Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Base Product Number | Input Type | Current - Supply | Voltage - Input | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Clock Rate | Non-Volatile Memory | On-Chip RAM | Voltage - Core | Channel Type | Driven Configuration | Gate Type | Logic Voltage - VIL, VIH | Current - Peak Output (Source, Sink) | Rise / Fall Time (Typ) |
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NXP USA Inc. SAF4000EL/101S470Y | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | - | - | - | - | SAF4000 | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,000 | - | - | - | - | - | - | |||||||||||||||||||||||||||||||||||||||||
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NXP USA Inc. TEA8918BAT/1J | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | - | - | - | - | TEA8918 | - | Not Verified | - | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | ||||||||||||||||||||||||||||||||||||||||||
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NXP USA Inc. MC33FS8430G2ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Active | MC33FS8430 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. S9KEAZN64AVLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | S9KEAZN64 | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 2,000 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | ||||||||||||||||||||||||||||||||||||
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NXP USA Inc. SPC5745BK1AMKU6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5745 | 176-LQFP (24x24) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 500 | 129 | e200z4 | 32-Bit Single-Core | 160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 2MB (2M x 8) | FLASH | 64K x 8 | 256K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | |||||||||||||||||||||||||||||||||||
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NXP USA Inc. SPC5746BSK1AVKU2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5746 | 176-LQFP (24x24) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 200 | 129 | e200z4 | 32-Bit Single-Core | 160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | |||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5744CFK1ACMH2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LFBGA | SPC5744 | 100-MAPBGA (11x11) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 880 | 65 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | ||||||||||||||||||||||||||||||||||||
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NXP USA Inc. T4081NSN7NQB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ T4 | Tray | Active | 0°C ~ 105°C (TA) | Surface Mount | 1932-BBGA, FCBGA | T4081 | 1932-FCPBGA (45x45) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 12 | PowerPC e6500 | 1.3GHz | 8 Core, 64-Bit | - | DDR3, DDR3L | No | - | 1Gbps (13), 10Gbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.8V, 2.5V | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | I²C, MMC/SD, PCIe, RapidIO, SPI, UART | |||||||||||||||||||||||||||||||||
NXP USA Inc. MKM33Z64ACLH5R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KM | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | MKM33Z64 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,500 | 38 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | DMA, LCD, WDT | 64KB (64K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 6x16b, 24b SAR, Sigma; D/A 4x6b | Internal | |||||||||||||||||||||||||||||||||||
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NXP USA Inc. SAF4000EL/101S23BK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | - | - | - | - | SAF4000 | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 630 | - | - | - | - | - | - | |||||||||||||||||||||||||||||||||||||||||
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NXP USA Inc. SAF4000EL/101S470K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | - | - | - | - | SAF4000 | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 630 | - | - | - | - | - | - | |||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. FS32K146HRT0MLHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP | FS32K146 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 1,500 | 58 | ARM® Cortex®-M4F | 32-Bit Single-Core | 80MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | POR, PWM, WDT | 1MB (1M x 8) | FLASH | 4K x 8 | 128K x 8 | 2.7V ~ 5.5V | A/D 24x12b SAR; D/A1x8b | Internal | |||||||||||||||||||||||||||||||||
NXP USA Inc. TEA1999TS/2Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | GreenChip™ | Tape & Reel (TR) | Active | -40°C ~ 150°C (TJ) | Active/Synchronous Rectification Controller | Surface Mount | SC-74, SOT-457 | TEA1999 | 250 µA | - | Not Verified | 0V ~ 21V | SC-74 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 3,000 | |||||||||||||||||||||||||||||||||||||||||
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NXP USA Inc. SAF4000EL/101S23AY | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | - | - | - | - | SAF4000 | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,000 | - | - | - | - | - | - | |||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. S9S12GN16BMTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | S9S12 | 20-TSSOP | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 2,250 | 14 | CPU12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 512 x 8 | 1K x 8 | 3.13V ~ 5.5V | A/D 8x10b | Internal | ||||||||||||||||||||||||||||||||||||
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NXP USA Inc. SAF775DHV/N208Q/DK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | - | - | - | - | SAF775 | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 200 | - | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||
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NXP USA Inc. PCA9440HE-Q100Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Obsolete | - | Surface Mount | 180-VFBGA | PCA9440 | - | Not Verified | - | 180-VFBGA (8x8) | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 1,500 | - | - | - | - | - | - | |||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC33PF8200DMES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8200 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | |||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08PL32CLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | MC9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 30 | S08 | 8-Bit | 20MHz | LINbus, SCI, UART/USART | LVD, POR, PWM | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | |||||||||||||||||||||||||||||||||
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NXP USA Inc. SPC5741PK1AMMM5R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 257-LFBGA | SPC5741 | 257-LFBGA (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,000 | e200z4 | 32-Bit Dual-Core | 150MHz | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | DMA, LVD, POR, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 3.15V ~ 5.5V | A/D 64x12b | Internal | ||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5744CFK1ACMH6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LFBGA | SPC5744 | 100-MAPBGA (11x11) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 880 | 65 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | ||||||||||||||||||||||||||||||||||||
NXP USA Inc. FS32K142HFT0VLLT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | FS32K142 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 450 | 89 | ARM® Cortex®-M4F | 32-Bit Single-Core | 80MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 32K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR; D/A1x8b | Internal | |||||||||||||||||||||||||||||||||
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NXP USA Inc. S9S12P64J0MFTR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-TFQFN Exposed Pad | S9S12 | 48-QFN-EP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 2,000 | 34 | CPU12V1 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 4K x 8 | 4K x 8 | 3.15V ~ 5.5V | A/D 10x12b | Internal | ||||||||||||||||||||||||||||||||||
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NXP USA Inc. SAF4000EL/101S233Y | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | - | - | - | - | SAF4000 | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,000 | - | - | - | - | - | - | |||||||||||||||||||||||||||||||||||||||||
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NXP USA Inc. SPC5748CK0AMKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5748 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 200 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3.15V ~ 5.5V | A/D 48x10b, 16x12b | Internal | ||||||||||||||||||||||||||||||||||
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NXP USA Inc. LS1017ASE7KQA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ® Layerscape | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 448-BFBGA | LS1017 | 448-FBGA (17x17) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 90 | ARM® Cortex®-A72 | 1GHz | 1 Core, 64-Bit | - | DDR3L SDRAM, DDR4 SDRAM | - | - | 1Gbps (1), 2.5Gbps (5) | SATA 6Gbps (1) | - | - | - | CANbus, I²C, SPI, UART | |||||||||||||||||||||||||||||||||||
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NXP USA Inc. SPC5744CBK1ACKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5744 | 176-LQFP (24x24) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 200 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | |||||||||||||||||||||||||||||||||||
NXP USA Inc. MIMX8UX5AVLFZAC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | - | - | MIMX8UX5 | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 60 | - | - | - | - | - | - | - | - | - | - | - | - | - | |||||||||||||||||||||||||||||||||||||
NXP USA Inc. S9KEAZ64AVLHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | S9KEAZ64 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,500 | 58 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | CANbus, I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR | Internal | |||||||||||||||||||||||||||||||||||
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NXP USA Inc. SPC5748CSK0AMKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5748 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 200 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3.15V ~ 5.5V | A/D 48x10b, 16x12b | Internal |
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