Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Features | Base Product Number | Current - Supply | Output Type | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Function | Standards | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Protocol | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Interrupt Output | Current - Output Source/Sink | Clock Frequency |
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NXP USA Inc. MC34PF4210A0ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Audio, Video | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC34PF4210 | - | 2.8V ~ 4.5V | 56-QFN-EP (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | |||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC34PF4210A0ESR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Audio, Video | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC34PF4210 | - | 2.8V ~ 4.5V | 56-QFN-EP (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | |||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC34PF4210A1ESR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Audio, Video | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC34PF4210 | - | 2.8V ~ 4.5V | 56-QFN-EP (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | |||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC35FS6513CAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6513 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360436528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08SH4MTJR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | MC9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321021534 | 3A991A2 | 8542.31.0001 | 5,000 | 17 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | ||||||||||||||||||||||||||||
NXP USA Inc. MCF51EM256CLLR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF51EM | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | MCF51 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,000 | 63 | Coldfire V1 | 32-Bit Single-Core | 50MHz | I²C, SCI, SPI | LCD, LVD, PWM, WDT | 256KB (256K x 8) | FLASH | - | 16K x 8 | 1.8V ~ 3.6V | A/D 16x12b | External | |||||||||||||||||||||||||||||
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NXP USA Inc. MCIMX6D4AVT10AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6D | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935357607557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||||||||
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NXP USA Inc. MCIMX6D4AVT10AER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6D | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935357607518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||||||||
NXP USA Inc. MCIMX6D5EYM12AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6D | Tray | Active | -20°C ~ 105°C (TJ) | Surface Mount | 624-LFBGA, FCBGA | MCIMX6 | 624-FCPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935357867557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.2GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||
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NXP USA Inc. MCIMX6D6AVT08AER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6D | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935357609518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 852MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||||||||
NXP USA Inc. MCIMX6Q5EYM10CE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tray | Active | -20°C ~ 105°C (TJ) | Surface Mount | 624-LFBGA, FCBGA | MCIMX6 | 624-FCPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935357872557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.0GHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||
NXP USA Inc. MCIMX6Q5EYM12AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tray | Active | -20°C ~ 105°C (TJ) | Surface Mount | 624-LFBGA, FCBGA | MCIMX6 | 624-FCPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935357873557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.2GHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||
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NXP USA Inc. MCIMX6Q6AVT08AER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935357618518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 852MHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||||||||
NXP USA Inc. MCIMX6U6AVM08AD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360347557 | 5A002A1 | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||
NXP USA Inc. MCIMX6Y1DVK05AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 272-LFBGA | MCIMX6 | 272-MAPBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935357244557 | 5A992C | 8542.31.0001 | 260 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, DDR3, DDR3L | No | Electrophoretic, LCD | 10/100Mbps (1) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | A-HAB, ARM TZ, CSU, SJC, SNVS | CAN, I²C, SPI, UART | ||||||||||||||||||||||||||||
NXP USA Inc. MCIMX6Y2CVM08AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6 | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 289-LFBGA | MCIMX6 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7 | 792MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, DDR3, DDR3L | No | Electrophoretic, LCD | 10/100Mbps (1) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | A-HAB, ARM TZ, CSU, SJC, SNVS | CAN, I²C, SPI, UART | |||||||||||||||||||||||||||||
NXP USA Inc. MCIMX6Y2DVM09AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 289-LFBGA | MCIMX6 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7 | 900MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, DDR3, DDR3L | No | Electrophoretic, LCD | 10/100Mbps (2) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | A-HAB, ARM TZ, CSU, SJC, SNVS | CAN, I²C, SPI, UART | |||||||||||||||||||||||||||||
NXP USA Inc. MIMX8MQ5DVAJZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MQ | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 621-FBGA, FCBGA | MIMX8 | 621-FCPBGA (17x17) | download | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 90 | ARM® Cortex®-A53 | 1.5GHz | 4 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | eDP, HDMI, MIPI-CSI, MIPI-DSI | GbE | - | USB 3.0 (2) | - | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | EBI/EMI, I²C, PCIe, SPI, UART, uSDHC | ||||||||||||||||||||||||||||||
NXP USA Inc. MIMX8MQ6DVAJZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MQ | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 621-FBGA, FCBGA | MIMX8 | 621-FCPBGA (17x17) | download | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 90 | ARM® Cortex®-A53 | 1.5GHz | 4 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | eDP, HDMI, MIPI-CSI, MIPI-DSI | GbE | - | USB 3.0 (2) | - | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | EBI/EMI, I²C, PCIe, SPI, UART, uSDHC | ||||||||||||||||||||||||||||||
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NXP USA Inc. MK28FN2M0AVMI15 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K27F | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 169-LFBGA | MK28FN2M0 | 169-MAPBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360415557 | 5A002A1 | 8542.31.0001 | 260 | 120 | ARM® Cortex®-M4 | 32-Bit Single-Core | 150MHz | EBI/EMI, I²C, QSPI, SDHC, SPI, UART/USART, USB | DMA, I²S, PWM, WDT | 2MB (2M x 8) | FLASH | - | 1M x 8 | 1.71V ~ 3.6V | A/D 16b SAR; D/A 2x6b, 1x12b | External, Internal | |||||||||||||||||||||||||||
NXP USA Inc. PCA9557BSHP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C | Surface Mount | 16-VQFN Exposed Pad | POR | PCA95 | Open Drain | Not Verified | 2.3V ~ 5.5V | 16-HVQFN (4x4) | download | 1 (Unlimited) | REACH Unaffected | 935272775128 | OBSOLETE | 0000.00.0000 | 6,000 | 8 | I²C, SMBus | No | 10mA, 20mA | 400 kHz | |||||||||||||||||||||||||||||||||
NXP USA Inc. S9S12G128AVLLR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | S9S12 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358914528 | 3A991A2 | 8542.31.0001 | 1,000 | 86 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 8K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | ||||||||||||||||||||||||||||
NXP USA Inc. S9S12G48BCLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | S9S12 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935359308528 | 3A991A2 | 8542.31.0001 | 2,000 | 26 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | 1.5K x 8 | 4K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | ||||||||||||||||||||||||||||
NXP USA Inc. S9S12G48BMLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | S9S12 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935359311557 | 3A991A2 | 8542.31.0001 | 250 | 26 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | 1.5K x 8 | 4K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | ||||||||||||||||||||||||||||
NXP USA Inc. S9S12GA128AMLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935354399528 | 3A991A2 | 8542.31.0001 | 2,000 | 40 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 8K x 8 | 3.13V ~ 5.5V | A/D 12x12b | Internal | ||||||||||||||||||||||||||||
NXP USA Inc. SC18IS600IPW/S8HP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Last Time Buy | -40°C ~ 85°C | 16-TSSOP (0.173", 4.40mm Width) | SC18IS600 | 11mA | 2.4V ~ 3.6V | 16-TSSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | Controller | - | I²C | SPI | |||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5645CF0VLT1 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 208-LQFP | SPC5645 | 208-TQFP (28x28) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358741557 | 5A992C | 8542.31.0001 | 180 | 177 | e200z4d, e200z0h | 32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 2MB (2M x 8) | FLASH | 64K x 8 | 256K x 8 | 3V ~ 5.5V | A/D 33x10b, 10x12b | Internal | |||||||||||||||||||||||||||||
NXP USA Inc. SPC5645CF0VLT1R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 208-LQFP | SPC5645 | 208-TQFP (28x28) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358741528 | 5A992C | 8542.31.0001 | 180 | 177 | e200z4d, e200z0h | 32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 2MB (2M x 8) | FLASH | 64K x 8 | 256K x 8 | 3V ~ 5.5V | A/D 33x10b, 10x12b | Internal | |||||||||||||||||||||||||||||
NXP USA Inc. SPC5745BK1VMH2R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LFBGA | SPC5745 | 100-MAPBGA (11x11) | download | ROHS3 Compliant | REACH Unaffected | 935353624518 | 5A992C | 8542.31.0001 | 1,500 | e200z4 | 32-Bit Single-Core | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 2MB (2M x 8) | FLASH | 64K x 8 | 256K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. SPC5746BHK1AMKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5746 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358748557 | 5A992C | 8542.31.0001 | 200 | 129 | e200z4 | 32-Bit Single-Core | 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal |
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