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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Base Product Number | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MCIMX6Y2DVM05AAR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6 | Tape & Reel (TR) | Active | 0°C ~ 95°C (TJ) | Surface Mount | 289-LFBGA | MCIMX6 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313074518 | 5A992C | 8542.31.0001 | 1,000 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, DDR3, DDR3L | No | Electrophoretic, LCD | 10/100Mbps (2) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | A-HAB, ARM TZ, CSU, SJC, SNVS | CAN, I²C, SPI, UART | ||||||||||||||||||
| NXP USA Inc. MCIMX7D3EVK10SD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX7D | Tray | Active | -20°C ~ 105°C (TJ) | Surface Mount | 488-TFBGA | MCIMX7 | 488-TFBGA (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 84 | ARM® Cortex®-A7, ARM® Cortex®-M4 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LPDDR3, DDR3, DDR3L | No | Keypad, LCD, MIPI | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 3.3V | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | AC'97, CAN, eCSPI, I²C, I²S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | |||||||||||||||||||
| NXP USA Inc. MCIMX7D5EVM10SD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX7D | Tray | Active | -20°C ~ 105°C (TJ) | Surface Mount | 541-LFBGA | MCIMX7 | 541-MAPBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 84 | ARM® Cortex®-A7, ARM® Cortex®-M4 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LPDDR3, DDR3, DDR3L | No | Keypad, LCD, MIPI | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 3.3V | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | AC'97, CAN, eCSPI, I²C, I²S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | |||||||||||||||||||
| NXP USA Inc. MCIMX7S3EVK08SD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX7S | Tray | Active | -20°C ~ 105°C (TJ) | Surface Mount | 488-TFBGA | MCIMX7 | 488-TFBGA (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935352048557 | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7, ARM® Cortex®-M4 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LPDDR3, DDR3, DDR3L | No | Keypad, LCD, MIPI | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | 1.8V, 3.3V | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | AC'97, eCSPI, I²C, I²S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | |||||||||||||||||||
| NXP USA Inc. MCR908JL3ECDWER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC08 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | MCR908 | 28-SOIC | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314544518 | EAR99 | 8542.31.0001 | 1,000 | 23 | HC08 | 8-Bit | 8MHz | - | LED, LVD, POR, PWM | 4KB (4K x 8) | FLASH | - | 128 x 8 | 2.7V ~ 3.3V | A/D 12x8b | External | |||||||||||||||||||
| NXP USA Inc. MCZ33903D3EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33903 | 5.5V ~ 28V | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935333155574 | EAR99 | 8542.39.0001 | 42 | CAN, LIN | |||||||||||||||||||||||||||||
| NXP USA Inc. MCZ33903D5EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33903 | 5.5V ~ 28V | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935333161518 | EAR99 | 8542.39.0001 | 1,000 | CAN, LIN | |||||||||||||||||||||||||||||
| NXP USA Inc. MCZ33903DD5EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33903 | 5.5V ~ 28V | 32-SSOP-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935333165574 | EAR99 | 8542.39.0001 | 42 | CAN, LIN | |||||||||||||||||||||||||||||
| NXP USA Inc. MCZ33903DD5EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33903 | 5.5V ~ 28V | 32-SSOP-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935333165518 | EAR99 | 8542.39.0001 | 1,000 | CAN, LIN | |||||||||||||||||||||||||||||
| NXP USA Inc. MCZ33903DP3EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33903 | 5.5V ~ 28V | 32-SSOP-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935333199518 | EAR99 | 8542.39.0001 | 1,000 | CAN, LIN | |||||||||||||||||||||||||||||
| NXP USA Inc. MCZ33903DP5EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33903 | 5.5V ~ 28V | 32-SSOP-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935333218518 | EAR99 | 8542.39.0001 | 1,000 | CAN, LIN | |||||||||||||||||||||||||||||
| NXP USA Inc. MCZ33904D3EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33904 | 5.5V ~ 28V | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935331842574 | EAR99 | 8542.39.0001 | 42 | CAN | |||||||||||||||||||||||||||||
| NXP USA Inc. MCZ33904D5EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33904 | 5.5V ~ 28V | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 1,000 | CAN | ||||||||||||||||||||||||||||||
| NXP USA Inc. MCZ33905DD3EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | System Basis Chip | Surface Mount | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33905 | 5.5V ~ 28V | 54-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935333202518 | EAR99 | 8542.39.0001 | 1,000 | CAN, LIN | |||||||||||||||||||||||||||||
| NXP USA Inc. MCZ33905DD5EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | System Basis Chip | Surface Mount | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33905 | 5.5V ~ 28V | 54-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935333193574 | EAR99 | 8542.39.0001 | 26 | CAN, LIN | |||||||||||||||||||||||||||||
| NXP USA Inc. MCZ33905DD5EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | System Basis Chip | Surface Mount | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33905 | 5.5V ~ 28V | 54-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935333193518 | EAR99 | 8542.39.0001 | 1,000 | CAN, LIN | |||||||||||||||||||||||||||||
 |
NXP USA Inc. MFR4310E1MAE40 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Obsolete | MFR43 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313999557 | OBSOLETE | 800 | ||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT1052DVL6A | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1050 | Tray | Obsolete | 0°C ~ 95°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT1052 | 196-LFBGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 240 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 600MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | - | External Program Memory | - | 512K x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | |||||||||||||||||||
| NXP USA Inc. MK20DN512VLK10R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK20DN512 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,000 | 52 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 27x16b; D/A 1x12b | Internal | |||||||||||||||||||
| NXP USA Inc. MK21DN512AVMC5R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK21DN512 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311752518 | 5A002A1 | 8542.31.0001 | 2,000 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 20x16b; D/A 1x12b | Internal | ||||||||||||||||||
| NXP USA Inc. MK21DX256AVMC5R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK21DX256 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318123518 | 5A002A1 | 8542.31.0001 | 2,000 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 20x16b; D/A 1x12b | Internal | ||||||||||||||||||
| NXP USA Inc. MK21FN1M0AVMC12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK21FN1M0 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323739518 | 5A002A1 | 8542.31.0001 | 2,000 | 81 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 40x16b; D/A 2x12b | Internal | ||||||||||||||||||
| NXP USA Inc. MK22FN128VLH10R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MK22FN128 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320318528 | 3A991A2 | 8542.31.0001 | 1,500 | 40 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 24K x 8 | 1.71V ~ 3.6V | A/D 22x16b; D/A 1x12b | Internal | ||||||||||||||||||
| NXP USA Inc. MK22FN1M0AVLK12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK22FN1M0 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323834528 | 3A991A2 | 8542.31.0001 | 1,000 | 56 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 27x16b; D/A 1x12b | Internal | ||||||||||||||||||
| NXP USA Inc. MK22FX512VMC12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK22FX512 | 121-MAPBGA (8x8) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311152518 | 3A991A2 | 8542.31.0001 | 2,000 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 38x16b; D/A 2x12b | Internal | |||||||||||||||||||
|
NXP USA Inc. MK65FN2M0VMI18R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 169-LFBGA | MK65FN2M0 | 169-MAPBGA (9x9) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316011518 | 3A991A2 | 8542.31.0001 | 2,000 | 116 | ARM® Cortex®-M4 | 32-Bit Single-Core | 180MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 2MB (2M x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 2x16b; D/A 2x12b | Internal | ||||||||||||||||||
| NXP USA Inc. MK70FN1M0VMJ12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K70 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 256-LBGA | MK70FN1M0 | 256-MAPPBGA (17x17) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319892518 | 3A991A2 | 8542.31.0001 | 1,000 | 128 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LCD, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 71x16b; D/A 2x12b | Internal | |||||||||||||||||||
| NXP USA Inc. MKE02Z16VLC2R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MKE02Z16 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314884528 | 3A991A2 | 8542.31.0001 | 2,000 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 20MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | ||||||||||||||||||
| NXP USA Inc. MKE02Z32VFM4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | MKE02Z32 | 32-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322222528 | 3A991A2 | 8542.31.0001 | 5,000 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | ||||||||||||||||||
| NXP USA Inc. MKE02Z32VLC2R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MKE02Z32 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315854528 | 3A991A2 | 8542.31.0001 | 2,000 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 20MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal |
