Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Features | Base Product Number | Output Type | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Max Output Power x Channels @ Load | Interface |
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NXP USA Inc. PK51N256CMD100 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Box | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 144-LBGA | PK51 | 144-MAPBGA (13x13) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1 | 94 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LCD, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 25x16b; D/A 2x12b | Internal | |||||||||||||
NXP USA Inc. PK51X256CLL100 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Box | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | PK51 | 100-LQFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1 | 59 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LCD, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 64K x 8 | 1.71V ~ 3.6V | A/D 18x16b; D/A 2x12b | Internal | |||||||||||||
NXP USA Inc. PK52N512CLQ100 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Box | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | PK52 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1 | 96 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 25x16b; D/A 2x12b | Internal | |||||||||||||
NXP USA Inc. PK52N512CMD100 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Box | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 144-LBGA | PK52 | 144-MAPBGA (13x13) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1 | 96 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 25x16b; D/A 2x12b | Internal | |||||||||||||
NXP USA Inc. PK60FX512VLQ12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Box | Discontinued at Digi-Key | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | PK60 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 16K x 8 | 128K x 8 | 1.71V ~ 3.6V | A/D 48x16b; D/A 2x12b | Internal | ||||||||||||
NXP USA Inc. S908GR8AE1MFAER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC08 | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | S908 | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312606528 | EAR99 | 8542.31.0001 | 2,000 | 21 | HC08 | 8-Bit | 8MHz | SCI, SPI | LVD, POR, PWM | 7.5KB (7.5K x 8) | FLASH | - | 384 x 8 | 2.7V ~ 5.5V | A/D 6x8b | Internal | ||||||||||||
NXP USA Inc. S908GZ60E1MFAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC08 | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | S908 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 250 | 37 | HC08 | 8-Bit | 8MHz | CANbus, SCI, SPI | LVD, POR, PWM | 60KB (60K x 8) | FLASH | - | 2K x 8 | 3V ~ 5.5V | A/D 24x10b | Internal | |||||||||||||
NXP USA Inc. S912XHY128F0VLM | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 300 | 88 | HCS12X | 16-Bit | 40MHz | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | LCD, Motor control PWM, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 8K x 8 | 8K x 8 | 4.5V ~ 5.5V | A/D 12x10b | External | |||||||||||||
NXP USA Inc. S9S08SC4E0MTGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | S9S08 | 16-TSSOP | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310062534 | 3A991A2 | 8542.31.0001 | 5,000 | 12 | S08 | 8-Bit | 40MHz | LINbus, SCI | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 4.5V ~ 5.5V | A/D 8x10b | Internal | ||||||||||||
NXP USA Inc. S9S12G128F0MLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP | S9S12 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314928557 | EAR99 | 8542.31.0001 | 800 | 54 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 8K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | |||||||||||
NXP USA Inc. S9S12G128F0VLHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | S9S12 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314562528 | EAR99 | 8542.31.0001 | 1,500 | 54 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 8K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | |||||||||||
NXP USA Inc. S9S12G96F0CLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | S9S12 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 800 | 54 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 3K x 8 | 8K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | ||||||||||||
NXP USA Inc. S9S12G96F0MLL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LQFP | S9S12 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 450 | 86 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 3K x 8 | 8K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | ||||||||||||
NXP USA Inc. S9S12GN16F0CLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 40 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 512 x 8 | 1K x 8 | 3.13V ~ 5.5V | A/D 8x10b | Internal | ||||||||||||
NXP USA Inc. S9S12GN16F0VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 105°C | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321592557 | 3A991A2 | 8542.31.0001 | 250 | 40 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 512 x 8 | 1K x 8 | 3.13V ~ 5.5V | A/D 8x10b | Internal | |||||||||||
NXP USA Inc. S9S12XS128J1CALR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | S9S12 | 112-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 500 | 91 | HCS12X | 16-Bit | 40MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 8K x 8 | 1.72V ~ 5.5V | A/D 16x12b | External | ||||||||||||
NXP USA Inc. S9S12XS64J1CAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | S9S12 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322907557 | 3A991A2 | 8542.31.0001 | 160 | 44 | HCS12X | 16-Bit | 40MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 4K x 8 | 1.72V ~ 5.5V | A/D 8x12b | External | |||||||||||
NXP USA Inc. SPC5606SF2VLQ6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | SPC5606 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 60 | 108 | e200z0h | 32-Bit Single-Core | 64MHz | CANbus, I²C, LINbus, QSPI, SCI, SPI | DMA, LCD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | 64K x 8 | 48K x 8 | 3V ~ 5.5V | A/D 16x10b | Internal | ||||||||||||
NXP USA Inc. SPC5606SF2VLU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 176-LQFP | SPC5606 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 40 | 136 | e200z0h | 32-Bit Single-Core | 64MHz | CANbus, I²C, LINbus, QSPI, SCI, SPI | DMA, LCD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | 64K x 8 | 48K x 8 | 3V ~ 5.5V | A/D 16x10b | Internal | ||||||||||||
NXP USA Inc. SPC5633MF1MLU60 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP | SPC5633 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 40 | 80 | e200z3 | 32-Bit Single-Core | 60MHz | CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART | DMA, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 64K x 8 | 4.5V ~ 5.25V | A/D 34x12b | Internal | ||||||||||||
NXP USA Inc. SPC5634MF1MLU80 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tray | Active | -40°C ~ 150°C | Surface Mount | 176-LQFP | SPC5634 | 176-LQFP (24x24) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324406557 | 3A991A2 | 8542.31.0001 | 40 | 114 | e200z3 | 32-Bit Single-Core | 80MHz | CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART | DMA, POR, PWM, WDT | 1.5MB (1.5M x 8) | FLASH | - | 94K x 8 | 4.5V ~ 5.25V | A/D 34x12b | Internal | ||||||||||||
NXP USA Inc. LPC4330FET100,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC43xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-TFBGA | LPC4330 | 100-TFBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 260 | 49 | ARM® Cortex®-M4/M0 | 32-Bit Dual-Core | 204MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | - | ROMless | - | 264K x 8 | 2.2V ~ 3.6V | A/D 4x10b; D/A 1x10b | Internal | ||||||||||||
NXP USA Inc. PTN3460BS/F2,518 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | LVDS | Surface Mount | 56-VFQFN Exposed Pad | PTN3460 | 3.3V | 56-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,000 | - | |||||||||||||||||||||||
NXP USA Inc. TDF8530TH/N1,518 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 44-BSSOP (0.433", 11.00mm Width) Exposed Pad | Class D | Depop, I²C, Mute, Short-Circuit and Thermal Protection, Standby | TDF853 | 4-Channel (Quad) | 6V ~ 24V | 44-HSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.33.0001 | 500 | 100W x 4 @ 2Ohm | ||||||||||||||||||||
NXP USA Inc. TDF8541TH/N2,518 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | Class AB | Depop, I²C, Mute, Short-Circuit and Thermal Protection, Standby | TDF854 | 4-Channel (Quad) | 6V ~ 18V | 36-HSOP | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.33.0001 | 500 | 64W x 4 @ 2Ohm | |||||||||||||||||||||
NXP USA Inc. TDF8546TH/N1,518 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | - | Surface Mount | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | Class AB | Depop, I²C, Mute, Short-Circuit and Thermal Protection, Standby | TDF854 | 4-Channel (Quad) | 6V ~ 18V | 36-HSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.33.0001 | 500 | 64W x 4 @ 2Ohm | ||||||||||||||||||||
NXP USA Inc. TDF8530TH/N1,512 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 44-BSSOP (0.433", 11.00mm Width) Exposed Pad | Class D | Depop, I²C, Mute, Short-Circuit and Thermal Protection, Standby | TDF853 | 4-Channel (Quad) | 6V ~ 24V | 44-HSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.33.0001 | 30 | 100W x 4 @ 2Ohm | ||||||||||||||||||||
NXP USA Inc. TDF8541J/N2,112 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -40°C ~ 105°C (TA) | Through Hole | 27-SIP, Formed Leads | Class AB | Depop, I²C, Mute, Short-Circuit and Thermal Protection, Standby | TDF854 | 4-Channel (Quad) | 6V ~ 18V | DBS27P | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.33.0001 | 19 | 64W x 4 @ 2Ohm | |||||||||||||||||||||
NXP USA Inc. TDF8599CTH/N1,112 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | Class D | Depop, Differential Inputs, I²C, Mute, Short-Circuit and Thermal Protection, Standby | TDF8599 | 1-Channel (Mono) or 2-Channel (Stereo) | 8V ~ 48V | 36-HSOP | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.33.0001 | 720 | 300W x 1 @ 3Ohm; 155W x 2 @ 6Ohm | |||||||||||||||||||||
NXP USA Inc. LPC1114FHI33/302,5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC1100L | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | LPC1114 | 32-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 490 | 28 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 32KB (32K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal |
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