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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Features | Base Product Number | Input Type | Output Type | Digi-Key Programmable | Ratio - Input:Output | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Protocol | Number of Drivers/Receivers | Duplex | Data Rate | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Number of Outputs | Controller Series | Fault Protection | Output Configuration | Rds On (Typ) | Voltage - Load | Switch Type | Current - Output (Max) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MC10XS6325EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Status Flag | MC10XS6325 | - | - | - | 32-HSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 42 | 4.5V ~ 5.5V | SPI | 3 | Open Load Detect, Over Temperature | High Side | 10mOhm, 25mOhm | 7V ~ 18V | General Purpose | 3.8A, 9A | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX535DVV2C2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX53 | Tray | Obsolete | -20°C ~ 85°C (TC) | Surface Mount | 529-FBGA | MCIMX535 | 529-FBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323583557 | 5A992C | 8542.31.0001 | 420 | ARM® Cortex®-A8 | 1.2GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR2, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2), USB 2.0 + PHY (2) | 1.3V, 1.8V, 2.775V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 1-Wire, AC'97, CAN, I²C, I²S, MMC/SD, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK21FX512AVMC12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK21FX512 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 348 | 81 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK22FN1M0AVLH12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MK22FN1M0 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 40 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 22x16b; D/A 1x12b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK22FN1M0AVLK12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK22FN1M0 | 80-FQFP (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323834557 | 3A991A2 | 8542.31.0001 | 96 | 56 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 27x16b; D/A 1x12b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK22FN1M0AVLL12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MK22FN1M0 | 100-LQFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 66 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 33x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK22FN1M0AVLQ12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK22FN1M0 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324971557 | 3A991A2 | 8542.31.0001 | 60 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK22FN1M0AVMC12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK22FN1M0 | 121-MAPBGA (8x8) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 348 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 38x16b; D/A 2x12b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK22FN1M0AVMD12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | MK22FN1M0 | 144-MAPBGA (13x13) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320723557 | 3A991A2 | 8542.31.0001 | 160 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK22FX512AVLH12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MK22FX512 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312548557 | 3A991A2 | 8542.31.0001 | 160 | 40 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 22x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK22FX512AVLL12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MK22FX512 | 100-LQFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 66 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 33x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MKE02Z32VFM4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | MKE02Z32 | 32-HVQFN (5x5) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322222557 | 3A991A2 | 8542.31.0001 | 490 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MKE02Z64VFM4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | MKE02Z64 | 32-HVQFN (5x5) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 490 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 64KB (64K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MM912KS812AMAF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 125°C | Engine Control | Surface Mount | 100-LQFP Exposed Pad | MM912 | Not Verified | 4.7V ~ 36V | 100-LQFP-EP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 6 | S12XS | FLASH (256kB) | 12K x 8 | CAN, SCI, SPI | HCS12 | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC08XS6421EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Slew Rate Controlled | MC08XS6421 | - | N-Channel | 1:1 | 32-HSOP | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 42 | 4.5V ~ 5.5V | SPI | 4 | Current Limiting (Fixed), Open Load Detect, Over Temperature | High Side | 8mOhm, 21mOhm | 7V ~ 18V | General Purpose | 5.5A, 11A | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC17XS6400EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Slew Rate Controlled | MC17XS6400 | - | N-Channel | 1:1 | 32-HSOP | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 42 | 4.5V ~ 5.5V | SPI | 4 | Current Limiting (Fixed), Open Load Detect, Over Temperature | High Side | 17mOhm | 7V ~ 18V | General Purpose | 5.5A | ||||||||||||||||||||||||||||||||||||||
 |
NXP USA Inc. B4420NSE7QQMD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ Qonverge B | Box | Active | 0°C ~ 105°C (TA) | Surface Mount | 1020-BBGA, FCBGA | B4420 | 1020-FCPBGA (33x33) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323499557 | 5A002A1 | 8542.31.0001 | 24 | PowerPC e6500 | 1.6GHz | 2 Core, 64-Bit | Signal Processing; SC3900FP FVP - Dual | DDR3, DDR3L | No | - | 1/2.5Gbps (4) | - | USB 2.0 (1) | 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V | AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC | I²C, MMC/SD, SPI, UART | ||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. B4860NXE7QUMD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ Qonverge B | Box | Active | -40°C ~ 105°C (TA) | Surface Mount | 1020-BBGA, FCBGA | B4860 | 1020-FCPBGA (33x33) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315373557 | 5A002A1 | 8542.31.0001 | 24 | PowerPC e6500 | 1.8GHz | 4 Core, 64-Bit | Signal Processing; SC3900FP FVP - 6 Core | DDR3, DDR3L | No | - | 1/2.5Gbps (4), 1/2.5/10Gbps (2) | - | USB 2.0 (1) | 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V | AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC | I²C, MMC/SD, RapidIO, SPI, UART | |||||||||||||||||||||||||||||||||||
|
NXP USA Inc. B4860NXN7QUMD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ Qonverge B | Box | Active | -40°C ~ 105°C (TA) | Surface Mount | 1020-BBGA, FCBGA | B4860 | 1020-FCPBGA (33x33) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.31.0001 | 24 | PowerPC e6500 | 1.8GHz | 4 Core, 64-Bit | Signal Processing; SC3900FP FVP - 6 Core | DDR3, DDR3L | No | - | 1/2.5Gbps (4), 1/2.5/10Gbps (2) | - | USB 2.0 (1) | 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V | AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC | I²C, MMC/SD, RapidIO, SPI, UART | ||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. LS101MASE7EHA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorlQ LS1 | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 448-FBGA Exposed Pad | LS101 | 448-PBGA w/Heat Spreader (23x23) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318085557 | 5A002A1 | 8542.31.0001 | 60 | ARM1136JF-S | 650MHz | 1 Core, 32-Bit | - | DDR2 | No | - | GbE (2) | - | USB 2.0 + PHY (1) | - | I²C, PCIe, PCM/TDM, SPI, UART | |||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. LS101MAXE7DFA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorlQ LS1 | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 448-FBGA Exposed Pad | LS101 | 448-PBGA w/Heat Spreader (23x23) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322191557 | 5A002A1 | 8542.31.0001 | 60 | ARM1136JF-S | 650MHz | 1 Core, 32-Bit | - | DDR2 | No | - | GbE (2) | - | USB 2.0 + PHY (1) | - | I²C, PCIe, PCM/TDM, SPI, UART | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LS1024ASE7ELA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ® Layerscape | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 625-BFBGA, FCBGA | LS1024 | 625-FCPBGA (21x21) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315625557 | 5A002A1 | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.2GHz | 2 Core, 32-Bit | - | DDR3 | - | - | GbE (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1), USB 3.0 + PHY | - | Secure Boot, TrustZone® | - | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LS1024ASE7JLA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ® Layerscape | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 625-BFBGA, FCBGA | LS1024 | 625-FCPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.2GHz | 2 Core, 32-Bit | - | DDR3 | - | - | GbE (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1), USB 3.0 + PHY | - | Secure Boot, TrustZone® | - | |||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. LS102MASE7EHA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorlQ LS1 | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 448-FBGA Exposed Pad | LS102 | 448-PBGA w/Heat Spreader (23x23) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315654557 | 5A002A1 | 8542.31.0001 | 60 | ARM1136JF-S | 650MHz | 2 Core, 32-Bit | - | DDR2 | No | - | GbE (2) | - | USB 2.0 + PHY (1) | - | I²C, PCIe, PCM/TDM, SPI, UART | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC10XS6225EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Status Flag | MC10XS6225 | - | - | - | 32-HSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934070655518 | EAR99 | 8542.39.0001 | 1,000 | 4.5V ~ 5.5V | SPI | 2 | Open Load Detect, Over Temperature | High Side | 10mOhm, 25mOhm | 7V ~ 18V | General Purpose | 3.8A, 9A | ||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC10XSD200BFKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 23-PowerQFN | - | MC10XSD200 | - | - | - | 23-PQFN (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 1,200 | 3V ~ 5.5V | SPI | 2 | Open Load Detect, Over Temperature, Over Voltage | High Side | 10mOhm | 8V ~ 36V | General Purpose | 6A | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC25XS6300EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Status Flag | MC25XS6300 | - | - | - | 32-HSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934070517518 | EAR99 | 8542.39.0001 | 1,000 | 4.5V ~ 5.5V | SPI | 4 | Open Load Detect, Over Temperature | High Side | 25mOhm | 7V ~ 18V | General Purpose | 3.8A | ||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33901SEFR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | Transceiver | MC339 | 4.5V ~ 5.5V | 8-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323468518 | EAR99 | 8542.39.0001 | 2,500 | CANbus | 1/1 | - | - | |||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33978ESR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | Multiple Switch Detection | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | MC339 | 3V ~ 5.25V | 32-QFN-EP (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 1,000 | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC34901SEFR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | Transceiver | MC349 | 4.5V ~ 5.5V | 8-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315242518 | EAR99 | 8542.39.0001 | 2,500 | CANbus | 1/1 | - | - |
