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Embedded(154023)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Type | Base Product Number | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Total RAM Bits | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Clock Rate | Non-Volatile Memory | On-Chip RAM | Voltage - Core |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. S912XDT512J1MAAR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Not For New Designs | -40°C ~ 125°C (TA) | Surface Mount | 80-QFP | S912 | 80-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358582528 | 3A991A2 | 8542.31.0001 | 750 | 59 | HCS12X | 16-Bit | 80MHz | CANbus, I²C, SCI, SPI | LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 20K x 8 | 3.15V ~ 5.5V | A/D 8x12b | External | |||||||||||||||||||||||
| NXP USA Inc. S912ZVLA96F0MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | S912 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358142557 | 3A991A2 | 8542.31.0001 | 1,250 | 34 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 10x10b; D/A 1x8b | Internal | |||||||||||||||||||||||
| NXP USA Inc. S9S12G48BCLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | S9S12 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 26 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | 1.5K x 8 | 4K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | ||||||||||||||||||||||||
| NXP USA Inc. SP5745BBK1AMMH6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LFBGA | SP5745 | 100-MAPBGA (11x11) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358561518 | 5A992C | 8542.31.0001 | 1,500 | e200z4 | 32-Bit Single-Core | 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 2MB (2M x 8) | FLASH | 64K x 8 | 256K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | |||||||||||||||||||||||||
| NXP USA Inc. SPC5602BACLQ4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | SPC5602 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358034557 | 3A991A2 | 8542.31.0001 | 60 | 123 | e200z0h | 32-Bit Single-Core | 48MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 64K x 8 | 24K x 8 | 3V ~ 5.5V | A/D 36x10b | Internal | ||||||||||||||||||||||||
| NXP USA Inc. SPC5604BAMLQ6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 144-LQFP | SPC5604 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358035557 | 3A991A2 | 8542.31.0001 | 60 | 123 | e200z0h | 32-Bit Single-Core | 64MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 64K x 8 | 32K x 8 | 3V ~ 5.5V | A/D 36x10b | Internal | ||||||||||||||||||||||||
| NXP USA Inc. SPC5745BBK1ACMH2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LFBGA | SPC5745 | 100-MAPBGA (11x11) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358699557 | 5A992C | 8542.31.0001 | 880 | e200z4 | 32-Bit Single-Core | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 2MB (2M x 8) | FLASH | 64K x 8 | 256K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | ||||||||||||||||||||||||
| NXP USA Inc. SPC5745BK1VMH2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LFBGA | SPC5745 | 100-MAPBGA (11x11) | download | ROHS3 Compliant | REACH Unaffected | 935353624557 | 5A992C | 8542.31.0001 | 880 | e200z4 | 32-Bit Single-Core | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 2MB (2M x 8) | FLASH | 64K x 8 | 256K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | |||||||||||||||||||||||||
| NXP USA Inc. SPC5748CK0AMMJ6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 256-LBGA | SPC5748 | 256-MAPPBGA (17x17) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358692518 | 5A992C | 8542.31.0001 | 1,000 | 178 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | ||||||||||||||||||||||||
| Infineon Technologies CY8C4248LQI-BL483T | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | PSOC® 4 CY8C4xx8 BLE | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 56-UFQFN Exposed Pad | CY8C4248 | 56-QFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 2832-CY8C4248LQI-BL483TTR | 5A002A1 | 8542.31.0001 | 2,000 | 36 | ARM® Cortex®-M0 | 32-Bit Single-Core | 48MHz | I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 1.71V ~ 5.5V | A/D 16x12b SAR; D/A 2xIDAC | Internal | |||||||||||||||||||||||
 |
Analog Devices Inc./Maxim Integrated MAX32625IWYL+T | Analog Devices Inc./Maxim Integrated |
Min: 1 Mult: 1 |
/image/Analog Devices Inc./Maxim Integrated | DARWIN | Tape & Reel (TR) | Active | -30°C ~ 85°C (TA) | Surface Mount | 63-WFBGA, WLBGA | MAX32625 | 63-WLP (3.07x3.87) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 5A002A1 | 8542.31.0001 | 2,000 | 40 | ARM® Cortex®-M4F | 32-Bit Single-Core | 96MHz | 1-Wire, I²C, SPI, UART/USART, USB | Brown-out Detect/Reset, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 128K x 8 | 1.14V ~ 3.6V | A/D 4x10b | Internal | |||||||||||||||||||||||
|
Toshiba Semiconductor and Storage TMP89FS60FG(Z | Toshiba Semiconductor and Storage |
Min: 1 Mult: 1 |
/image/Toshiba Semiconductor and Storage | TLCS-870/C1 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-BQFP | TMP89 | 64-QFP (14x14) | download | RoHS Compliant | 3 (168 Hours) | EAR99 | 8542.31.0001 | 200 | 56 | TLCS-870 | 8-Bit | 8MHz | I²C, SIO, UART/USART | LED, PWM, WDT | 60KB (60K x 8) | FLASH | - | 3K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | ||||||||||||||||||||||||
|
Toshiba Semiconductor and Storage TMPM330FYFG(B) | Toshiba Semiconductor and Storage |
Min: 1 Mult: 1 |
/image/Toshiba Semiconductor and Storage | TX03 | Tray | Active | -20°C ~ 85°C (TA) | Surface Mount | 100-LQFP | TMPM330 | 100-LQFP (14x14) | download | RoHS Compliant | 3 (168 Hours) | 3A991A2 | 8542.31.0001 | 200 | 78 | ARM® Cortex®-M3 | 32-Bit Single-Core | 40MHz | I²C, SIO, UART/USART | POR, WDT | 256KB (256K x 8) | FLASH | - | 16K x 8 | 2.7V ~ 3.6V | A/D 12x10b | External | ||||||||||||||||||||||||
|
Toshiba Semiconductor and Storage TMPM366FDXBG | Toshiba Semiconductor and Storage |
Min: 1 Mult: 1 |
/image/Toshiba Semiconductor and Storage | TX03 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 109-TFBGA | TMPM366 | 109-TFBGA (9x9) | download | RoHS Compliant | 3 (168 Hours) | 3A991A2 | 8542.31.0001 | 200 | 74 | ARM® Cortex®-M3 | 32-Bit Single-Core | 48MHz | I²C, SIO, UART/USART | DMA, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 2.7V ~ 3.6V | A/D 12x12b | Internal | ||||||||||||||||||||||||
|
Toshiba Semiconductor and Storage TMPM366FYXBG | Toshiba Semiconductor and Storage |
Min: 1 Mult: 1 |
/image/Toshiba Semiconductor and Storage | TX03 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 109-TFBGA | TMPM366 | 109-TFBGA (9x9) | download | RoHS Compliant | 3 (168 Hours) | 3A991A2 | 8542.31.0001 | 200 | 73 | ARM® Cortex®-M3 | 32-Bit Single-Core | 48MHz | I²C, SIO, SPI, UART/USART | DMA, LVD, WDT | 256KB (256K x 8) | FLASH | - | 48K x 8 | 2.7V ~ 3.6V | A/D 12x12b | Internal | ||||||||||||||||||||||||
| NXP USA Inc. MCIMX6L3DVN10AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SL | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 432-TFBGA | MCIMX6 | 432-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 160 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (3) | 1.2V, 1.8V, 3.0V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | ||||||||||||||||||||||||
| NXP USA Inc. MCIMX6L3EVN10AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SL | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 432-TFBGA | MCIMX6 | 432-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360496557 | 5A992C | 8542.31.0001 | 160 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (3) | 1.2V, 1.8V, 3.0V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | |||||||||||||||||||||||
| NXP USA Inc. MCIMX6L8DVN10ACR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SL | Tape & Reel (TR) | Active | 0°C ~ 95°C (TJ) | Surface Mount | 432-TFBGA | MCIMX6 | 432-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935352982518 | 5A992C | 8542.31.0001 | 1,000 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (3) | 1.2V, 1.8V, 3.0V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | |||||||||||||||||||||||
| NXP USA Inc. MCIMX6S5DVM10ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tape & Reel (TR) | Active | 0°C ~ 95°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360456518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||||
| NXP USA Inc. MCIMX6S6AVM08ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | REACH Unaffected | 935352997518 | 5A002A1 | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||
| NXP USA Inc. MCIMX6U1AVM08AD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360458557 | 5A002A1 | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||||
| NXP USA Inc. MCIMX6U1AVM08ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360458518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||||
| NXP USA Inc. MCIMX6U5DVM10ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tape & Reel (TR) | Active | 0°C ~ 95°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||
| NXP USA Inc. MCIMX6U6AVM08ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360347518 | 5A002A1 | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||||
|
NXP USA Inc. MCIMX6X1CVO08AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SX | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 400-LFBGA | MCIMX6 | 400-MAPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935361033557 | 5A992C | 8542.31.0001 | 90 | ARM® Cortex®-A9, ARM® Cortex®-M4 | 200MHz, 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LVDDR3, DDR3 | No | Keypad, LCD | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | AC'97, CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | ||||||||||||||||||||||
| Microchip Technology ATTINY214-SSNR | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | tinyAVR™ 1, Functional Safety (FuSa) | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | ATTINY214 | 14-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 3,000 | 12 | AVR | 8-Bit | 20MHz | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 2KB (2K x 8) | FLASH | 64 x 8 | 128 x 8 | 1.8V ~ 5.5V | A/D 10x10b; D/A 1x8b | Internal | ||||||||||||||||||||||||
| Microchip Technology ATSAMV71Q21B-AAB | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, SAM V71 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | ATSAMV71 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | 114 | ARM® Cortex®-M7 | 32-Bit Single-Core | 300MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 2MB (2M x 8) | FLASH | - | 384K x 8 | 3V ~ 3.6V | A/D 24x12b; D/A 2x12b | Internal | ||||||||||||||||||||||||
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AMD XCVU13P-2FHGA2104E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Virtex® UltraScale+™ | Tray | Active | 0°C ~ 100°C (TJ) | Surface Mount | 2104-BBGA, FCBGA | XCVU13 | Not Verified | 0.825V ~ 0.876V | 2104-FCBGA (52.5x52.5) | download | ROHS3 Compliant | 4 (72 Hours) | 3A001A7B | 8542.39.0001 | 1 | 514867200 | 832 | 216000 | 3780000 | |||||||||||||||||||||||||||||||
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AMD XCVU13P-L2FHGB2104E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Virtex® UltraScale+™ | Tray | Active | 0°C ~ 110°C (TJ) | Surface Mount | 2104-BBGA, FCBGA | XCVU13 | Not Verified | 0.698V ~ 0.876V | 2104-FCBGA (52.5x52.5) | download | ROHS3 Compliant | 4 (72 Hours) | 3A001A7B | 8542.39.0001 | 1 | 514867200 | 832 | 216000 | 3780000 | |||||||||||||||||||||||||||||||
| Analog Devices Inc. 21488WBSWZ2A02 | Analog Devices Inc. |
Min: 1 Mult: 1 |
/image/Analog Devices Inc. | Automotive, SHARC® | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 100-LQFP Exposed Pad | Floating Point | AD21488 | 100-LQFP-EP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1 | EBI/EMI, DAI, I²C, SPI, SPORT, UART/USART | 3.30V | 300MHz | External | 3Mbit | 1.10V |
