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Circuit Protection
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Sensors, Transducers
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Switches
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Microcontrollers, Microprocessor, FPGA Modules(1446)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Trenz Electronic GmbH 0745-02-45-3EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0745 | Box | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-45-3EA | OBSOLETE | 1 | ARM® Cortex®-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Samtec ST5 | |||
|
Trenz Electronic GmbH 0808-04-9BE21-L | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0808 | Box | Active | - | - | TE0808 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-9BE21-L | 1 | - | - | 4GB | 128MB | MPU Core | - | B2B | |||
|
Trenz Electronic GmbH 0808-04-09EG-1EL | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-09EG-1EL | OBSOLETE | 1 | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | |||
|
Trenz Electronic GmbH 0808-04-6BE21-L | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-6BE21-L | 1 | Zynq UltraScale+ XCZU6EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | |||
|
Trenz Electronic GmbH 0808-04-6BE21-AK | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-6BE21-AK | 1 | Zynq UltraScale+ XCZU6EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | |||
| Octavo Systems LLC D32MP157C-512M-BAA | Octavo Systems LLC |
Min: 1 Mult: 1 |
/image/Octavo Systems LLC | OSD32MP15x | Tray | Active | 0°C ~ 85°C | 0.709" L x 0.709" W (18.00mm x 18.00mm) | OSD32 | download | ROHS3 Compliant | 4 (72 Hours) | 1676-OSD32MP157C-512M-BAA | 5A992C | 8542.31.0001 | 65 | Arm® Dual Cortex®-A7, Arm® Cortex®-M4 | 650MHz, 209MHz | - | MPU Core | NEON™ SIMD | 302-BGA | |||
|
System-On-Chip (SOC) Technologies Inc. 2EC-VA-H264-10B-30-1080-MD00C-A200T | System-On-Chip (SOC) Technologies Inc. |
Min: 1 Mult: 1 |
/image/System-On-Chip (SOC) Technologies Inc. | - | Box | Active | - | - | 2EC-VA | download | 1962-2EC-VA-H264-10B-30-1080-MD00C-A200T | 3A991D | 8473.30.1180 | 1 | - | - | 512MB | 32MB | DSP, FPGA Core | Xilinx Artix-7 XC7A200T | SO-DIMM | |||
|
System-On-Chip (SOC) Technologies Inc. DC-VA-H264-10B-60-4K-OPVIC-0000 | System-On-Chip (SOC) Technologies Inc. |
Min: 1 Mult: 1 |
/image/System-On-Chip (SOC) Technologies Inc. | * | Box | Active | DC-VA-H264 | download | 1962-DC-VA-H264-10B-60-4K-OPVIC-0000 | 1 | ||||||||||||||
|
System-On-Chip (SOC) Technologies Inc. 2DC-VA-H264-10B-30-1080-MD00C-A200T | System-On-Chip (SOC) Technologies Inc. |
Min: 1 Mult: 1 |
/image/System-On-Chip (SOC) Technologies Inc. | - | Box | Active | - | - | 2DC-VA | download | 1962-2DC-VA-H264-10B-30-1080-MD00C-A200T | 3A991D | 8473.30.1180 | 1 | - | - | 512MB | 32MB | DSP, FPGA Core | Xilinx Artix-7 XC7A200T | SO-DIMM | |||
|
System-On-Chip (SOC) Technologies Inc. EC-VA-H264-10B-60-1080-MD00C-A200T | System-On-Chip (SOC) Technologies Inc. |
Min: 1 Mult: 1 |
/image/System-On-Chip (SOC) Technologies Inc. | - | Box | Active | - | - | EC-VA-H264 | download | 1962-EC-VA-H264-10B-60-1080-MD00C-A200T | 3A991D | 8473.30.1180 | 1 | - | - | 512MB | 32MB | DSP, FPGA Core | Xilinx Artix-7 XC7A200T | SO-DIMM | |||
|
System-On-Chip (SOC) Technologies Inc. DC-VA-H264-10B-60-1080-MD00C-A200T | System-On-Chip (SOC) Technologies Inc. |
Min: 1 Mult: 1 |
/image/System-On-Chip (SOC) Technologies Inc. | - | Box | Active | - | - | DC-VA-H264 | download | 1962-DC-VA-H264-10B-60-1080-MD00C-A200T | 3A991D | 8473.30.1180 | 1 | - | - | 512MB | 32MB | DSP, FPGA Core | Xilinx Artix-7 XC7A200T | SO-DIMM | |||
|
System-On-Chip (SOC) Technologies Inc. 2DC-VA-H264-10B-30-4K-MD00C-SX660 | System-On-Chip (SOC) Technologies Inc. |
Min: 1 Mult: 1 |
/image/System-On-Chip (SOC) Technologies Inc. | H.264-HD Encoder | Box | Active | - | - | download | 1962-2DC-VA-H264-10B-30-4K-MD00C-SX660 | 1 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | 512MB | 128KB | FPGA Core | - | - | ||||||
|
System-On-Chip (SOC) Technologies Inc. DC-VA-MEPG2-8B-60-1080-OPVXC-0000 | System-On-Chip (SOC) Technologies Inc. |
Min: 1 Mult: 1 |
/image/System-On-Chip (SOC) Technologies Inc. | * | Box | Active | DC-VA-MEPG2 | download | 1962-DC-VA-MEPG2-8B-60-1080-OPVXC-0000 | 1 | ||||||||||||||
|
System-On-Chip (SOC) Technologies Inc. 4EC-VA-H265-10B-60-1080-MD00C-SX660 | System-On-Chip (SOC) Technologies Inc. |
Min: 1 Mult: 1 |
/image/System-On-Chip (SOC) Technologies Inc. | H.265-HD Encoder | Box | Active | - | - | download | 1962-4EC-VA-H265-10B-60-1080-MD00C-SX660 | 1 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | 512MB | 128KB | FPGA Core | - | - | ||||||
|
System-On-Chip (SOC) Technologies Inc. EC-VA-H264-10B-60-4K-MD00C-SX660 | System-On-Chip (SOC) Technologies Inc. |
Min: 1 Mult: 1 |
/image/System-On-Chip (SOC) Technologies Inc. | H.264-HD Encoder | Box | Active | - | - | EC-VA-H264 | download | 1962-EC-VA-H264-10B-60-4K-MD00C-SX660 | 1 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | 512MB | 128KB | FPGA Core | - | - | |||||
|
System-On-Chip (SOC) Technologies Inc. DC-VA-H264-10B-60-4K-MD00C-SX660 | System-On-Chip (SOC) Technologies Inc. |
Min: 1 Mult: 1 |
/image/System-On-Chip (SOC) Technologies Inc. | H.264-HD Encoder | Box | Active | - | - | DC-VA-H264 | download | 1962-DC-VA-H264-10B-60-4K-MD00C-SX660 | 1 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | 512MB | 128KB | FPGA Core | - | - | |||||
|
System-On-Chip (SOC) Technologies Inc. DC-VA-H264-10B-60-1080-OPVXC-0000 | System-On-Chip (SOC) Technologies Inc. |
Min: 1 Mult: 1 |
/image/System-On-Chip (SOC) Technologies Inc. | * | Box | Active | DC-VA-H264 | download | 1962-DC-VA-H264-10B-60-1080-OPVXC-0000 | 1 | ||||||||||||||
|
Digi CC-WMX-FR6D-NN | Digi |
Min: 1 Mult: 1 |
/image/Digi | ConnectCore® 8M | Bulk | Active | -40°C ~ 85°C | 1.770" L x 1.570" W (45.00mm x 40.00mm) | 602-CC-WMX-FR6D-NN | 50 | ARM® Cortex®-A53 | 600MHz, 1.4GHz | 512MB | - | MCU Core | ARM® Cortex®-M7 | USB | |||||||
|
Digi CC-WMX-FS7D-NN | Digi |
Min: 1 Mult: 1 |
/image/Digi | ConnectCore® 8M | Bulk | Active | -40°C ~ 85°C | 1.770" L x 1.570" W (45.00mm x 40.00mm) | 602-CC-WMX-FS7D-NN | 50 | ARM® Cortex®-A53 | 600MHz, 1.4GHz | 1GB | - | MCU Core | ARM® Cortex®-M7 | USB | |||||||
|
Trenz Electronic GmbH 0820-05-2BI21MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-2BI21MA | 1 | ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784I | Pin(s) | ||||||
|
Trenz Electronic GmbH 0820-05-4AE21MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-4AE21MA | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E | Pin(s) | ||||||
|
Trenz Electronic GmbH 0820-05-3BE21MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-3BE21MA | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E | Pin(s) | ||||||
|
Trenz Electronic GmbH 0820-05-3AE21MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-3AE21MA | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E | Pin(s) | ||||||
|
Trenz Electronic GmbH 0820-05-S002C1 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Bulk | Active | download | 1686-TE0820-05-S002C1 | 1 | |||||||||||||||
| MYIR Tech Limited MYC-C8MMQ6-V2-8E2D-180-C | MYIR Tech Limited |
Min: 1 Mult: 1 |
/image/MYIR Tech Limited | - | Book | Active | 0°C ~ 70°C | 2.360" L x 1.930" W (60.00mm x 49.00mm) | Vendor Undefined | 3309-MYC-C8MMQ6-V2-8E2D-180-C | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A53, ARM® Cortex®-M4 | 400MHz, 1.8GHz | 3GB | 8GB | MPU Core | ARM® Cortex®-M4F | Board-to-Board (BTB) Socket | |||||
| MYIR Tech Limited MYC-JX8MPQ-8E3D-160-I | MYIR Tech Limited |
Min: 1 Mult: 1 |
/image/MYIR Tech Limited | - | Book | Active | -40°C ~ 85°C | 3.230" L x 1.770" W (82.00mm x 45.00mm) | Vendor Undefined | 3309-MYC-JX8MPQ-8E3D-160-I | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A53, ARM® Cortex®-M7 | 800MHz, 1.6GHz | 3GB | 8GB | MPU Core | - | Card Edge | |||||
| MYIR Tech Limited MYC-JX8MPQ-8E3D-160-C | MYIR Tech Limited |
Min: 1 Mult: 1 |
/image/MYIR Tech Limited | - | Book | Active | 0°C ~ 70°C | 3.230" L x 1.770" W (82.00mm x 45.00mm) | Vendor Undefined | 3309-MYC-JX8MPQ-8E3D-160-C | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A53, ARM® Cortex®-M7 | 800MHz, 1.6GHz | 3GB | 8GB | MPU Core | - | Card Edge | |||||
| MYIR Tech Limited MYC-J1028N-8E2D-150-I | MYIR Tech Limited |
Min: 1 Mult: 1 |
/image/MYIR Tech Limited | - | Book | Active | -40°C ~ 85°C | 3.230" L x 1.770" W (82.00mm x 45.00mm) | Vendor Undefined | 3309-MYC-J1028N-8E2D-150-I | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A72 | 1.5GHz | 2GB | 8GB | MPU Core | - | Card Edge | |||||
|
Digi 20-101-1142 | Digi |
Min: 1 Mult: 1 |
/image/Digi | - | Bulk | Obsolete | -20°C ~ 85°C | 1.850" L x 2.840" W (47.00mm x 72.00mm) | 602-20-101-1142 | OBSOLETE | 1 | Rabbit 4000 | 58.98MHz | 512KB | 4MB | MPU Core | - | Header | ||||||
|
Digi 20-109-0198 | Digi |
Min: 1 Mult: 1 |
/image/Digi | RabbitCore® | Bulk | Obsolete | -40°C ~ 70°C | 3.860" L x 2.010" W (98.00mm x 51.00mm) | REACH Unaffected | 602-20-109-0198 | OBSOLETE | 1 | Rabbit 2000 | 22.1MHz | 512KB | 512KB | MPU Core | - | Header |
