Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Type | Features | Base Product Number | Input Type | Output Type | Number of Circuits | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | ECCN | HTSUS | Standard Package | Logic Type | Number of Elements | Number of Bits per Element | Current - Output High, Low | Function | Current - Quiescent (Max) | -3db Bandwidth | Number of Inputs | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Switch Circuit | Multiplexer/Demultiplexer Circuit | On-State Resistance (Max) | Channel-to-Channel Matching (ΔRon) | Voltage - Supply, Single (V+) | Voltage - Supply, Dual (V±) | Switch Time (Ton, Toff) (Max) | Charge Injection | Channel Capacitance (CS(off), CD(off)) | Current - Leakage (IS(off)) (Max) | Crosstalk | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Clock Frequency | Voltage Supply Source | Trigger Type | Max Propagation Delay @ V, Max CL | Current - Quiescent (Iq) | Input Capacitance | Input Logic Level - Low | Input Logic Level - High | Circuit | Independent Circuits |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. MPC8260AZUPJDB-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC82xx | Bulk | Active | 0°C ~ 105°C (TA) | Surface Mount | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | download | RoHS non-compliant | 3 (168 Hours) | REACH Affected | 5A991B4B | 8542.31.0001 | 1 | PowerPC G2 | 300MHz | 1 Core, 32-Bit | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100Mbps (3) | - | - | 3.3V | - | I²C, SCC, SMC, SPI, UART, USART | |||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. 74AUP2G126GF,115-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 74AUP | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 8-XFDFN | 74AUP2G126 | - | 3-State | 0.8V ~ 3.6V | 8-XSON (1.35x1) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 5,000 | Buffer, Non-Inverting | 2 | 1 | 4mA, 4mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. 74HCT132DB,118-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 74HCT | Bulk | Active | -40°C ~ 125°C | Surface Mount | 14-SSOP (0.209", 5.30mm Width) | Schmitt Trigger | 74HCT132 | 4 | 4.5V ~ 5.5V | 14-SSOP | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 2,000 | NAND Gate | 4mA, 4mA | 2 µA | 2 | 33ns @ 4.5V, 50pF | 0.5V ~ 0.6V | 1.9V ~ 2.1V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MPC875VR66-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Active | 0°C ~ 95°C (TA) | Surface Mount | 256-BBGA | 256-PBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 FRE | 8542.31.0001 | 1 | MPC8xx | 66MHz | 1 Core, 32-Bit | Communications; CPM, Security; SEC | DRAM | No | - | 10Mbps (1), 10/100Mbps (2) | - | USB 2.0 (1) | 3.3V | Cryptography | I²C, PCMCIA, SPI, TDM, UART | |||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08PA16VLC-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MC9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1 | 28 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. 74LVC3G04GD,125-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Bulk | Active | 74LVC3G04 | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3,000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX6L8DVN10AA-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Bulk | Active | MCIMX6 | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992 | 8542.31.0001 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC68340CAG16E-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Bulk | Active | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC908QT2ACDWER-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC08 | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | MC908 | 8-SO | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 1 | 5 | HC08 | 8-Bit | 8MHz | - | LVD, POR, PWM | 1.5KB (1.5K x 8) | FLASH | - | 128 x 8 | 2.7V ~ 5.5V | A/D 6x10b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MPC8245TVV300D-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Bulk | Active | download | Not applicable | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08PT32VLH-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MC9S08 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 1 | 57 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | External | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() |
NXP USA Inc. MC68302CEH20C-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | M683xx | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 132-BQFP Bumpered | 132-PQFP (24.13x24.13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A991B4B | 8542.31.0001 | 1 | M68000 | 20MHz | 1 Core, 8/16-Bit | Communications; RISC CPM | DRAM | No | - | - | - | - | 5V | - | GCI, IDL, ISDN, NMSI, PCM, SCPI | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() |
NXP USA Inc. MC9328MX21CJM-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Bulk | Active | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. 74HCT4051DB,112-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 16-SSOP (0.209", 5.30mm Width) | 74HCT4051 | 1 | 16-SSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 1 | 180MHz | - | 8:1 | 120Ohm | 6Ohm | 2V ~ 10V | - | 59ns, 49ns | - | 3.5pF | 400nA | -50dB @ 1MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MPC860DPZQ50D4557-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC86xx | Bulk | Active | 0°C ~ 95°C (TJ) | Surface Mount | 357-BBGA | 357-PBGA (25x25) | download | Not applicable | 3 (168 Hours) | Vendor Undefined | 5A991B4B | 8542.31.0001 | 1 | MPC8xx | 50MHz | 1 Core, 32-Bit | Communications; CPM | DRAM | No | - | 10Mbps (2), 10/100Mbps (1) | - | - | 3.3V | - | HDLC/SDLC, I²C, IrDA, PCMCIA, SPI, TDM, UART/USART | |||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX6G2DVK05AA-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6 | Bulk | Active | 0°C ~ 95°C (TJ) | Surface Mount | 272-LFBGA | MCIMX6 | 272-MAPBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992 | 8542.31.0001 | 1 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3, DDR3L | No | LCD, LVDS | 10/100Mbps (1) | - | USB 2.0 + PHY (1) | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() |
NXP USA Inc. MPC855TCVR50D4-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Bulk | Active | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. 74HC107DB,112-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 74HC | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 14-SSOP (0.209", 5.30mm Width) | JK Type | 74HC107 | Complementary | 2V ~ 6V | 14-SSOP | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 1 | 2 | 1 | 5.2mA, 5.2mA | Reset | 85 MHz | Negative Edge | 27ns @ 6V, 50pF | 4 µA | 3.5 pF | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() |
NXP USA Inc. MC68EC040RC33A-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Bulk | Active | download | Not applicable | 3 (168 Hours) | Vendor Undefined | 3A991A2 | 8542.31.0001 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08PA8VLC-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MC9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1 | 28 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | External | ||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC68LC302CAF20CT-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1 | M68000 | 20MHz | 1 Core, 8/16-Bit | Communications; RISC CPM | DRAM | No | - | - | - | - | 5V | - | GCI, IDL, ISDN, NMSI, PCM, SCPI | |||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MPC860PCZQ50D4-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC86xx | Bulk | Active | -40°C ~ 95°C (TJ) | Surface Mount | 357-BBGA | 357-PBGA (25x25) | download | RoHS non-compliant | 3 (168 Hours) | Vendor Undefined | 5A991B4B | 8542.31.0001 | 1 | MPC8xx | 50MHz | 1 Core, 32-Bit | Communications; CPM | DRAM | No | - | 10Mbps (4), 10/100Mbps (1) | - | - | 3.3V | - | HDLC/SDLC, I²C, IrDA, PCMCIA, SPI, TDM, UART/USART | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() |
NXP USA Inc. MC68040RC40V-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Bulk | Active | download | Not applicable | 3 (168 Hours) | Vendor Undefined | 3A991A2 | 8542.31.0001 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC68HC908QT2CPE-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC08 | Bulk | Active | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | MC68HC908 | 8-PDIP | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1 | 5 | HC08 | 8-Bit | 8MHz | - | LVD, POR, PWM | 1.5KB (1.5K x 8) | FLASH | - | 128 x 8 | 2.7V ~ 5.5V | A/D 4x8b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() |
NXP USA Inc. 74AUP2T1326GF,115-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 74AUP | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 10-XFDFN | 74AUP2T1326 | - | 3-State | 1.1V ~ 3.6V | 10-XSON (1.7x1) | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 5,000 | Buffer, Non-Inverting | 2 | 1 | 4mA, 4mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() |
NXP USA Inc. MCIMX6D4AVT10AC-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Bulk | Active | MCIMX6 | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992 | 8542.31.0001 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() |
NXP USA Inc. 74LVC257ADB,112-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 74LVC | Tube | Active | -40°C ~ 125°C | Surface Mount | 16-SSOP (0.209", 5.30mm Width) | Multiplexer | 74LVC257 | 1.2V ~ 3.6V | 16-SSOP | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 1 | 24mA, 24mA | Single Supply | 4 x 2:1 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MK60DN512ZVLQ10-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK60DN512 | 144-LQFP (20x20) | download | Not applicable | 3 (168 Hours) | REACH Unaffected | 1 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() |
NXP USA Inc. 74LVC1G80GF,132-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 74LVC | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 6-XFDFN | D-Type | 74LVC1G80 | Inverted | 1.65V ~ 5.5V | 6-XSON, SOT891 (1x1) | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 1 | 1 | 1 | 32mA, 32mA | Standard | 400 MHz | Positive Edge | 4.5ns @ 5V, 50pF | 200 µA | 5 pF | |||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. P5010NSN7TNB557-NXP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Active | Not applicable | 3 (168 Hours) | Vendor Undefined | EAR99 | 8542.39.0001 | 1 |
Please send RFQ , we will respond immediately.