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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Features | Base Product Number | Input Type | Technology | Current - Supply | Battery Chemistry | Charge Current - Max | Number of Cells | Output Type | Ratio - Input:Output | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Current - Output High, Low | Current - Output / Channel | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Interrupt Output | Current - Output Source/Sink | Clock Frequency | Number of Outputs | Voltage Supply Source | Circuit | Independent Circuits | Fault Protection | Current - Charging | Programmable Features | Battery Pack Voltage | Voltage - Supply (Max) | Output Configuration | Load Type | Rds On (Typ) | Current - Peak Output | Voltage - Load | Switch Type | Current - Output (Max) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. PCAL6524HEAZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C | Surface Mount | 32-UFQFN Exposed Pad | POR | PCAL6524 | Open Drain, Push-Pull | 1.65V ~ 5.5V | 32-HUQFN (5x5) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 500 | 24 | I²C | Yes | - | 1 MHz | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. PCA9849PWJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | Multiplexer | PCA9849 | 0.8V ~ 3.6V, 1.65V ~ 3.6V | 16-TSSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | - | Dual Supply | 2 x 4:1 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SPC5604EEF2MLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP | SPC5604 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315407557 | 3A991A2 | 8542.31.0001 | 160 | 39 | e200z0h | 32-Bit Single-Core | 64MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, WDT | 512KB (512K x 8) | FLASH | 64K x 8 | 96K x 8 | 3V ~ 3.6V | A/D 4x10b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MKL82Z128VMC7 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL8 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MKL82Z128 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316055557 | 5A992C | 8542.31.0001 | 348 | 85 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 72MHz | I²C, SPI, UART/USART, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 96K x 8 | 1.71V ~ 3.6V | A/D 12x16b; D/A 1x6b, 1x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC32BC3770CSR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 25-WFBGA, WLCSP | MC32BC3770 | Lithium Ion/Polymer | 2A | 1 | 25-WLCSP (2.27x2.17) | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | I²C | - | Constant - Programmable | Current | 4.475V (Max) | 6.2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33HB2001EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | -40°C ~ 150°C (TJ) | DC Motors, General Purpose | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Slew Rate Controlled | MC33HB2001 | Power MOSFET | 5V ~ 28V | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318112574 | EAR99 | 8542.39.0001 | 42 | - | SPI | Over Temperature, Over Voltage, UVLO | Half Bridge (2) | Inductive | 125mOhm LS (Max), 125mOhm HS (Max) | - | 5V ~ 28V | ||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC34PF3000A6EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C | i.MX Processors | Surface Mount | 48-VFQFN Exposed Pad | MC34PF3000 | - | 2.8V ~ 5.5V | 48-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC34PF3001A1EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C | Processor | Surface Mount | 48-VFQFN Exposed Pad | MC34PF3001 | - | 2.8V ~ 5.5V | 48-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC34PF3001A4EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C | Processor | Surface Mount | 48-VFQFN Exposed Pad | MC34PF3001 | - | 2.8V ~ 5.5V | 48-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC34VR500V4ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | QorlQ LS1/T1 Communications Processors | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC34VR500 | 250µA | 2.8V ~ 4.5V | 56-QFN-EP (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33CD1030AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | Switch Monitoring | Surface Mount | 48-LQFP Exposed Pad | MC33CD1030 | 4.5V ~ 36V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 250 | SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. NX5P2925CUKZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | NX5 | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 6-XFBGA, WLCSP | Load Discharge, Slew Rate Controlled | NX5P2925 | Non-Inverting | N-Channel | 1:1 | 6-WLCSP (0.87x1.37) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 3,000 | Not Required | On/Off | 1 | Reverse Current | High Side | 18mOhm | 0.8V ~ 5.5V | General Purpose | 2.5A | ||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6QP4AVT8AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6QP | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 852MHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | ||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6DP7CVT8AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DP | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | ||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LS1012ASN7EKA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ® Layerscape | Tray | Active | 0°C ~ 105°C | Surface Mount | 211-VFLGA | LS1012 | 211-FCLGA (9.6x9.6) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325013557 | 3A991A2 | 8542.31.0001 | 168 | ARM® Cortex®-A53 | 600MHz | 1 Core, 64-Bit | - | DDR3L | - | - | GbE (2) | SATA 6Gbps (1) | USB 2.0 (1), USB 3.0 + PHY | - | Secure Boot, TrustZone® | - | ||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08AW32MFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-QFP | MC9S08 | 64-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319942557 | 3A991A2 | 8542.31.0001 | 84 | 54 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08AW32VFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-QFP | MC9S08 | 64-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325685557 | 3A991A2 | 8542.31.0001 | 420 | 54 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08QE32CFMR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | MC9S08 | 32-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322981528 | 3A991A2 | 8542.31.0001 | 5,000 | 26 | S08 | 8-Bit | 50MHz | I²C, LINbus, SCI, SPI | LVD, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | A/D 10x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08SL8VTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | MC9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 75 | 16 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | 256 x 8 | 512 x 8 | 2.7V ~ 5.5V | A/D 12x10b | External | ||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCF51AC256BCFGER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF51AC | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | MCF51 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320266528 | 3A991A2 | 8542.31.0001 | 1,500 | 36 | Coldfire V1 | 32-Bit Single-Core | 50MHz | I²C, SCI, SPI | LVD, PWM, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 2.7V ~ 5.5V | A/D 9x12b | External | |||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCF5272CVM66R2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF527x | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 196-LBGA | MCF5272 | 196-LBGA (15x15) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 750 | 32 | Coldfire V2 | 32-Bit Single-Core | 66MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB | DMA, WDT | 16KB (4K x 32) | ROM | - | 1K x 32 | 3V ~ 3.6V | - | External | ||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCHC11F1VFNE4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC11 | Tube | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 68-LCC (J-Lead) | MCHC11 | 68-PLCC (24.21x24.21) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314607574 | EAR99 | 8542.31.0001 | 18 | 30 | HC11 | 8-Bit | 4MHz | SCI, SPI | POR, WDT | - | ROMless | 512 x 8 | 1K x 8 | 4.75V ~ 5.25V | A/D 8x8b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MKS22FN128VFT12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KS22 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | MKS22FN128 | 48-QFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 260 | 35 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, I²C, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 1x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S908AB32AE2CFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC08 | Bulk | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 64-QFP | S908 | 64-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325615557 | EAR99 | 8542.31.0001 | 420 | 51 | HC08 | 8-Bit | 8MHz | SCI, SPI | POR, PWM | 32KB (32K x 8) | FLASH | 512 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x8b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S908AB32AH3CFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC08 | Bulk | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 64-QFP | S908 | 64-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310168557 | EAR99 | 8542.31.0001 | 420 | 51 | HC08 | 8-Bit | 8MHz | SCI, SPI | POR, PWM | 32KB (32K x 8) | FLASH | 512 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x8b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S908AB32AH3CFUER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC08 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 64-QFP | S908 | 64-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310168528 | EAR99 | 8542.31.0001 | 750 | 51 | HC08 | 8-Bit | 8MHz | SCI, SPI | POR, PWM | 32KB (32K x 8) | FLASH | 512 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x8b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S908AB32AH3MFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC08 | Bulk | Not For New Designs | -40°C ~ 125°C (TA) | Surface Mount | 64-QFP | S908 | 64-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319768557 | EAR99 | 8542.31.0001 | 420 | 51 | HC08 | 8-Bit | 8MHz | SCI, SPI | POR, PWM | 32KB (32K x 8) | FLASH | 512 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x8b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912B32E4CFUE8 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC12 | Bulk | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 80-QFP | S912 | 80-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935309891557 | EAR99 | 8542.31.0001 | 420 | 63 | CPU12 | 16-Bit | 8MHz | SCI, SPI | POR, PWM, WDT | 32KB (32K x 8) | FLASH | 768 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x10b | External | ||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912B32E4MFUE8R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC12 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 125°C (TA) | Surface Mount | 80-QFP | S912 | 80-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313938528 | EAR99 | 8542.31.0001 | 750 | 63 | CPU12 | 16-Bit | 8MHz | SCI, SPI | POR, PWM, WDT | 32KB (32K x 8) | FLASH | 768 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x10b | External | ||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912B32E4VFUE8R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC12 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 80-QFP | S912 | 80-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935309978528 | EAR99 | 8542.31.0001 | 750 | 63 | CPU12 | 16-Bit | 8MHz | SCI, SPI | POR, PWM, WDT | 32KB (32K x 8) | FLASH | 768 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x10b | External |
