Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces |
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NXP USA Inc. SPC5777CK2MMO3 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 516-BGA | SPC5777 | 516-MAPBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315708557 | 5A002A1 | 8542.31.0001 | 200 | e200z7 | 32-Bit Tri-Core | 264MHz | EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | DMA, LVD, POR, Zipwire | 8MB (8M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 16b Sigma-Delta, eQADC | Internal | ||||||||||||||||
NXP USA Inc. SPC5744PGK1AMMM9 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 257-LFBGA | SPC5744 | 257-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325066557 | 3A991A2 | 8542.31.0001 | 760 | e200z4 | 32-Bit Dual-Core | 200MHz | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | DMA, LVD, POR, WDT | 2.5MB (2.5M x 8) | FLASH | - | 384K x 8 | 3.15V ~ 5.5V | A/D 64x12b | Internal | ||||||||||||||||
NXP USA Inc. LS1012ASE7HKA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ® Layerscape | Tray | Active | 0°C ~ 105°C | Surface Mount | 211-VFLGA | LS1012 | 211-FCLGA (9.6x9.6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 FRE | 8542.31.0001 | 168 | ARM® Cortex®-A53 | 800MHz | 1 Core, 64-Bit | - | DDR3L | - | - | GbE (2) | SATA 6Gbps (1) | USB 2.0 (1), USB 3.0 + PHY | - | Secure Boot, TrustZone® | - | ||||||||||||||||
NXP USA Inc. LS1012ASN7HKA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ® Layerscape | Tray | Active | 0°C ~ 105°C | Surface Mount | 211-VFLGA | LS1012 | 211-FCLGA (9.6x9.6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 168 | ARM® Cortex®-A53 | 800MHz | 1 Core, 64-Bit | - | DDR3L | - | - | GbE (2) | SATA 6Gbps (1) | USB 2.0 (1), USB 3.0 + PHY | - | Secure Boot, TrustZone® | - | ||||||||||||||||
NXP USA Inc. MC908JK1ECDWER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC08 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | MC908 | 20-SOIC | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319045518 | EAR99 | 8542.31.0001 | 1,000 | 14 | HC08 | 8-Bit | 8MHz | - | LED, LVD, POR, PWM | 1.5KB (1.5K x 8) | FLASH | - | 128 x 8 | 2.7V ~ 3.3V | A/D 12x8b | External | ||||||||||||||||
NXP USA Inc. MC908QB4MDWER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC08 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 125°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | MC908 | 16-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319052518 | EAR99 | 8542.31.0001 | 1,000 | 13 | HC08 | 8-Bit | 8MHz | SCI, SPI | LVD, POR, PWM | 4KB (4K x 8) | FLASH | - | 128 x 8 | 2.7V ~ 5.5V | A/D 10x10b | Internal | |||||||||||||||
NXP USA Inc. MC9S08PA16AVWJR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | MC9S08 | 20-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312285518 | 3A991A2 | 8542.31.0001 | 1,000 | 18 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | |||||||||||||||
NXP USA Inc. MC9S08PA32AVLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MC9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 28 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | ||||||||||||||||
NXP USA Inc. MC9S08SL8MTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | MC9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314461574 | 3A991A2 | 8542.31.0001 | 75 | 16 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | 256 x 8 | 512 x 8 | 2.7V ~ 5.5V | A/D 12x10b | External | |||||||||||||||
NXP USA Inc. MC9S12DT512CPVE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | MC9S12 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321072557 | 3A991A2 | 8542.31.0001 | 300 | 91 | HCS12 | 16-Bit | 25MHz | CANbus, I²C, SCI, SPI | PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 14K x 8 | 2.35V ~ 5.25V | A/D 8x10b | Internal | ||||||||||||||||
NXP USA Inc. MCF51AC128CCFGER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF51AC | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | MCF51 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314719528 | 3A991A2 | 8542.31.0001 | 1,500 | 36 | Coldfire V1 | 32-Bit Single-Core | 50MHz | I²C, SCI, SPI | LVD, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 2.7V ~ 5.5V | A/D 9x12b | External | |||||||||||||||
NXP USA Inc. MCF51AC256BCFGE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF51AC | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | MCF51 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320266557 | 3A991A2 | 8542.31.0001 | 800 | 36 | Coldfire V1 | 32-Bit Single-Core | 50MHz | I²C, SCI, SPI | LVD, PWM, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 2.7V ~ 5.5V | A/D 9x12b | External | |||||||||||||||
NXP USA Inc. MCHC908JW16FC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC08 | Tray | Not For New Designs | 0°C ~ 70°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | MCHC908 | 48-QFN-EP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322687557 | EAR99 | 8542.31.0001 | 260 | 29 | HC08 | 8-Bit | 8MHz | SPI, USB | LED, LVD, POR, PWM | 16KB (16K x 8) | FLASH | - | 1K x 8 | 3.5V ~ 5.5V | - | Internal | ||||||||||||||||
NXP USA Inc. MKL03Z32CBF4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL03 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-XFBGA, WLCSP | MKL03Z32 | 20-WLCSP (2x1.61) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 935325063098 | 3A991A2 | 8542.31.0001 | 5,000 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 3.6V | Internal | |||||||||||||||||
NXP USA Inc. MKL81Z128CBH7R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL8 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-XFBGA, WLCSP | MKL81Z128 | 64-WLCSP (3.48x3.38) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 5A002A1 | 8542.31.0001 | 5,000 | 41 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 72MHz | I²C, SPI, UART/USART, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 96K x 8 | 1.71V ~ 3.6V | A/D 11x16b; D/A 1x6b, 1x12b | Internal | ||||||||||||||||
NXP USA Inc. S711E20E0VFNE2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC11 | Tube | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 52-LCC (J-Lead) | S711E20 | 52-PLCC (19.13x19.13) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317461574 | EAR99 | 8542.31.0001 | 23 | 38 | HC11 | 8-Bit | 2MHz | SCI, SPI | POR, WDT | 20KB (20K x 8) | OTP | 512 x 8 | 768 x 8 | 4.5V ~ 5.5V | A/D 8x8b | Internal | ||||||||||||||||
NXP USA Inc. S711E20E0VFNE2R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC11 | Tape & Reel (TR) | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 52-LCC (J-Lead) | S711E20 | 52-PLCC (19.13x19.13) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317461518 | EAR99 | 8542.31.0001 | 450 | 38 | HC11 | 8-Bit | 2MHz | SCI, SPI | POR, WDT | 20KB (20K x 8) | OTP | 512 x 8 | 768 x 8 | 4.5V ~ 5.5V | A/D 8x8b | Internal | ||||||||||||||||
NXP USA Inc. S912B32E4CFUE8R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC12 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 80-QFP | S912 | 80-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935309891528 | EAR99 | 8542.31.0001 | 750 | 63 | CPU12 | 16-Bit | 8MHz | SCI, SPI | POR, PWM, WDT | 32KB (32K x 8) | FLASH | 768 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x10b | External | ||||||||||||||||
NXP USA Inc. S912DG128H4VPVER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC12 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310537528 | EAR99 | 8542.31.0001 | 500 | 69 | CPU12 | 16-Bit | 8MHz | CANbus, I²C, SCI, SPI | POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 4.5V ~ 5.5V | A/D 16x8/10b | Internal | ||||||||||||||||
NXP USA Inc. S912DG12AE0CPVE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC12 | Bulk | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324454557 | EAR99 | 8542.31.0001 | 300 | 69 | CPU12 | 16-Bit | 8MHz | CANbus, I²C, SCI, SPI | POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 4.5V ~ 5.5V | A/D 16x8/10b | Internal | ||||||||||||||||
NXP USA Inc. S912DG12CE1VPVE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC12 | Bulk | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310718557 | EAR99 | 8542.31.0001 | 300 | 69 | CPU12 | 16-Bit | 8MHz | CANbus, I²C, SCI, SPI | POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 4.5V ~ 5.5V | A/D 16x8/10b | Internal | ||||||||||||||||
NXP USA Inc. S912ZVL64F0CLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | S912 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 19 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 6x10b | Internal | ||||||||||||||||
NXP USA Inc. S912ZVL64F0CLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | S912 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322524528 | 3A991A2 | 8542.31.0001 | 2,000 | 19 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 6x10b | Internal | |||||||||||||||
NXP USA Inc. S912ZVL64F0VLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S912 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316497528 | 3A991A2 | 8542.31.0001 | 2,000 | 34 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 10x10b | Internal | |||||||||||||||
NXP USA Inc. S912ZVL96F0VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S912 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318888557 | 3A991A2 | 8542.31.0001 | 1,250 | 34 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 10x10b | Internal | |||||||||||||||
NXP USA Inc. S912ZVLA12F0MLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | S912 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316407557 | 3A991A2 | 8542.31.0001 | 1,250 | 19 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 6x10b; D/A 1x8b | Internal | |||||||||||||||
NXP USA Inc. S912ZVLA96F0CLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | S912 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320926557 | 3A991A2 | 8542.31.0001 | 1,250 | 19 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 6x10b; D/A 1x8b | Internal | |||||||||||||||
NXP USA Inc. S912ZVLA96F0CLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | S912 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320926528 | 3A991A2 | 8542.31.0001 | 2,000 | 19 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 6x10b; D/A 1x8b | Internal | |||||||||||||||
NXP USA Inc. S9KEAZN64AVLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | S9KEAZN64 | 64-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322484557 | 3A991A2 | 8542.31.0001 | 800 | 57 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | ||||||||||||||||
NXP USA Inc. S9S12DP51J4VPVE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 112-LQFP | S9S12 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316206557 | 3A991A2 | 8542.31.0001 | 300 | 20 | HCS12 | 16-Bit | 25MHz | CANbus, I²C, SCI, SPI | PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 14K x 8 | 2.35V ~ 5.25V | A/D 8x10b | External |
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