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ALLCHIPS ELECTRONICS LIMITED

NXP USA Inc. LS101MAXE7DFA

LS101MAXE7DFA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: LS101MAXE7DFA
  • Package: 448-FBGA Exposed Pad
  • Datasheet: -
  • Stock: 9027
  • Description: LS101MAXE7DFA(Kg)

Quantity:

In Stock

Please send RFQ , we will respond immediately.

Purchase & Inquiry

Transport

Purchase

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We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.

SPECIFICATIONS

Parameters
Mfr NXP USA Inc.
Series QorlQ LS1
Package Tray
Product Status Obsolete
Core Processor ARM1136JF-S
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 650MHz
Co-Processors/DSP -
RAM Controllers DDR2
Graphics Acceleration No
Display & Interface Controllers -
Ethernet GbE (2)
SATA -
USB USB 2.0 + PHY (1)
Operating Temperature -40°C ~ 85°C (TA)
Security Features -
Mounting Type Surface Mount
Package / Case 448-FBGA Exposed Pad
Supplier Device Package 448-PBGA w/Heat Spreader (23x23)
Additional Interfaces I²C, PCIe, PCM/TDM, SPI, UART
Base Product Number LS101
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A002A1
HTSUS 8542.31.0001
Other Names 935322191557
Standard Package 60
ARM1136JF-S Microprocessor IC QorlQ LS1 1 Core, 32-Bit 650MHz 448-PBGA w/Heat Spreader (23x23)

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In Stock

Please send RFQ , we will respond immediately.