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ALLCHIPS ELECTRONICS LIMITED

Microchip Technology M2S060-FGG676I

M2S060-FGG676I


  • Manufacturer: Microchip Technology
  • Origchip NO: M2S060-FGG676I
  • Package: 676-BGA
  • Datasheet: pdfPDF
  • Stock: 5227
  • Description: M2S060-FGG676I(Kg)

Quantity:

Qty

Unit Price

Ext Price

  • 40

    $172.38

    $6,895.11

Not the price you want? Send RFQ Now and we'll contact you ASAP.

In Stock

Please send RFQ , we will respond immediately.

Purchase & Inquiry

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Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.

SPECIFICATIONS

Parameters
Mfr Microchip Technology
Series SmartFusion®2
Package Tray
Product Status Active
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 256KB
RAM Size 64KB
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed 166MHz
Primary Attributes FPGA - 60K Logic Modules
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Number of I/O 387
Base Product Number M2S060
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 40
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 60K Logic Modules 166MHz 676-FBGA (27x27)

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