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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Base Product Number | Technology | Voltage - Input | Output Type | Digi-Key Programmable | PLL | Input | Output | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Voltage - Supply | Supplier Device Package | DataSheet | Divider/Multiplier | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Function | Number of Bits | Data Interface | Architecture | Reference Type | Voltage - Supply, Analog | Voltage - Supply, Digital | Number of D/A Converters | Settling Time | Differential Output | INL/DNL (LSB) | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Protocol | Number of Drivers/Receivers | Duplex | Data Rate | Interface | Clock Frequency | Controller Series | Memory Type | Memory Size | Access Time | Memory Format | Memory Organization | Memory Interface | Write Cycle Time - Word, Page | Sensing Method | Accuracy | Current - Output |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Microchip Technology FX-500-EAE-KNNN-C4-JF | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | FX-500 | Bulk | Obsolete | -40°C ~ 85°C | Surface Mount | 6-BESOJ (0.300", 7.62mm) | Frequency Translator | No | - | CMOS | 1 | 1:1 | No/No | 40MHz | 3V ~ 3.6V | 6-SOJ | Yes/No | 150-FX-500-EAE-KNNN-C4-JF | OBSOLETE | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Microchip Technology FX-500-EAE-KNNA-AR-BB | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | FX-500 | Bulk | Obsolete | -40°C ~ 85°C | Surface Mount | 6-BESOJ (0.300", 7.62mm) | Frequency Translator | No | - | CMOS | 1 | 1:1 | No/No | 1MHz | 3V ~ 3.6V | 6-SOJ | Yes/No | 150-FX-500-EAE-KNNA-AR-BB | OBSOLETE | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Microchip Technology 24CS256T-I/SN | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | FLASH - NAND, DRAM - LPDDR | 1.7V ~ 5.5V | 8-SOIC | download | REACH Unaffected | 150-24CS256T-I/SNTR | EAR99 | 8542.32.0051 | 3,300 | 3.4 MHz | Non-Volatile | 256Kbit | 70 ns | EEPROM | 32K x 8 | I²C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Microchip Technology 24CS256T-E/SN | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | FLASH - NAND, DRAM - LPDDR | 1.7V ~ 5.5V | 8-SOIC | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 150-24CS256T-E/SNTR | EAR99 | 8542.32.0051 | 3,300 | 1 MHz | Non-Volatile | 256Kbit | 400 ns | EEPROM | 32K x 8 | I²C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Microchip Technology 24CS256T-E/MS | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | FLASH - NAND, DRAM - LPDDR | 1.7V ~ 5.5V | 8-MSOP | download | REACH Unaffected | 150-24CS256T-E/MSTR | EAR99 | 8542.32.0051 | 2,500 | 1 MHz | Non-Volatile | 256Kbit | 400 ns | EEPROM | 32K x 8 | I²C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology SYA75612TWL-TRVAO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | Clock Buffer | CML, HCSL, LVDS, PECL | HCSL | 1 | 2:12 | Yes/Yes | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | 56-VQFN (8x8) | download | REACH Unaffected | 150-SYA75612TWL-TRVAOTR | 3,000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology CEC1734-S0-I/2HW | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 85°C (TA) | Real Time Platform Root | Surface Mount | 64-VFBGA | Not Verified | 3.135V ~ 3.465V | 64-VFBGA (5.5x5.5) | download | REACH Unaffected | 150-CEC1734-S0-I/2HW | 360 | 52 | ARM® Cortex®-M4F | - | 384K x 8 | I²C, PWM, SMBus, SPI, UART | CEC173X | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology PAC1944T-E/4MXVAO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | PAC1944 | 2.7V ~ 5.5V | 16-VQFN (3x3) | download | REACH Unaffected | 150-PAC1944T-E/4MXVAOTR | EAR99 | 8542.39.0001 | 3,300 | Current Monitor | High-Side | ±1% | 100mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Microchip Technology SY75608TWL-TR | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | Clock Buffer | CML, HCSL, LVDS, PECL | HCSL | 1 | 2:8 | Yes/Yes | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | 48-VQFN (6x6) | download | REACH Unaffected | 150-SY75608TWL-TR | 3,300 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology PAC1954T-E/4MXVAO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | PAC1954 | 2.7V ~ 5.5V | 16-VQFN (3x3) | download | REACH Unaffected | 150-PAC1954T-E/4MXVAOTR | EAR99 | 8542.39.0001 | 3,300 | Current Monitor | High-Side | ±1% | 100mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology PAC1953T-E/4MXVAO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | PAC1953 | 2.7V ~ 5.5V | 16-VQFN (3x3) | download | REACH Unaffected | 150-PAC1953T-E/4MXVAOTR | EAR99 | 8542.39.0001 | 3,300 | Current Monitor | High-Side | ±1% | 100mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology PIC32CX1012BZ25048-I/MYX | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | PIC32CX1012 | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-PIC32CX1012BZ25048-I/MYX | 416 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Microchip Technology SYA75608TWLVAO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 48-VFQFN Exposed Pad | Clock Buffer | CML, HCSL, LVDS, PECL | HCSL | 1 | 2:8 | Yes/Yes | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | 48-VQFN (6x6) | download | REACH Unaffected | 150-SYA75608TWLVAO | 490 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology PAC1951T-1E/4MXVAO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | PAC1951 | 2.7V ~ 5.5V | 16-VQFN (3x3) | download | REACH Unaffected | 150-PAC1951T-1E/4MXVAOTR | EAR99 | 8542.39.0001 | 3,300 | Current Monitor | High-Side | ±1% | 100mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology PAC1941T-2E/4MXVAO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | PAC1941 | 2.7V ~ 5.5V | 16-VQFN (3x3) | download | REACH Unaffected | 150-PAC1941T-2E/4MXVAOTR | EAR99 | 8542.39.0001 | 3,300 | Current Monitor | Low-Side | ±1% | 100mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology PAC1942T-1E/4MXVAO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | PAC1942 | 2.7V ~ 5.5V | 16-VQFN (3x3) | download | REACH Unaffected | 150-PAC1942T-1E/4MXVAOTR | EAR99 | 8542.39.0001 | 3,300 | Current Monitor | High-Side | ±1% | 100mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology LAN8841T/Q2A | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | 0°C ~ 70°C | Surface Mount | 64-VFQFN Exposed Pad | Transceiver | 1.067V ~ 1.21V, 2.375V ~ 2.75V, 3.135V ~ 3.63V | 64-VQFN (8x8) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 1,000 | Ethernet | 8/8 | Full, Half | 10Mbps, 100Mbps, 1Gbps | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Microchip Technology MCP47CMD11T-E/MF | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | MCP | Tape & Reel (TR) | Active | -40°C ~ 125°C | Surface Mount | 10-VFDFN Exposed Pad | Voltage - Buffered | Not Verified | 10-DFN (3x3) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 3,300 | 10 | I²C | String DAC | External, Internal, Supply | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 1 | 4µs | No | ±0.25 (Max), ±0.25 (Max) | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Microchip Technology MCP47CMD12T-E/MG | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | MCP | Tape & Reel (TR) | Active | -40°C ~ 125°C | Surface Mount | 16-VFQFN Exposed Pad | Voltage - Buffered | Not Verified | 16-QFN (3x3) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 3,300 | 10 | I²C | String DAC | External, Internal, Supply | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 2 | 4µs | No | ±0.25 (Max), ±0.25 (Max) | ||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology MCP48CVD21-E/UN | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | MCP | Tube | Active | -40°C ~ 125°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | Voltage - Buffered | Not Verified | 10-MSOP | download | ROHS3 Compliant | 2 (1 Year) | REACH Unaffected | 150-MCP48CVD21-E/UN | EAR99 | 8542.39.0001 | 100 | 12 | SPI | String DAC | External, Internal, Supply | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 1 | 4µs | No | ±1 (Max), ±1 (Max) | ||||||||||||||||||||||||||||||||||||||||||||||||
| Microchip Technology MCP47CVD11-E/MF | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | MCP | Tube | Active | -40°C ~ 125°C | Surface Mount | 10-VFDFN Exposed Pad | Voltage - Buffered | Not Verified | 10-DFN (3x3) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 150-MCP47CVD11-E/MF | EAR99 | 8542.39.0001 | 120 | 10 | I²C | String DAC | External, Internal, Supply | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 1 | 4µs | No | ±0.25 (Max), ±0.25 (Max) | |||||||||||||||||||||||||||||||||||||||||||||||||
| Microchip Technology MCP47CVD21-E/MG | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | MCP | Tube | Active | -40°C ~ 125°C | Surface Mount | 16-VFQFN Exposed Pad | Voltage - Buffered | Not Verified | 16-QFN (3x3) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-MCP47CVD21-E/MG | EAR99 | 8542.39.0001 | 120 | 12 | I²C | String DAC | External, Internal, Supply | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 1 | 4µs | No | ±1 (Max), ±1 (Max) | |||||||||||||||||||||||||||||||||||||||||||||||||
| Microchip Technology MCP47CMD22T-E/MG | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | MCP | Tape & Reel (TR) | Active | -40°C ~ 125°C | Surface Mount | 16-VFQFN Exposed Pad | Voltage - Buffered | Not Verified | 16-QFN (3x3) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 3,300 | 12 | I²C | String DAC | External, Internal, Supply | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 2 | 4µs | No | ±1 (Max), ±1 (Max) | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Microchip Technology MCP48CMD02-E/MG | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | MCP | Tube | Active | -40°C ~ 125°C | Surface Mount | 16-VFQFN Exposed Pad | Voltage - Buffered | Not Verified | 16-QFN (3x3) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-MCP48CMD02-E/MG | EAR99 | 8542.39.0001 | 120 | 8 | SPI | String DAC | External, Internal, Supply | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 2 | 4µs | No | ±0.1 (Max), ±0.1 (Max) | |||||||||||||||||||||||||||||||||||||||||||||||||
| Microchip Technology PIC32MK0128MCA028-E/N2X | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, PIC® 32MK | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | PIC32MK0128 | 28-SSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-PIC32MK0128MCA028-E/N2X | 3A991A2 | 8542.31.0001 | 47 | 20 | MIPS32® microAptiv™ | 32-Bit | 80MHz | I²C, IrDA, LINbus, PMP, SPI, UART/USART | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 16K x 8 | 32K x 8 | 2.3V ~ 3.6V | A/D 10x12b SAR; D/A 1x12b | External, Internal | |||||||||||||||||||||||||||||||||||||||||||||||
| Microchip Technology MCP48CVD11T-E/MF | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | MCP | Tape & Reel (TR) | Active | -40°C ~ 125°C | Surface Mount | 10-VFDFN Exposed Pad | Voltage - Buffered | Not Verified | 10-DFN (3x3) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 3,300 | 10 | SPI | String DAC | External, Internal, Supply | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 1 | 4µs | No | ±0.25 (Max), ±0.25 (Max) | ||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology MCP47CMD21T-E/UN | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | MCP | Tape & Reel (TR) | Active | -40°C ~ 125°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | Voltage - Buffered | Not Verified | 10-MSOP | download | ROHS3 Compliant | 2 (1 Year) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | 12 | I²C | String DAC | External, Internal, Supply | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 1 | 4µs | No | ±1 (Max), ±1 (Max) | |||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology MCP47CMD11T-E/UN | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | MCP | Tape & Reel (TR) | Active | -40°C ~ 125°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | Voltage - Buffered | Not Verified | 10-MSOP | download | ROHS3 Compliant | 2 (1 Year) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | 10 | I²C | String DAC | External, Internal, Supply | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 1 | 4µs | No | ±0.25 (Max), ±0.25 (Max) | |||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology MCP48CVD01T-E/UN | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | MCP | Tape & Reel (TR) | Active | -40°C ~ 125°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | Voltage - Buffered | Not Verified | 10-MSOP | download | ROHS3 Compliant | 2 (1 Year) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | 8 | SPI | String DAC | External, Internal, Supply | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 1 | 4µs | No | ±0.1 (Max), ±0.1 (Max) | |||||||||||||||||||||||||||||||||||||||||||||||||
| Microchip Technology MCP47CVD21-E/MF | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | MCP | Tube | Active | -40°C ~ 125°C | Surface Mount | 10-VFDFN Exposed Pad | Voltage - Buffered | Not Verified | 10-DFN (3x3) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 150-MCP47CVD21-E/MF | EAR99 | 8542.39.0001 | 120 | 12 | I²C | String DAC | External, Internal, Supply | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 1 | 4µs | No | ±1 (Max), ±1 (Max) |
