Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Voltage - Rated | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Features | Base Product Number | Frequency | Technology | Voltage - Input | Output Type | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Number of Outputs | Controller Series | Voltage - Output | Current Rating (Amps) | Current - Test | Power - Output | Gain | Bandwidth | Noise Figure | Voltage - Test | Axis | Acceleration Range | Sensitivity (LSB/g) | Sensitivity (mV/g) |
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NXP USA Inc. MC9S08PT8AVTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | MC9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 75 | 18 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08QE96CFTR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | MC9S08 | 48-QFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 38 | S08 | 8-Bit | 50MHz | I²C, LINbus, SCI, SPI | LVD, PWM, WDT | 96KB (96K x 8) | FLASH | - | 6K x 8 | 1.8V ~ 3.6V | A/D 10x12b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. MK22FN256CAH12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-UFBGA, WLCSP | MK22FN256 | 64-WLCSP (3.35x3.32) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 935315603098 | 3A991A2 | 8542.31.0001 | 5,000 | 40 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 48K x 8 | 1.71V ~ 3.6V | A/D 22x16b; D/A 1x12b | Internal | |||||||||||||||||||||||||||||
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NXP USA Inc. MK24FN1M0CAJ12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 142-UFBGA, WLCSP | MK24FN1M0 | 142-WLCSP (4.83x5.58) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 935318228051 | 3A991A2 | 8542.31.0001 | 3,000 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal | ||||||||||||||||||||||||||||
NXP USA Inc. MKE04Z64VLK4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE04 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MKE04Z64 | 80-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315282528 | 3A991A2 | 8542.31.0001 | 1,000 | 71 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | |||||||||||||||||||||||||||||
NXP USA Inc. MKL17Z128VFM4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL1 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-UFQFN Exposed Pad | MKL17Z128 | 32-QFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 490 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 32K x 8 | 1.71V ~ 3.6V | A/D 11x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. MKM34Z128ACLL5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KM | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | MKM34Z128 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 68 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | DMA, LCD, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 12x16b, 4x24b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. MM908E625ACPEKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C | Automotive Mirror Control | Surface Mount | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | MM908 | Not Verified | 8V ~ 18V | 54-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314271518 | 3A991A2 | 8542.31.0001 | 1,000 | 13 | HC08 | FLASH (16kB) | 512 x 8 | SCI, SPI | 908E | |||||||||||||||||||||||||||||||||
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NXP USA Inc. MMA2725JWR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | - | Surface Mount | 16-QFN | - | - | MMA27 | - | - | 16-QFN (6x6) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311399528 | EAR99 | 8542.39.0001 | 2,000 | - | - | - | - | - | |||||||||||||||||||||||||||||||||
NXP USA Inc. MMPF0100F0ANESR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Converter, i.MX6 | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MMPF0100 | 2.8V ~ 4.5V | 56-QFN-EP (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317987528 | EAR99 | 8542.39.0001 | 4,000 | 12 | Multiple | ||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MMPF0100F3AEP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C (TA) | Converter, i.MX6 | Surface Mount | 56-VFQFN Exposed Pad | MMPF0100 | 2.8V ~ 4.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | 12 | Multiple | |||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MMPF0100F4ANES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Converter, i.MX6 | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MMPF0100 | 2.8V ~ 4.5V | 56-QFN-EP (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | 12 | Multiple | |||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MMPF0100NPANESR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Converter, i.MX6 | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MMPF0100 | 2.8V ~ 4.5V | 56-QFN-EP (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315475528 | EAR99 | 8542.39.0001 | 4,000 | 12 | Multiple | ||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MMRF1018NBR1 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | 120 V | Chassis Mount | TO-272BB | MMRF1 | 860MHz | LDMOS | TO-272 WB-4 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324763528 | EAR99 | 8541.29.0075 | 500 | - | 350 mA | 18W | 22dB | - | 50 V | |||||||||||||||||||||||||||||||||||
NXP USA Inc. S912XEG128W1MAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 80-QFP | S912 | 80-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 420 | 59 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 12K x 8 | 1.72V ~ 5.5V | A/D 8x12b | External | |||||||||||||||||||||||||||||||
NXP USA Inc. S912XEP100W1MAL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 300 | 91 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | 4K x 8 | 64K x 8 | 1.72V ~ 5.5V | A/D 16x12b | External | |||||||||||||||||||||||||||||||
NXP USA Inc. S912XET256BMAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 80-QFP | S912 | 80-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 420 | 59 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 16K x 8 | 1.72V ~ 5.5V | A/D 8x12b | External | |||||||||||||||||||||||||||||||
NXP USA Inc. S912XET256W1MAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 80-QFP | S912 | 80-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 420 | 59 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 16K x 8 | 1.72V ~ 5.5V | A/D 8x12b | External | |||||||||||||||||||||||||||||||
NXP USA Inc. S912XET256W1MAG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 300 | 119 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 16K x 8 | 1.72V ~ 5.5V | A/D 24x12b | External | |||||||||||||||||||||||||||||||
NXP USA Inc. S912XET256W1MAL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 300 | 91 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 16K x 8 | 1.72V ~ 5.5V | A/D 16x12b | External | |||||||||||||||||||||||||||||||
NXP USA Inc. S9KEAZ128ACLK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 80-LQFP | S9KEAZ128 | 80-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 450 | 71 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | CANbus, I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. S9KEAZ64AVLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | S9KEAZ64 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 800 | 57 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | CANbus, I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. S9KEAZN16ACLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | S9KEAZN16 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 800 | 57 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. S9KEAZN32ACLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | S9KEAZN32 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. S9KEAZN32ACLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | S9KEAZN32 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322218557 | 3A991A2 | 8542.31.0001 | 800 | 57 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | |||||||||||||||||||||||||||||
NXP USA Inc. S9KEAZN8ACTG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | S9KEAZN8 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 96 | 14 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. S9S08SG8E2CSC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | S9S08 | 8-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 98 | 4 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 2.7V ~ 5.5V | A/D 4x10b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. S9S12DG12W2CPVE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | S9S12 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310272557 | EAR99 | 8542.31.0001 | 300 | 91 | HCS12 | 16-Bit | 25MHz | CANbus, I²C, SCI, SPI | PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 2.35V ~ 5.25V | A/D 16x10b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. S9S12G48F1MLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | S9S12 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 26 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | 1.5K x 8 | 4K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. S9S12P96J0MFTR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-TFQFN Exposed Pad | S9S12 | 48-QFN-EP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310184528 | 3A991A2 | 8542.31.0001 | 2,000 | 34 | HCS12 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 4K x 8 | 6K x 8 | 1.72V ~ 5.5V | A/D 10x12b | Internal |
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