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ALLCHIPS ELECTRONICS LIMITED

Micron Technology Inc. 29F256G08CBHBBL06B3WC1-R

MT29F256G08CBHBBL06B3WC1-R


  • Manufacturer: Micron Technology Inc.
  • Origchip NO: 29F256G08CBHBBL06B3WC1-R
  • Package: Die
  • Datasheet: -
  • Stock: 7253
  • Description: MT29F256G08CBHBBL06B3WC1-R(Kg)

Quantity:

In Stock

Please send RFQ , we will respond immediately.

Purchase & Inquiry

Transport

Purchase

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We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.

SPECIFICATIONS

Parameters
Mfr Micron Technology Inc.
Series -
Package Bulk
Product Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND (MLC)
Memory Size 256Gbit
Memory Organization 32G x 8
Memory Interface Parallel
Write Cycle Time - Word, Page -
Voltage - Supply 2.5V ~ 3.6V
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case Die
Supplier Device Package Die
Base Product Number MT29F256G08
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071
Standard Package 1
FLASH - NAND (MLC) Memory IC 256Gbit Parallel Die

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In Stock

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