Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Features | Base Product Number | Input Type | Voltage - Input | Output Type | Ratio - Input:Output | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Number of Outputs | Fault Protection | Output Configuration | Rds On (Typ) | Voltage - Load | Voltage - Output | Switch Type | Current - Output (Max) |
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NXP USA Inc. MC56F82323VFM | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | MC56F82 | 32-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 490 | 26 | 56800EX | 32-Bit Single-Core | 50MHz | I²C, SCI, SPI | DMA, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 6K x 8 | 2.7V ~ 3.6V | A/D 6x12b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MC56F82348MLHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP | MC56F82 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324747528 | 3A991A2 | 8542.31.0001 | 1,500 | 54 | 56800EX | 32-Bit Single-Core | 50MHz | CANbus, I²C, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 2.7V ~ 3.6V | A/D 16x12b; D/A 2x12b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. MC56F82748MLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP | MC56F82 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 54 | 56800EX | 32-Bit Single-Core | 100MHz | CANbus, I²C, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 2.7V ~ 3.6V | A/D 16x12b; D/A 2x12b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08PA16AVLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MC9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 28 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08PA16AVTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | MC9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 75 | 18 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08PA32AVQH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-QFP | MC9S08 | 64-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 84 | 57 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08PA4AVWJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | MC9S08 | 20-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 38 | 18 | S08 | 8-Bit | 20MHz | LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | 128 x 8 | 512 x 8 | 2.7V ~ 5.5V | A/D 8x12b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08PA8AVLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MC9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 28 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08PA8AVTG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312416574 | 3A991A2 | 8542.31.0001 | 96 | 14 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08PA8AVWJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | MC9S08 | 20-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 38 | 18 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08PT16AVTG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 96 | 14 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MC10XS6325EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Status Flag | MC10XS6325 | - | - | - | 32-HSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 42 | 4.5V ~ 5.5V | SPI | 3 | Open Load Detect, Over Temperature | High Side | 10mOhm, 25mOhm | 7V ~ 18V | General Purpose | 3.8A, 9A | |||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX535DVV2C2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX53 | Tray | Obsolete | -20°C ~ 85°C (TC) | Surface Mount | 529-FBGA | MCIMX535 | 529-FBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323583557 | 5A992C | 8542.31.0001 | 420 | ARM® Cortex®-A8 | 1.2GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR2, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2), USB 2.0 + PHY (2) | 1.3V, 1.8V, 2.775V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 1-Wire, AC'97, CAN, I²C, I²S, MMC/SD, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||
NXP USA Inc. MK21FX512AVMC12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK21FX512 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 348 | 81 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MK22FN1M0AVLH12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MK22FN1M0 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 40 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 22x16b; D/A 1x12b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MK22FN1M0AVLK12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK22FN1M0 | 80-FQFP (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323834557 | 3A991A2 | 8542.31.0001 | 96 | 56 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 27x16b; D/A 1x12b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MK22FN1M0AVLL12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MK22FN1M0 | 100-LQFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 66 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 33x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||||
NXP USA Inc. MK22FN1M0AVLQ12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK22FN1M0 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324971557 | 3A991A2 | 8542.31.0001 | 60 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MK22FN1M0AVMC12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK22FN1M0 | 121-MAPBGA (8x8) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 348 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 38x16b; D/A 2x12b | Internal | ||||||||||||||||||||||||||||||||
NXP USA Inc. MK22FN1M0AVMD12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | MK22FN1M0 | 144-MAPBGA (13x13) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320723557 | 3A991A2 | 8542.31.0001 | 160 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MK22FX512AVLH12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MK22FX512 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312548557 | 3A991A2 | 8542.31.0001 | 160 | 40 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 22x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. MK22FX512AVLL12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MK22FX512 | 100-LQFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 66 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 33x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||||
NXP USA Inc. MKE02Z32VFM4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | MKE02Z32 | 32-HVQFN (5x5) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322222557 | 3A991A2 | 8542.31.0001 | 490 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MKE02Z64VFM4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | MKE02Z64 | 32-HVQFN (5x5) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 490 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 64KB (64K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | ||||||||||||||||||||||||||||||||
NXP USA Inc. MC33908NAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 125°C | Power Supply, Automotive Applications | Surface Mount | 48-LQFP Exposed Pad | MC33908 | -1V ~ 40V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313228528 | EAR99 | 8542.39.0001 | 2,000 | 6 | Multiple | |||||||||||||||||||||||||||||||||||||||
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NXP USA Inc. M83160G13 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Obsolete | M8316 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.31.0001 | 84 | ||||||||||||||||||||||||||||||||||||||||||||||||
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NXP USA Inc. M83159G13 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Obsolete | M8315 | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 935320436557 | 5A002A1 | 8542.31.0001 | 60 | |||||||||||||||||||||||||||||||||||||||||||||||
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NXP USA Inc. M83240G13 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Obsolete | M8324 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.31.0001 | 84 | ||||||||||||||||||||||||||||||||||||||||||||||||
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NXP USA Inc. M83241G13 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Bulk | Obsolete | M8324 | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 935324876557 | 5A002A1 | 8542.31.0001 | 60 | |||||||||||||||||||||||||||||||||||||||||||||||
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NXP USA Inc. M86295G12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Bulk | Obsolete | M86295 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312149557 | 5A002A1 | 8542.31.0001 | 300 |
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