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Microcontrollers, Microprocessor, FPGA Modules(1446)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Trenz Electronic GmbH 0712-02-82C36-AW | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0712 | Bulk | Discontinued at Digi-Key | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-82C36-AW | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | ||
|
Trenz Electronic GmbH 0712-02-71I06-M | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0712 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-71I06-M | 3A991D | 8471.50.0150 | 1 | - | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
|
Trenz Electronic GmbH 0712-02-200-2C10 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-200-2C10 | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
|
Trenz Electronic GmbH 0712-02-200-1IC1 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-200-1IC1 | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
|
Trenz Electronic GmbH 0712-02-71I01-M | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-71I01-M | 3A991D | 8471.50.0150 | 1 | - | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
|
Trenz Electronic GmbH 0712-02-72C36-C | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0712 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-72C36-C | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
|
Trenz Electronic GmbH 0712-02-100-2C2 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-100-2C2 | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
| MYIR Tech Limited MYC-C3354-256N256D-80-I-GW | MYIR Tech Limited |
Min: 1 Mult: 1 |
/image/MYIR Tech Limited | AM335x | Box | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Vendor Undefined | Vendor Undefined | 3309-MYC-C3354-256N256D-80-I-GW | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A8, AM3354 | 600MHz, 800MHz, 1GHz | 256KB | 256KB EPROM | MPU | - | 80 Pin | ||
|
Trenz Electronic GmbH 0729-02-62I63FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Bulk | Discontinued at Digi-Key | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0729-02-62I63FA | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 512MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | ||
|
Trenz Electronic GmbH 0729-02-62I65FM | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Bulk | Discontinued at Digi-Key | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0729-02-62I65FM | 1 | ARM Cortex-A9 | - | 512MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | |||||
|
Motorola KXC705JJ7CS | Motorola |
Min: 1 Mult: 1 |
/image/Motorola | * | Bulk | Active | Not applicable | 3 (168 Hours) | Vendor Undefined | 1 | ||||||||||||||
| NXP USA Inc. JN5169-001-M03-2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Bulk | Active | download | Not applicable | 3 (168 Hours) | Vendor Undefined | EAR99 | 8542.39.0001 | 1 | ||||||||||||
| Rendeer Systems D51M200 | Rendeer Systems |
Min: 1 Mult: 1 |
/image/Rendeer Systems | - | Bulk | Active | -40°C ~ 85°C (TA) | 1.470" L x 1.090" W (37.50mm x 27.75mm) | download | ROHS3 Compliant | 1 (Unlimited) | 3112-RSD51M200 | 3A991A | 8542.31.0001 | 1 | ARM® Cortex®-M4 | 120MHz | 256KB (Internal), 16MB (External QSPI) | 1MB | MCU Core | - | - | |||
|
Trenz Electronic GmbH 0782-02-92I33FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0782 | Bulk | Discontinued at Digi-Key | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0782-02-92I33FA | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ||||
|
Trenz Electronic GmbH 0782-02-045-2IC | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0782 | Bulk | Obsolete | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0782-02-045-2IC | OBSOLETE | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ||||
|
Trenz Electronic GmbH 0745-02-71I31-AK | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.990" L x 2.130" W (76.00mm x 54.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-71I31-AK | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | Board-to-Board (BTB) Socket - 480 | ||||
|
Trenz Electronic GmbH 0745-02-81C31-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-81C31-A | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7035) | Board-to-Board (BTB) Socket - 160 | ||
|
Trenz Electronic GmbH 0745-02-92I11-AK | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-92I11-AK | OBSOLETE | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ||||
| AMD SM-K26-XCL2GC-ED | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ Kria™ | Box | Active | 0°C ~ 85°C (TJ) | 3.030" L x 2.360" W (77.00mm x 60.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 122-SM-K26-XCL2GC-ED | EAR99 | 8471.50.0150 | 1 | ARM® Cortex®-A53 | 533MHz, 1.333GHz | 4GB | 16GB eMMC, 64MB QSPI | FPGA Core | Arm® Cortex®-R5F | 2 x 240 Pin | |||
| Beacon EmbeddedWorks SOMIMX8MNS-10-29C0DMCR | Beacon EmbeddedWorks |
Min: 1 Mult: 1 |
/image/Beacon EmbeddedWorks | i.MX 8M Nano | Bulk | Active | 0°C ~ 70°C | 1.100" L x 1.500" W (28.00mm x 38.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 460-SOMIMX8MNS-10-29C0DMCR | 1 | ARM® Cortex®-A53, ARM® Cortex™-M7 | 1.5GHz, 750MHz | 1GB | 8GB | MPU Core | - | 3 x 100 Pins HD Connectors | ||||
| Trenz Electronic GmbH 0808-05-9BE21-AK | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-05-9BE21-AK | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | 2GB | 128MB | MPU Core | - | B2B | |||
|
Trenz Electronic GmbH 0803-04-4BE11-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-4BE11-A | 1 | Zynq UltraScale+ XCZU4EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
|
Trenz Electronic GmbH 0803-04-3BE11-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-3BE11-A | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
|
Trenz Electronic GmbH 0803-04-5DE11-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-5DE11-A | 1 | Zynq UltraScale+ XCZU5EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
|
Trenz Electronic GmbH 0803-04-2BE11-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-2BE11-A | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
|
Trenz Electronic GmbH 0803-04-2AE11-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-2AE11-A | 1 | Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
| Octavo Systems LLC D32MP153C-512M-BAA | Octavo Systems LLC |
Min: 1 Mult: 1 |
/image/Octavo Systems LLC | - | Tray | Active | 0°C ~ 85°C | 0.710" L x 0.710" W (18.00mm x 18.00mm) | download | 4 (72 Hours) | 1676-OSD32MP153C-512M-BAA | 5A992C 23 | 8542.31.0001 | 65 | Arm® Dual Cortex®-A7, Arm® Cortex®-M4 | 650MHz | 512MB | - | MPU Core | NEON™ SIMD | 302-BGA | ||||
| Octavo Systems LLC D32MP153A-512M-BAA | Octavo Systems LLC |
Min: 1 Mult: 1 |
/image/Octavo Systems LLC | - | Tray | Active | 0°C ~ 85°C | 0.710" L x 0.710" W (18.00mm x 18.00mm) | download | 1676-OSD32MP153A-512M-BAA | 65 | Arm® Dual Cortex®-A7, Arm® Cortex®-M4 | 650MHz | 512MB | - | MPU Core | NEON™ SIMD | 302-BGA | |||||||
|
Enclustra FPGA Solutions MA-XU3-3EG-2I-D11-R3 | Enclustra FPGA Solutions |
Min: 1 Mult: 1 |
/image/Enclustra FPGA Solutions | * | Box | Active | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 5A002A4 ENC | 8471.50.0150 | 1 | ||||||||||||
| Enclustra FPGA Solutions ME-XU7-6EG-1I-D11E-R4 | Enclustra FPGA Solutions |
Min: 1 Mult: 1 |
/image/Enclustra FPGA Solutions | * | Box | Obsolete | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | OBSOLETE | 1 |
