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ALLCHIPS ELECTRONICS LIMITED

Winbond Electronics W66BM6NBUAFJ

W66BM6NBUAFJ


  • Manufacturer: Winbond Electronics
  • Origchip NO: W66BM6NBUAFJ
  • Package: 200-WFBGA
  • Datasheet: pdfPDF
  • Stock: 7890
  • Description: W66BM6NBUAFJ(Kg)

Quantity:

Qty

Unit Price

Ext Price

  • 144

    $6.57

    $945.84

Not the price you want? Send RFQ Now and we'll contact you ASAP.

In Stock

Please send RFQ , we will respond immediately.

Purchase & Inquiry

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Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.

SPECIFICATIONS

Parameters
Mfr Winbond Electronics
Series -
Package Tray
Product Status Not For New Designs
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR4X
Memory Size 2Gbit
Memory Organization 128M x 16
Memory Interface LVSTL_11
Clock Frequency 1.6 GHz
Write Cycle Time - Word, Page 18ns
Access Time 3.5 ns
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature -40°C ~ 105°C (TC)
Mounting Type Surface Mount
Package / Case 200-WFBGA
Supplier Device Package 200-WFBGA (10x14.5)
Base Product Number W66BM6
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0036
Other Names 256-W66BM6NBUAFJ
Standard Package 144
SDRAM - Mobile LPDDR4X Memory IC 2Gbit LVSTL_11 1.6 GHz 3.5 ns 200-WFBGA (10x14.5)

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In Stock

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