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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Base Product Number | Voltage - Input | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Number of Outputs | Voltage - Output |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MMPF0100F1EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Converter, i.MX6 | Surface Mount | 56-VFQFN Exposed Pad | MMPF0 | 2.8V ~ 4.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | 12 | Multiple | |||||||||||||||||||||||||||||
| NXP USA Inc. S912XDT256F1CAGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315552528 | 3A991A2 | 8542.31.0001 | 500 | 119 | HCS12X | 16-Bit | 80MHz | CANbus, I²C, SCI, SPI | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 16K x 8 | 3.15V ~ 5.5V | A/D 24x12b | External | |||||||||||||||||||
| NXP USA Inc. S912XET256J2VAGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315439528 | 3A991A2 | 8542.31.0001 | 500 | 119 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 16K x 8 | 1.72V ~ 5.5V | A/D 24x12b | External | ||||||||||||||||||||
| NXP USA Inc. S9S08QD4J2MSCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | S9S08 | 8-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 2,500 | 4 | S08 | 8-Bit | 16MHz | - | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 2.7V ~ 5.5V | A/D 4x10b | Internal | ||||||||||||||||||||
| NXP USA Inc. S9S08SG16E1MTGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | S9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314753518 | 3A991A2 | 8542.31.0001 | 2,500 | 12 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||||||||||||||||
| NXP USA Inc. S9S12XS256J0MAAR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 80-QFP | S9S12 | 80-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311459528 | 3A991A2 | 8542.31.0001 | 750 | 59 | HCS12X | 16-Bit | 40MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 12K x 8 | 1.72V ~ 5.5V | A/D 8x12b | External | |||||||||||||||||||
| NXP USA Inc. MC56F84441VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | MC56F84 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324547557 | 3A991A2 | 8542.31.0001 | 250 | 39 | 56800EX | 32-Bit Single-Core | 60MHz | CANbus, I²C, LINbus, SCI, SPI | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 2K x 8 | 8K x 8 | 3V ~ 3.6V | A/D 10x10b | Internal | ||||||||||||||||||||
| NXP USA Inc. MC56F84451VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | MC56F84 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 39 | 56800EX | 32-Bit Single-Core | 60MHz | CANbus, I²C, LINbus, SCI, SPI | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 2K x 8 | 16K x 8 | 3V ~ 3.6V | A/D 10x10b | Internal | |||||||||||||||||||||
| NXP USA Inc. MCIMX6D6AVT08AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6D | Tray | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317648557 | 5A992C | 8542.31.0001 | 300 | ARM® Cortex®-A9 | 852MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||
| NXP USA Inc. MCIMX6L2EVN10AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SL | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 432-TFBGA | MCIMX6 | 432-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 320 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (3) | 1.2V, 1.8V, 3.0V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | ||||||||||||||||||||
| NXP USA Inc. MCIMX6L3DVN10AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SL | Tray | Obsolete | 0°C ~ 95°C (TJ) | Surface Mount | 432-TFBGA | MCIMX6 | 432-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 320 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (3) | 1.2V, 1.8V, 3.0V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | ||||||||||||||||||||
| NXP USA Inc. MCIMX6L7DVN10AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SL | Tray | Obsolete | 0°C ~ 95°C (TJ) | Surface Mount | 432-TFBGA | MCIMX6 | 432-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 320 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (3) | 1.2V, 1.8V, 3.0V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | ||||||||||||||||||||
| NXP USA Inc. MCIMX6Q4AVT08AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tray | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 300 | ARM® Cortex®-A9 | 852MHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||
| NXP USA Inc. MCIMX6Q6AVT08AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tray | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 300 | ARM® Cortex®-A9 | 852MHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||
| NXP USA Inc. SPC5674FF3MVV3 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 516-BBGA | SPC5674 | 516-PBGA (27x27) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 40 | 32 | e200z7 | 32-Bit Single-Core | 264MHz | CANbus, EBI/EMI, SCI, SPI | DMA, POR, PWM | 4MB (4M x 8) | FLASH | - | 256K x 8 | 1.08V ~ 5.25V | A/D 64x12b | External | ||||||||||||||||||||
| NXP USA Inc. MCIMX6U1AVM08AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tray | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317841557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||
| NXP USA Inc. MK10DX128VMD10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | MK10DX128 | 144-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319971557 | 3A991A2 | 8542.31.0001 | 160 | 104 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 46x16b; D/A 2x12b | Internal | |||||||||||||||||||
| NXP USA Inc. MK11DN512VMC5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK11DN512 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311134557 | 3A991A2 | 8542.31.0001 | 1,740 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 24x16b; D/A 1x12b | Internal | |||||||||||||||||||
| NXP USA Inc. MK12DN512VLH5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MK12DN512 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314795557 | 3A991A2 | 8542.31.0001 | 160 | 44 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 22x16b; D/A 1x12b | Internal | |||||||||||||||||||
| NXP USA Inc. MK12DX128VLH5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MK12DX128 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 44 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 22x16b; D/A 1x12b | Internal | ||||||||||||||||||||
| NXP USA Inc. MK12DX256VMC5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK12DX256 | 121-MAPBGA (8x8) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 935325697557 | 3A991A2 | 8542.31.0001 | 348 | 60 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 24x16b; D/A 1x12b | Internal | |||||||||||||||||||
| NXP USA Inc. MK20DX128VMC7 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK20DX128 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314832557 | 3A991A2 | 8542.31.0001 | 348 | 70 | ARM® Cortex®-M4 | 32-Bit Single-Core | 72MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 35x16b; D/A 1x12b | Internal | |||||||||||||||||||
| NXP USA Inc. MK20DX256VMD10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | MK20DX256 | 144-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 64K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | ||||||||||||||||||||
| NXP USA Inc. MK21DN512VMC5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK21DN512 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325711557 | 3A991A2 | 8542.31.0001 | 1,740 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 20x16b; D/A 1x12b | Internal | |||||||||||||||||||
| NXP USA Inc. MK21DX128VLK5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK21DX128 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311123557 | 3A991A2 | 8542.31.0001 | 480 | 60 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 20x16b | Internal | |||||||||||||||||||
| NXP USA Inc. MK22DN512VLH5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MK22DN512 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321793557 | 3A991A2 | 8542.31.0001 | 160 | 40 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 18x16b; D/A 1x12b | Internal | |||||||||||||||||||
| NXP USA Inc. MK22DX128VLK5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK22DX128 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321791557 | 3A991A2 | 8542.31.0001 | 480 | 56 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 20x16b; D/A 1x12b | Internal | |||||||||||||||||||
| NXP USA Inc. MK22DX256VLF5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | MK22DX256 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325699557 | 3A991A2 | 8542.31.0001 | 250 | 29 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 14x16b | Internal | |||||||||||||||||||
| NXP USA Inc. MK22DX256VLH5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MK22DX256 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314823557 | 3A991A2 | 8542.31.0001 | 160 | 40 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 18x16b; D/A 1x12b | Internal | |||||||||||||||||||
| NXP USA Inc. MK30DX128VLK7 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K30 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK30DX128 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325681557 | 3A991A2 | 8542.31.0001 | 96 | 56 | ARM® Cortex®-M4 | 32-Bit Single-Core | 72MHz | CANbus, I²C, IrDA, SD, SPI, UART/USART | DMA, I²S, LCD, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 31x16b; D/A 1x12b | Internal |
