | ||
Microchip Technology PIC12F1612T-I/MF | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 12F | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | PIC12F1612 | 8-DFN (3x3) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 3,300 | 6 | PIC | 8-Bit | 32MHz | - | Brown-out Detect/Reset, POR, PWM, WDT | 3.5KB (2K x 14) | FLASH | - | 256 x 8 | 2.3V ~ 5.5V | A/D 4x10b | Internal | ||
Microchip Technology PIC32MX430F064HT-I/RG | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 32MX | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-VFQFN Exposed Pad | PIC32MX430 | 64-VQFN (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 3,300 | 49 | MIPS32® M4K™ | 32-Bit Single-Core | 100MHz | I²C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 16K x 8 | 2.3V ~ 3.6V | A/D 28x10b | Internal | ||
Microchip Technology PIC32MX430F064H-I/RG | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 32MX | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-VFQFN Exposed Pad | PIC32MX430 | 64-VQFN (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 40 | 49 | MIPS32® M4K™ | 32-Bit Single-Core | 100MHz | I²C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 16K x 8 | 2.3V ~ 3.6V | A/D 28x10b | Internal | ||
Microchip Technology PIC12LF1612-E/MF | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 12F | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 8-VDFN Exposed Pad | PIC12LF1612 | 8-DFN (3x3) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 120 | 6 | PIC | 8-Bit | 32MHz | - | Brown-out Detect/Reset, POR, PWM, WDT | 3.5KB (2K x 14) | FLASH | - | 256 x 8 | 1.8V ~ 3.6V | A/D 4x10b | Internal | ||
Microchip Technology PIC16LF1613-E/P | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 125°C (TA) | Through Hole | 14-DIP (0.300", 7.62mm) | PIC16LF1613 | 14-PDIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 30 | 12 | PIC | 8-Bit | 32MHz | - | Brown-out Detect/Reset, POR, PWM, WDT | 3.5KB (2K x 14) | FLASH | - | 256 x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | ||
Microchip Technology PIC16LF1613-E/SL | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | PIC16LF1613 | 14-SOIC | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 57 | 12 | PIC | 8-Bit | 32MHz | - | Brown-out Detect/Reset, POR, PWM, WDT | 3.5KB (2K x 14) | FLASH | - | 256 x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | ||
Microchip Technology PIC16LF1613-E/ST | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | PIC16LF1613 | 14-TSSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 96 | 12 | PIC | 8-Bit | 32MHz | - | Brown-out Detect/Reset, POR, PWM, WDT | 3.5KB (2K x 14) | FLASH | - | 256 x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | ||
Microchip Technology PIC16LF1613-I/ST | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | PIC16LF1613 | 14-TSSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 96 | 12 | PIC | 8-Bit | 32MHz | - | Brown-out Detect/Reset, POR, PWM, WDT | 3.5KB (2K x 14) | FLASH | - | 256 x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | ||
Panasonic Electronic Components MN101LR05DXW | Panasonic Electronic Components |
Min: 1 Mult: 1 |
/image/Panasonic Electronic Components | MN101L | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 80-TQFP | MN101LR | 80-TQFP (12x12) | download | RoHS Compliant | 3 (168 Hours) | P16826 | EAR99 | 8542.31.0001 | 1,000 | 69 | AM13L | 8-Bit | 10MHz | I²C, UART/USART | DMA, LCD, LVD, POR, PWM, WDT | 64KB (64K x 8) | ReRAM | - | 4K x 8 | 1.8V ~ 3.6V | A/D 8x12b | Internal | ||
Microchip Technology ATSAMD20J18A-AUES | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM D20J | Tray | Discontinued at Digi-Key | -40°C ~ 85°C (TA) | Surface Mount | 64-TQFP | ATSAMD20 | 64-TQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 800 | 52 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 1.62V ~ 3.6V | A/D 20x12b; D/A 1x10b | Internal | ||
Texas Instruments MSP430FR5949IRHAR | Texas Instruments |
Min: 1 Mult: 1 |
/image/Texas Instruments | MSP430™ FRAM | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 40-VFQFN Exposed Pad | MSP430FR5949 | 40-VQFN (6x6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 2,500 | 33 | MSP430 CPUXV2 | 16-Bit | 16MHz | I²C, IrDA, SCI, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 64KB (64K x 8) | FRAM | - | 2K x 8 | 1.8V ~ 3.6V | A/D 14x12b | Internal | ||
Texas Instruments TMP5704357AZWTQQ1 | Texas Instruments |
Min: 1 Mult: 1 |
/image/Texas Instruments | Automotive, AEC-Q100, Hercules™ TMS570 ARM® Cortex®-R | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 337-LFBGA | TMP57 | 337-NFBGA (16x16) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1 | 145 | ARM® Cortex®-R5F | 32-Bit Dual-Core | 300MHz | CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART | DMA, POR, PWM, WDT | 4MB (4M x 8) | FLASH | 128K x 8 | 512K x 8 | 3V ~ 3.6V | A/D 41x12b | Internal | ||
Microchip Technology PIC16LF1719-E/PT | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 44-TQFP | PIC16LF1719 | 44-TQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 35 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (16K x 14) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | A/D 28x10b; D/A 1x5b, 1x8b | Internal | ||
Microchip Technology PIC16F1719-E/MV | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 40-UFQFN Exposed Pad | PIC16F1719 | 40-UQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 73 | 35 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (16K x 14) | FLASH | - | 2K x 8 | 2.3V ~ 5.5V | A/D 28x10b; D/A 1x5b, 1x8b | Internal | ||
Microchip Technology PIC16LF1718-E/ML | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 28-VQFN Exposed Pad | PIC16LF1718 | 28-QFN (6x6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 61 | 24 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (16K x 14) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | A/D 17x10b; D/A 1x5b, 1x8b | Internal | ||
Microchip Technology PIC16LF1718-E/SS | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | PIC16LF1718 | 28-SSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 47 | 24 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (16K x 14) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | A/D 17x10b; D/A 1x5b, 1x8b | Internal | ||
Microchip Technology PIC16LF1719-E/MV | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 40-UFQFN Exposed Pad | PIC16LF1719 | 40-UQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 73 | 35 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (16K x 14) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | A/D 28x10b; D/A 1x5b, 1x8b | Internal | ||
Microchip Technology PIC16LF1719-E/P | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 125°C (TA) | Through Hole | 40-DIP (0.600", 15.24mm) | PIC16LF1719 | 40-PDIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 10 | 35 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (16K x 14) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | A/D 28x10b; D/A 1x5b, 1x8b | Internal | ||
Microchip Technology PIC16LF1717T-I/MV | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 40-UFQFN Exposed Pad | PIC16LF1717 | 40-UQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 3,300 | 35 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (8K x 14) | FLASH | - | 1K x 8 | 1.8V ~ 3.6V | A/D 28x10b; D/A 1x5b, 1x8b | Internal | ||
Microchip Technology PIC16LF1717T-I/PT | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-TQFP | PIC16LF1717 | 44-TQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,200 | 35 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (8K x 14) | FLASH | - | 1K x 8 | 1.8V ~ 3.6V | A/D 28x10b; D/A 1x5b, 1x8b | Internal | ||
Microchip Technology PIC16LF1718T-I/SO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | PIC16LF1718 | 28-SOIC | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,600 | 24 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (16K x 14) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | A/D 17x10b; D/A 1x5b, 1x8b | Internal | ||
Microchip Technology PIC16LF1719T-I/MV | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 40-UFQFN Exposed Pad | PIC16LF1719 | 40-UQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 3,300 | 35 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (16K x 14) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | A/D 28x10b; D/A 1x5b, 1x8b | Internal |
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