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ALLCHIPS ELECTRONICS LIMITED

AMD XC17S30XLVOG8I

XC17S30XLVOG8I


  • Manufacturer: AMD
  • Origchip NO: XC17S30XLVOG8I
  • Package: 8-SOIC (0.154", 3.90mm Width)
  • Datasheet: pdfPDF
  • Stock: 7135
  • Description: XC17S30XLVOG8I(Kg)

Quantity:

In Stock

Please send RFQ , we will respond immediately.

Purchase & Inquiry

Transport

Purchase

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Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.

SPECIFICATIONS

Parameters
Mfr AMD
Series -
Package Tray
Product Status Obsolete
Digi-Key Programmable Not Verified
Programmable Type OTP
Memory Size 300kb
Voltage - Supply 3V ~ 3.6V
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package 8-TSOP
Base Product Number XC17S30XL
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0061
Standard Package 98

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In Stock

Please send RFQ , we will respond immediately.