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Embedded(154023)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Microchip Technology PIC18F25K83-I/SP | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K, Functional Safety (FuSa) | Tube | Active | -40°C ~ 85°C (TA) | Through Hole | 28-DIP (0.300", 7.62mm) | PIC18F25 | 28-SPDIP | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991A2 | 8542.31.0001 | 15 | 25 | PIC | 8-Bit | 64MHz | CANbus, I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 32KB (16K x 16) | FLASH | 1K x 8 | 2K x 8 | 2.3V ~ 5.5V | A/D 24x12b; D/A 1x5b | Internal | |||||||||||||
| Microchip Technology PIC18F26K83-E/ML | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K, Functional Safety (FuSa) | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 28-VQFN Exposed Pad | PIC18F26 | 28-QFN (6x6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 61 | 25 | PIC | 8-Bit | 64MHz | CANbus, I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 64KB (32K x 16) | FLASH | 1K x 8 | 4K x 8 | 2.3V ~ 5.5V | A/D 24x12b; D/A 1x5b | Internal | |||||||||||||
| Microchip Technology PIC18F26K83-E/SO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K, Functional Safety (FuSa) | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | PIC18F26 | 28-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 27 | 25 | PIC | 8-Bit | 64MHz | CANbus, I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 64KB (32K x 16) | FLASH | 1K x 8 | 4K x 8 | 2.3V ~ 5.5V | A/D 24x12b; D/A 1x5b | Internal | |||||||||||||
| Microchip Technology PIC18F26K83-E/SP | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K, Functional Safety (FuSa) | Tube | Active | -40°C ~ 125°C (TA) | Through Hole | 28-DIP (0.300", 7.62mm) | PIC18F26 | 28-SPDIP | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991A2 | 8542.31.0001 | 15 | 25 | PIC | 8-Bit | 64MHz | CANbus, I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 64KB (32K x 16) | FLASH | 1K x 8 | 4K x 8 | 2.3V ~ 5.5V | A/D 24x12b; D/A 1x5b | Internal | |||||||||||||
| Microchip Technology PIC18F26K83-E/SS | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K, Functional Safety (FuSa) | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | PIC18F26 | 28-SSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 47 | 25 | PIC | 8-Bit | 64MHz | CANbus, I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 64KB (32K x 16) | FLASH | 1K x 8 | 4K x 8 | 2.3V ~ 5.5V | A/D 24x12b; D/A 1x5b | Internal | |||||||||||||
| Microchip Technology PIC18F26K83-I/ML | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K, Functional Safety (FuSa) | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-VQFN Exposed Pad | PIC18F26 | 28-QFN (6x6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 61 | 25 | PIC | 8-Bit | 64MHz | CANbus, I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 64KB (32K x 16) | FLASH | 1K x 8 | 4K x 8 | 2.3V ~ 5.5V | A/D 24x12b; D/A 1x5b | Internal | |||||||||||||
| Microchip Technology PIC18F26K83-I/SS | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K, Functional Safety (FuSa) | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | PIC18F26 | 28-SSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 47 | 25 | PIC | 8-Bit | 64MHz | CANbus, I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 64KB (32K x 16) | FLASH | 1K x 8 | 4K x 8 | 2.3V ~ 5.5V | A/D 24x12b; D/A 1x5b | Internal | |||||||||||||
| Microchip Technology PIC18LF25K83-E/SP | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K | Tube | Active | -40°C ~ 125°C (TA) | Through Hole | 28-DIP (0.300", 7.62mm) | PIC18LF25 | 28-SPDIP | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991A2 | 8542.31.0001 | 15 | 25 | PIC | 8-Bit | 64MHz | CANbus, I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 32KB (16K x 16) | FLASH | 1K x 8 | 2K x 8 | 1.8V ~ 3.6V | A/D 24x12b; D/A 1x5b | Internal | |||||||||||||
| Microchip Technology PIC18LF25K83-I/ML | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-VQFN Exposed Pad | PIC18LF25 | 28-QFN (6x6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 61 | 25 | PIC | 8-Bit | 64MHz | CANbus, I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 32KB (16K x 16) | FLASH | 1K x 8 | 2K x 8 | 1.8V ~ 3.6V | A/D 24x12b; D/A 1x5b | Internal | |||||||||||||
| Microchip Technology PIC18LF25K83-I/SP | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K | Tube | Active | -40°C ~ 85°C (TA) | Through Hole | 28-DIP (0.300", 7.62mm) | PIC18LF25 | 28-SPDIP | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991A2 | 8542.31.0001 | 15 | 25 | PIC | 8-Bit | 64MHz | CANbus, I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 32KB (16K x 16) | FLASH | 1K x 8 | 2K x 8 | 1.8V ~ 3.6V | A/D 24x12b; D/A 1x5b | Internal | |||||||||||||
| Microchip Technology PIC18LF26K83-E/SO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | PIC18LF26 | 28-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 27 | 25 | PIC | 8-Bit | 64MHz | CANbus, I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 64KB (32K x 16) | FLASH | 1K x 8 | 4K x 8 | 1.8V ~ 3.6V | A/D 24x12b; D/A 1x5b | Internal | |||||||||||||
| Microchip Technology PIC18LF26K83-I/SO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | PIC18LF26 | 28-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 27 | 25 | PIC | 8-Bit | 64MHz | CANbus, I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 64KB (32K x 16) | FLASH | 1K x 8 | 4K x 8 | 1.8V ~ 3.6V | A/D 24x12b; D/A 1x5b | Internal | |||||||||||||
| Microchip Technology PIC18LF26K83-I/SP | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K | Tube | Active | -40°C ~ 85°C (TA) | Through Hole | 28-DIP (0.300", 7.62mm) | PIC18LF26 | 28-SPDIP | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991A2 | 8542.31.0001 | 15 | 25 | PIC | 8-Bit | 64MHz | CANbus, I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 64KB (32K x 16) | FLASH | 1K x 8 | 4K x 8 | 1.8V ~ 3.6V | A/D 24x12b; D/A 1x5b | Internal | |||||||||||||
| Microchip Technology PIC18LF26K83-I/SS | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | PIC18LF26 | 28-SSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 47 | 25 | PIC | 8-Bit | 64MHz | CANbus, I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 64KB (32K x 16) | FLASH | 1K x 8 | 4K x 8 | 1.8V ~ 3.6V | A/D 24x12b; D/A 1x5b | Internal | |||||||||||||
| NXP USA Inc. LPC844M201JHI33E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC84x | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | LPC844 | 32-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935336503551 | 3A991A2 | 8542.31.0001 | 490 | 29 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 30MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 12x12b | External, Internal | ||||||||||||
| NXP USA Inc. MCIMX6S7CVM08ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935354192518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
| NXP USA Inc. MCIMX6U5DVM10AD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360464557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
| NXP USA Inc. MCIMX6U6AVM10ACR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935332959518 | 5A002A1 | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
| NXP USA Inc. MK22FN512VLL12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MK22FN512 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312058528 | 3A991A2 | 8542.31.0001 | 1,000 | 66 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 33x16b; D/A 2x12b | Internal | ||||||||||||
| NXP USA Inc. MKL26Z128VFT4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL2 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | MKL26Z128 | 48-QFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324624528 | 3A991A2 | 8542.31.0001 | 2,000 | 36 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, UART/USART, USB, USB OTG | Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D - 16bit; D/A - 12bit | Internal | ||||||||||||
| NXP USA Inc. S9S12G128AMLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 40 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 8K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | |||||||||||||
| NXP USA Inc. S9S12G128AMLLR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LQFP | S9S12 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,000 | 86 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 8K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | |||||||||||||
| NXP USA Inc. S9S12G128AVLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935361323528 | 3A991A2 | 8542.31.0001 | 2,000 | 40 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 8K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | ||||||||||||
| NXP USA Inc. S9S12G128AVLHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | S9S12 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935361233528 | 3A991A2 | 8542.31.0001 | 1,500 | 54 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 8K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | ||||||||||||
| NXP USA Inc. S9S12G96ACLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | S9S12 | 64-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935361237557 | 3A991A2 | 8542.31.0001 | 160 | 54 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 3K x 8 | 8K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | |||||||||||||
| NXP USA Inc. S9S12GA128AVLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935361325557 | 3A991A2 | 8542.31.0001 | 250 | 40 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 8K x 8 | 3.13V ~ 5.5V | A/D 12x12b | Internal | |||||||||||||
| NXP USA Inc. S9S12GN48ACLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360917528 | 3A991A2 | 8542.31.0001 | 2,000 | 40 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | 1.5K x 8 | 4K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | |||||||||||||
| NXP USA Inc. SP5744BBK1AMKU6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SP5744 | 176-LQFP (24x24) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360805528 | 5A992C | 8542.31.0001 | 500 | e200z4 | 32-Bit Single-Core | 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | ||||||||||||||
| NXP USA Inc. SP5747CSK0AMKU6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SP5747 | 176-LQFP (24x24) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935362157528 | 5A992C | 8542.31.0001 | 500 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |||||||||||||
| NXP USA Inc. SP5748GSK0AVMJ2R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 256-LBGA | SP5748 | 256-MAPPBGA (17x17) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935362155518 | 5A992C | 8542.31.0001 | 1,000 | 178 | e200z2, e200z4, e200z4 | 32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal |
