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AMD XCVE1752-2LLENSVG1369
XCVE1752-2LLENSVG1369
- Manufacturer: AMD
- Origchip NO: XCVE1752-2LLENSVG1369
- Package: 1369-BFBGA
- Datasheet:
PDF - Stock: 8463
- Description: XCVE1752-2LLENSVG1369(Kg)
Quantity:
In Stock
Please send RFQ , we will respond immediately.
Purchase
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(Please remember to check the spam folder if you didn't hear from us).
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extent, the sales manager is going to reconfirm the order and let you know if there
are any updates.
Shipping Cost
Shipping starts at $40, but some countries will exceed $40. For
example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time
zone and country.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
Delivery TimeOnce the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.| Parameters | |
|---|---|
| Mfr | AMD |
| Series | Versal™ AI Core |
| Package | Tray |
| Product Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 450MHz, 1.08GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 1369-BFBGA |
| Supplier Device Package | 1369-BGA (35x35) |
| Number of I/O | 500 |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| ECCN | 3A001A7B |
| HTSUS | 8542.39.0001 |
| Other Names | 122-XCVE1752-2LLENSVG1369 |
| Standard Package | 1 |
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ AI Core Versal™ AI Core FPGA, 1M Logic Cells 450MHz, 1.08GHz 1369-BGA (35x35)
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