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ALLCHIPS ELECTRONICS LIMITED

Texas Instruments 66AK2H06AAAWA24

66AK2H06AAAWA24


  • Manufacturer: Texas Instruments
  • Origchip NO: 66AK2H06AAAWA24
  • Package: 1517-BBGA, FCBGA
  • Datasheet: pdfPDF
  • Stock: 7744
  • Description: 66AK2H06AAAWA24(Kg)

Quantity:

In Stock

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Purchase & Inquiry

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Means of Payment

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RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.

SPECIFICATIONS

Parameters
Mfr Texas Instruments
Series 66AK2Hx KeyStone Multicore
Package Tray
Product Status Obsolete
Type DSP+ARM®
Interface EBI/EMI, Ethernet, DMA, I²C, Serial RapidIO, SPI, UART/USART, USB 3.0
Clock Rate 1.2GHz DSP, 1.4GHz ARM®
Non-Volatile Memory ROM (384kB)
On-Chip RAM 8.375MB
Voltage - I/O 0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
Voltage - Core Variable
Operating Temperature -40°C ~ 100°C (TC)
Mounting Type Surface Mount
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FCBGA (40x40)
Base Product Number 66AK2
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A991B4A
HTSUS 8542.31.0001
Standard Package 21

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