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ALLCHIPS ELECTRONICS LIMITED

AMD XCVM1802-1LSEVSVA2197

XCVM1802-1LSEVSVA2197


  • Manufacturer: AMD
  • Origchip NO: XCVM1802-1LSEVSVA2197
  • Package: 2197-BFBGA, FCBGA
  • Datasheet: pdfPDF
  • Stock: 5126
  • Description: XCVM1802-1LSEVSVA2197(Kg)

Quantity:

In Stock

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.

SPECIFICATIONS

Parameters
Mfr AMD
Series Versal™ Prime
Package Tray
Product Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ Prime FPGA, 1.9M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)
Number of I/O 770
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Other Names 122-XCVM1802-1LSEVSVA2197
Standard Package 1
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ Prime Versal™ Prime FPGA, 1.9M Logic Cells 400MHz, 1GHz 2197-FCBGA (45x45)

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