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ALLCHIPS ELECTRONICS LIMITED

AMD XCVC1702-1MLINSVG1369

XCVC1702-1MLINSVG1369


  • Manufacturer: AMD
  • Origchip NO: XCVC1702-1MLINSVG1369
  • Package: 1369-BFBGA, FCBGA
  • Datasheet: -
  • Stock: 7086
  • Description: XCVC1702-1MLINSVG1369(Kg)

Quantity:

In Stock

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.

SPECIFICATIONS

Parameters
Mfr AMD
Series Versal™ AI Core
Package Tray
Product Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.3GHz
Primary Attributes Versal™ AI Core FPGA, 1M Logic Cells
Operating Temperature -40°C ~ 110°C (TJ)
Package / Case 1369-BFBGA, FCBGA
Supplier Device Package 1369-FCBGA (35x35)
Number of I/O 500
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Other Names 122-XCVC1702-1MLINSVG1369
Standard Package 1
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ AI Core Versal™ AI Core FPGA, 1M Logic Cells 600MHz, 1.3GHz 1369-FCBGA (35x35)

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In Stock

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