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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Features | Base Product Number | Input Type | Current - Supply | Output Type | Ratio - Input:Output | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Number of Outputs | Topology | Frequency - Switching | Fault Protection | Output Configuration | Rds On (Typ) | Voltage - Load | Switch Type | Current - Output (Max) | Voltage/Current - Output 1 | Voltage/Current - Output 2 | Voltage/Current - Output 3 | w/LED Driver | w/Supervisor | w/Sequencer |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MC17XS6500EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Internal PWM | MC17XS6500 | - | N-Channel | 1:1 | 32-HSOP | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934070491574 | EAR99 | 8542.39.0001 | 42 | 4.5V ~ 5.5V | SPI | 6 | Current Limiting (Fixed), Open Load Detect, Over Temperature | High Side | 17mOhm | 7V ~ 18V | General Purpose | - | |||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC17XSF500EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | - | MC17XSF500 | - | N-Channel | 1:1 | 32-HSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 42 | 4.5V ~ 5.5V | SPI | 5 | Current Limiting (Fixed), Open Load Detect, Over Temperature | High Side | 17mOhm | 7V ~ 18V | General Purpose | 5.5A | |||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC17XSF500EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | - | MC17XSF500 | - | N-Channel | 1:1 | 32-HSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934070624518 | EAR99 | 8542.39.0001 | 1,000 | 4.5V ~ 5.5V | SPI | 5 | Current Limiting (Fixed), Open Load Detect, Over Temperature | High Side | 17mOhm | 7V ~ 18V | General Purpose | 5.5A | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33730EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | -40°C ~ 125°C | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MC33730 | 6V ~ 26.5V | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 42 | 3 | Step-Down (Buck) (1), Linear (LDO) (2) | 100kHz ~ 500kHz | 5V, 2A | Adjustable, 15mA | Adjustable, 15mA | No | No | No | ||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33981ABHFK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 150°C (TJ) | Surface Mount | 16-PowerQFN | Slew Rate Controlled | MC33981 | - | N-Channel | 1:1 | 16-HQFN (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 168 | - | PWM | 1 | Current Limiting (Fixed), Over Temperature | High Side | 4mOhm | 6V ~ 27V | General Purpose | 40A | |||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33981ABHFKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 150°C (TJ) | Surface Mount | 16-PowerQFN | Slew Rate Controlled | MC33981 | - | N-Channel | 1:1 | 16-HQFN (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 1,200 | - | PWM | 1 | Current Limiting (Fixed), Over Temperature | High Side | 4mOhm | 6V ~ 27V | General Purpose | 40A | |||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC34904C3EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MC34904 | 2mA | 5.5V ~ 28V | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321865518 | EAR99 | 8542.39.0001 | 1,000 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC56F82728VLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MC56F82 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315061557 | 3A991A2 | 8542.31.0001 | 160 | 54 | 56800EX | 32-Bit Single-Core | 100MHz | CANbus, I²C, SCI, SPI | DMA, POR, PWM, WDT | 32KB (16K x 16) | FLASH | - | 3K x 16 | 2.7V ~ 3.6V | A/D 16x12b; D/A 2x12b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC56F82733VLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MC56F82 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 26 | 56800EX | 32-Bit Single-Core | 100MHz | I²C, SCI, SPI | DMA, POR, PWM, WDT | 48KB (24K x 16) | FLASH | - | 4K x 16 | 2.7V ~ 3.6V | A/D 6x12b; D/A 2x12b | Internal | |||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC56F82743VLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MC56F82 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 26 | 56800EX | 32-Bit Single-Core | 100MHz | I²C, SCI, SPI | DMA, POR, PWM, WDT | 64KB (32K x 16) | FLASH | - | 4K x 16 | 2.7V ~ 3.6V | A/D 6x12b; D/A 2x12b | Internal | |||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC56F82746VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | MC56F82 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 39 | 56800EX | 32-Bit Single-Core | 100MHz | CANbus, I²C, SCI, SPI | DMA, POR, PWM, WDT | 64KB (32K x 16) | FLASH | - | 4K x 16 | 2.7V ~ 3.6V | A/D 10x12b; D/A 2x12b | Internal | |||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08PA16VWJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | MC9S08 | 20-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 38 | 18 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | |||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08PA4VWJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | MC9S08 | 20-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 38 | 18 | S08 | 8-Bit | 20MHz | LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | 128 x 8 | 512 x 8 | 2.7V ~ 5.5V | A/D 8x12b | Internal | |||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08PT8VLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MC9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 1,250 | 28 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | |||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08PT8VWJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | MC9S08 | 20-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 38 | 18 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | |||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6Q5EYM10ACR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tape & Reel (TR) | Not For New Designs | -20°C ~ 105°C (TJ) | Surface Mount | 624-LFBGA, FCBGA | MCIMX6 | 624-FCPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1.0GHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6Q6AVT10ACR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tape & Reel (TR) | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316342518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1.0GHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6S5DVM10ABR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tape & Reel (TR) | Not For New Designs | 0°C ~ 95°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311117518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6S5EVM10ABR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tape & Reel (TR) | Not For New Designs | -20°C ~ 105°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317895518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6U6AVM08ABR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tape & Reel (TR) | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311343518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCZ33903C5EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33 | 5.5V ~ 28V | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 1,000 | CAN | ||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK20DN512VLL10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MK20DN512 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317684557 | 3A991A2 | 8542.31.0001 | 90 | 66 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 33x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK20DN512VMC10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK20DN512 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311129557 | 3A991A2 | 8542.31.0001 | 348 | 66 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 38x16b; D/A 2x12b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK20DX256VMC10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK20DX256 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319977557 | 3A991A2 | 8542.31.0001 | 348 | 70 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 64K x 8 | 1.71V ~ 3.6V | A/D 38x16b; D/A 2x12b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK21FX512VLQ12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK21FX512 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315086557 | 3A991A2 | 8542.31.0001 | 60 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK21FX512VMD12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | MK21FX512 | 144-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317717557 | 3A991A2 | 8542.31.0001 | 160 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK22FX512VLH12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MK22FX512 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321867557 | 3A991A2 | 8542.31.0001 | 160 | 40 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 22x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK22FX512VLK12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK22FX512 | 80-FQFP (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 96 | 56 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 27x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK30DX64VLK7R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K30 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK30DX64 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321747528 | 3A991A2 | 8542.31.0001 | 1,000 | 56 | ARM® Cortex®-M4 | 32-Bit Single-Core | 72MHz | CANbus, I²C, IrDA, SD, SPI, UART/USART | DMA, I²S, LCD, LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 2K x 8 | 16K x 8 | 1.71V ~ 3.6V | A/D 31x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK50DN512CLL10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | MK50DN512 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 59 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 34x16b; D/A 2x12b | Internal |
