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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Base Product Number | Current - Supply | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MC34PF8100CEEP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount | 56-VFQFN Exposed Pad | MC34PF8100 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 260 | |||||||||||||||||||||||||||||||
| NXP USA Inc. MC33PF8100CFEP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount | 56-VFQFN Exposed Pad | MC33PF8100 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 260 | ||||||||||||||||||||||||||||||
| NXP USA Inc. MC34PF8100CGEP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount | 56-VFQFN Exposed Pad | MC34PF8100 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 260 | |||||||||||||||||||||||||||||||
| NXP USA Inc. MC33PF8200D2ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8200 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935382409557 | 0000.00.0000 | 260 | |||||||||||||||||||||||||||||
| NXP USA Inc. MC33PF8200DBES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8200 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935382424557 | 0000.00.0000 | 260 | |||||||||||||||||||||||||||||
| NXP USA Inc. MC33PF8200DEES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8200 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935376115557 | 0000.00.0000 | 260 | |||||||||||||||||||||||||||||
| NXP USA Inc. MC33PF8200DGES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8200 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 260 | ||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX281AVM4C | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX28 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 289-LFBGA | MCIMX281 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935369788557 | 5A992C | 8542.31.0001 | 760 | ARM926EJ-S | 454MHz | 1 Core, 32-Bit | Data; DCP | LVDDR, LVDDR2, DDR2 | No | Keypad | 10/100Mbps (1) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | Boot Security, Cryptography, Hardware ID | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | ||||||||||||||||||
| NXP USA Inc. MCIMX286CVM4C | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX28 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 289-LFBGA | MCIMX286 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935369793557 | 5A992C | 8542.31.0001 | 760 | ARM926EJ-S | 454MHz | 1 Core, 32-Bit | Data; DCP | LVDDR, LVDDR2, DDR2 | No | Keyboard, LCD, Touchscreen | 10/100Mbps (1) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | Boot Security, Cryptography, Hardware ID | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | ||||||||||||||||||
| NXP USA Inc. MCIMX286DVM4C | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX28 | Tray | Active | -20°C ~ 70°C (TA) | Surface Mount | 289-LFBGA | MCIMX286 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935369799557 | 5A992C | 8542.31.0001 | 760 | ARM926EJ-S | 454MHz | 1 Core, 32-Bit | Data; DCP | LVDDR, LVDDR2, DDR2 | No | Keypad | 10/100Mbps (1) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | Boot Security, Cryptography, Hardware ID | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | ||||||||||||||||||
| NXP USA Inc. MC9S08QL8CTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | MC9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 75 | 18 | S08 | 8-Bit | 20MHz | LINbus, SCI | LVD, PWM, WDT | 8KB (8K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 8x12b | Internal | |||||||||||||||||||
| NXP USA Inc. MC9S08QL8CTG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 96 | 14 | S08 | 8-Bit | 20MHz | LINbus, SCI | LVD, PWM, WDT | 8KB (8K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 8x12b | Internal | |||||||||||||||||||
| NXP USA Inc. MIMX8MM6DVTLZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MM | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | MIMX8MM6 | 486-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A53 | 1.8GHz | 4 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | I²C, PCIe, SDHC, SPI, UART | |||||||||||||||||||
| NXP USA Inc. MIMX8MM6CVTKZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MM | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | MIMX8 | 486-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A53 | 1.6GHz | 4 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | I²C, PCIe, SDHC, SPI, UART | |||||||||||||||||||
| NXP USA Inc. MIMX8MM5DVTLZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MM | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | MIMX8MM5 | 486-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A53 | 1.8GHz | 4 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | I²C, PCIe, SDHC, SPI, UART | |||||||||||||||||||
| NXP USA Inc. MIMX8MM5CVTKZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MM | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | MIMX8MM5 | 486-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A53 | 1.6GHz | 4 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | I²C, PCIe, SDHC, SPI, UART | |||||||||||||||||||
| NXP USA Inc. FS32R274KSK2MMM | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32R | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 257-LFBGA | FS32R274 | 257-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 760 | e200z4, e200z7 (2) | 32-Bit Tri-Core | 180MHz, 240MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire | POR, PWM, WDT | 2MB (2M x 8) | FLASH | 64K x 8 | 1.5M x 8 | 1.19V ~ 5.5V | A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b | Internal | ||||||||||||||||||||
| NXP USA Inc. MC9S08PL60CQH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-QFP | MC9S08 | 64-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 84 | 57 | S08 | 8-Bit | 20MHz | LINbus, SCI, UART/USART | LVD, POR, PWM | 60KB (60K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | |||||||||||||||||||
| NXP USA Inc. MC9S08PL16CTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | MC9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 75 | 18 | S08 | 8-Bit | 20MHz | LINbus, SCI, UART/USART | LVD, POR, PWM | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 10x10b | Internal | |||||||||||||||||||
| NXP USA Inc. MC32PF1510A2EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC32PF1510 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371713557 | EAR99 | 8542.39.0001 | 490 | ||||||||||||||||||||||||||||
| NXP USA Inc. MC32PF1510A6EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC32PF1510 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371869528 | EAR99 | 8542.39.0001 | 5,000 | ||||||||||||||||||||||||||||
| NXP USA Inc. MC34PF1510A2EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC34PF1510 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371926528 | EAR99 | 8542.39.0001 | 5,000 | ||||||||||||||||||||||||||||
| NXP USA Inc. MC34PF1510A3EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC34PF1510 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371924557 | EAR99 | 8542.39.0001 | 490 | ||||||||||||||||||||||||||||
| NXP USA Inc. MC34PF1510A3EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC34PF1510 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371924528 | EAR99 | 8542.39.0001 | 5,000 | ||||||||||||||||||||||||||||
| NXP USA Inc. MC34PF1510A4EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC34PF1510 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371922557 | EAR99 | 8542.39.0001 | 490 | ||||||||||||||||||||||||||||
| NXP USA Inc. MC34PF1510A5EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC34PF1510 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371919557 | EAR99 | 8542.39.0001 | 490 | ||||||||||||||||||||||||||||
| NXP USA Inc. MC34PF1510A5EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC34PF1510 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371919528 | EAR99 | 8542.39.0001 | 5,000 | ||||||||||||||||||||||||||||
| NXP USA Inc. MC34PF1550A6EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC34PF1550 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371936528 | EAR99 | 8542.39.0001 | 5,000 | ||||||||||||||||||||||||||||
| NXP USA Inc. MC34PF1550A7EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC34PF1550 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371934557 | EAR99 | 8542.39.0001 | 490 | ||||||||||||||||||||||||||||
| NXP USA Inc. MC32PF1510A1EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC32PF1510 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 5,000 |
