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ALLCHIPS ELECTRONICS LIMITED

Microsemi Corporation M2S090-1FG676IX417

M2S090-1FG676IX417


  • Manufacturer: Microsemi Corporation
  • Origchip NO: M2S090-1FG676IX417
  • Package: 676-BGA
  • Datasheet: pdfPDF
  • Stock: 6238
  • Description: M2S090-1FG676IX417(Kg)

Quantity:

In Stock

Please send RFQ , we will respond immediately.

Purchase & Inquiry

Transport

Purchase

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We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.

SPECIFICATIONS

Parameters
Mfr Microsemi Corporation
Series SmartFusion®2
Package Bag
Product Status Obsolete
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 512KB
RAM Size 64KB
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed 166MHz
Primary Attributes FPGA - 90K Logic Modules
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Number of I/O 425
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 1
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 90K Logic Modules 166MHz 676-FBGA (27x27)

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In Stock

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