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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Base Product Number | Frequency | Current - Supply | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | ECCN | HTSUS | Standard Package | Current - Output / Channel | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Protocol | Number of Drivers/Receivers | Duplex | Receiver Hysteresis | Data Rate | Interface | Power (Watts) | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Number of Outputs | Clock Rate | Non-Volatile Memory | On-Chip RAM | Voltage - Core | Output Isolation | Internal Switch(s) | Voltage - Breakdown | Topology | Voltage - Start Up | Duty Cycle | Frequency - Switching | Fault Protection | Control Features | Voltage - Supply (Max) | Dimming | Voltage - Supply (Min) | Voltage - Output |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MC33PF8100EAESR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8100 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33PF8200DNESR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8200 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT1051DVL6BR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1050 | Tape & Reel (TR) | Active | 0°C ~ 95°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT1051 | 196-LFBGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,500 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 600MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | External Program Memory | - | 512K x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SPC5747CSK0AVMJ2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 256-LBGA | SPC5747 | 256-MAPPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 450 | 178 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 120MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI | DMA, LVD, POR, WDT | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 48x10b, 16x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVL96F0VLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S912 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 2,000 | 34 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 2K x 8 | 8K x 8 | 5.5V ~ 18V | A/D 10x10b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVC96F0CLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | S912 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 28 | S12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 2K x 8 | 8K x 8 | 3.5V ~ 40V | A/D 10x10b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SPC5746CBK1ACMH6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LFBGA | SPC5746 | 100-MAPBGA (11x11) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 880 | 65 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 200MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 3MB (3M x 8) | FLASH | 128K x 8 | 384K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
NXP USA Inc. SAF775DHV/N208Q/BY | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | - | - | - | - | SAF775 | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 500 | - | - | - | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. SAF775DHN/N208ZAMP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | SAF77x | Tape & Reel (TR) | Obsolete | - | Surface Mount | 184-VQFN Multi Row, Exposed Pad | Audio, Car Signal Processor | SAF775 | 184-HVQFN (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 2,000 | - | - | - | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. SPC5744CFK1ACKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5744 | 176-LQFP (24x24) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 200 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. SAF4000EL/101S23EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | - | - | - | - | SAF4000 | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 630 | - | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. SPC5746CTK1AVKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5746 | 176-LQFP (24x24) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 200 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 3MB (3M x 8) | FLASH | 128K x 8 | 384K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. T4161NSE7NQB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ T4 | Tray | Active | 0°C ~ 105°C (TA) | Surface Mount | 1932-BBGA, FCBGA | T4161NSE7 | 1932-FCPBGA (45x45) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 12 | PowerPC e6500 | 1.3GHz | 16 Core, 64-Bit | - | DDR3, DDR3L | No | - | 1Gbps (13), 10Gbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.8V, 2.5V | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | I²C, MMC/SD, PCIe, RapidIO, SPI, UART | ||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. TFA9894AUK/N1Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tape & Reel (TR) | Active | TFA9894 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.33.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. TJA1049T/3/1Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TJ) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | Transceiver | TJA1049 | 4.75V ~ 5.25V | 8-SO | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 2,500 | CANbus | 1/1 | - | 300 mV | 5Mbps | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MCIMX6X3CVK08ACR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SX | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 400-LFBGA | MCIMX6 | 400-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,000 | ARM® Cortex®-A9, ARM® Cortex®-M4 | 200MHz, 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | DDR3, LPDDR2, LVDDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | AC'97, CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | |||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. TEA18362T/2J | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | GreenChip™ | Tape & Reel (TR) | Active | -40°C ~ 150°C (TJ) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | TEA18362 | 8-SO | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | 9.9V ~ 30V | 75 W | Isolated | No | - | Flyback | 14.9 V | - | 25kHz ~ 132.5kHz | Over Power, Over Temperature, Over Voltage | - | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08PL16CLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | MC9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,250 | 30 | S08 | 8-Bit | 20MHz | LINbus, SCI, UART/USART | LVD, POR, PWM | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. SPC5775BDK3MME2R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 416-BGA | SPC5775 | 416-MAPBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 500 | e200z7 | 32-Bit Dual-Core | 220MHz | CANbus, EBI/EMI, Ethernet, FlexRay, LINbus, SPI, PSI, UART/USART | DMA, LVD, POR, Zipwire | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3V, 5.5V | - | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. ASL9015SHNZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | - | - | Surface Mount, Wettable Flank | 36-VFQFN Exposed Pad | - | ASL9015 | - | 36-HVQFN (6x6) | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | - | - | - | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. SP5748GSK0AMKU6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SP5748 | 176-LQFP (24x24) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 500 | 129 | e200z2, e200z4, e200z4 | 32-Bit Tri-Core | 80MHz, 160MHz, 160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3.15V ~ 5.5V | A/D 48x10b, 16x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MC33VR5500V3ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Active | MC33VR5500 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. SAF775DHV/N208Q/KK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | - | - | - | - | SAF775 | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 200 | - | - | - | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVCA64F0VLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S912 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 2,000 | 28 | S12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 1K x 8 | 4K x 8 | 3.5V ~ 40V | A/D 10x12b; D/A 1x8b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC34PF8100CFEPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC34PF8100 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC54113J128BD64Y | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC54100 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | LPC54113 | 64-LQFP (10x10) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 1,500 | 48 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | I²C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 96K x 8 | 1.62V ~ 3.6V | A/D 12x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33PF8200DEESR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8200 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. FS32R372SBK0MMMT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 257-LFBGA | FS32R372 | 257-LFBGA (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 760 | e200z7260 | 32-Bit Dual-Core | 240MHz | CANbus, I²C, LINbus, SPI | POR, PWM, WDT | 1.3MB (1.3M x 8) | FLASH | 32K x 8 | 768K x 8 | 1.19V ~ 5.5V | A/D 16x12b SAR | Internal | |||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. LS1017ASE7NQA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ® Layerscape | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 448-BFBGA | LS1017 | 448-FBGA (17x17) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 90 | ARM® Cortex®-A72 | 1.3GHz | 1 Core, 64-Bit | - | DDR3L SDRAM, DDR4 SDRAM | - | - | 1Gbps (1), 2.5Gbps (5) | SATA 6Gbps (1) | - | - | - | CANbus, I²C, SPI, UART | ||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. SPC5744BFK1AVKU2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5744 | 176-LQFP (24x24) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 200 | 129 | e200z4 | 32-Bit Single-Core | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal |
