Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Type | Features | Base Product Number | Input Type | Output Type | Ratio - Input:Output | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Max Output Power x Channels @ Load | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Number of Outputs | Fault Protection | Output Configuration | Rds On (Typ) | Voltage - Load | Switch Type | Current - Output (Max) |
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NXP USA Inc. TDF8548AJ/N1U | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | - | Through Hole | 27-SIP, Formed Leads | Class AB | Depop, Short-Circuit and Thermal Protection | TDF854 | 4-Channel (Quad) | 6V ~ 18V | DBS27P | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 935300581112 | EAR99 | 8542.39.0001 | 456 | 28W x 4 @ 4Ohm | |||||||||||||||||||||||||||||||||||||||
NXP USA Inc. LPC11E37HFBD64/4QL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC11E3x | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | LPC11 | 64-LQFP (10x10) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 54 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, Microwire, SmartCard, SPI, SSP, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 10K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. LPC11U67JBD48E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC11Uxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | LPC11 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 34 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 50MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART, USB | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 20K x 8 | 2.4V ~ 3.6V | A/D 8x12b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MKL02Z16VFG4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL02 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 16-UFQFN Exposed Pad | MKL02Z16 | 16-QFN (3x3) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323424528 | 3A991A2 | 8542.31.0001 | 5,000 | 14 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 3.6V | A/D 6x12b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. MKL04Z32VLC4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL0 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MKL04Z32 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311626528 | 3A991A2 | 8542.31.0001 | 2,000 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 4K x 8 | 1.71V ~ 3.6V | A/D 14x12b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. MKL15Z32VFM4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL1 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | MKL15Z32 | 32-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323554528 | 3A991A2 | 8542.31.0001 | 5,000 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, TSI, UART/USART | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 4K x 8 | 1.71V ~ 3.6V | A/D 9x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. S9S08DV32F2MLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | S9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311868528 | 3A991A2 | 8542.31.0001 | 2,000 | 25 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 10x12b | External | ||||||||||||||||||||||||||||||
NXP USA Inc. S9S08SG32E1MTJR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | S9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,500 | 16 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | |||||||||||||||||||||||||||||||
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NXP USA Inc. BSC9132NXN7KNKB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ Qonverge BSC | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 780-BFBGA, FCBGA | BSC9132 | 780-FCBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323474557 | 3A991A2 | 8542.31.0001 | 60 | PowerPC e500 | 1.333GHz | 2 Core, 32-Bit | Signal Processing; SC3850 - Dual | DDR3, DDR3L | No | - | 10/100/1000Mbps (2) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | - | AIC, DUART, I²C, MMC/SD, SPI, USIM | |||||||||||||||||||||||||||||
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NXP USA Inc. BSC9132NXN7MNMB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ Qonverge BSC | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 780-BFBGA, FCBGA | BSC9132 | 780-FCBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311624557 | 3A991A2 | 8542.31.0001 | 60 | PowerPC e500 | 1.333GHz | 2 Core, 32-Bit | Signal Processing; SC3850 - Dual | DDR3, DDR3L | No | - | 10/100/1000Mbps (2) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | - | AIC, DUART, I²C, MMC/SD, SPI, USIM | |||||||||||||||||||||||||||||
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NXP USA Inc. MC10XS3535JHFK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 24-PowerQFN | Watchdog Timer | MC10XS3535 | - | N-Channel | 1:6 | 24-PQFN (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934070554557 | EAR99 | 8542.39.0001 | 168 | 3V ~ 5.5V | SPI | 6 | Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO | High Side | 10mOhm (Max), 35mOhm (Max) | 7V ~ 20V | General Purpose | - | |||||||||||||||||||||||||||||
NXP USA Inc. MC10XS4200BAFK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 23-PowerQFN | Internal PWM, Slew Rate Controlled, Watchdog Timer | MC10XS4200 | - | N-Channel | 1:1 | 23-PQFN (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 168 | 3V ~ 5.5V | SPI | 2 | Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO | High Side | 10mOhm (Max) | 8V ~ 36V | General Purpose | 6A | |||||||||||||||||||||||||||||||
NXP USA Inc. MC20XS4200BAFK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 23-PowerQFN | Internal PWM, Slew Rate Controlled, Watchdog Timer | MC20XS4200 | - | N-Channel | 1:1 | 23-PQFN (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934070549557 | EAR99 | 8542.39.0001 | 168 | 3V ~ 5.5V | SPI | 2 | Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO | High Side | 20mOhm (Max) | 8V ~ 36V | General Purpose | 3A | ||||||||||||||||||||||||||||||
NXP USA Inc. MC20XS4200BFK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 23-PowerQFN | Internal PWM, Slew Rate Controlled, Watchdog Timer | MC20XS4200 | - | N-Channel | 1:1 | 23-PQFN (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934070641557 | EAR99 | 8542.39.0001 | 840 | 3V ~ 5.5V | SPI | 2 | Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO | High Side | 20mOhm (Max) | 8V ~ 36V | General Purpose | 3A | ||||||||||||||||||||||||||||||
NXP USA Inc. MC9S12P64CLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | MC9S12 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317856557 | 3A991A2 | 8542.31.0001 | 160 | 49 | HCS12 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 4K x 8 | 4K x 8 | 1.72V ~ 5.5V | A/D 10x12b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX6Q7CVT08AD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 800MHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||||||||||||
NXP USA Inc. MK11DN512AVLK5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK11DN512 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316235557 | 5A002A1 | 8542.31.0001 | 96 | 60 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 24x16b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. MK21DX256AVMC5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK21DX256 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318123557 | 5A002A1 | 8542.31.0001 | 348 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 20x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. MKE02Z16VLD4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 44-LQFP | MKE02Z16 | 44-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 37 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | ||||||||||||||||||||||||||||||||
NXP USA Inc. MKE02Z32VLC4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MKE02Z32 | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | ||||||||||||||||||||||||||||||||
NXP USA Inc. MKE02Z32VLH4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MKE02Z32 | 64-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311558557 | 3A991A2 | 8542.31.0001 | 160 | 57 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MKE02Z32VQH4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-QFP | MKE02Z32 | 64-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324725557 | 3A991A2 | 8542.31.0001 | 84 | 57 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MKE02Z64VLC4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MKE02Z64 | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317983557 | 3A991A2 | 8542.31.0001 | 250 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 64KB (64K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MKE02Z64VLD4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 44-LQFP | MKE02Z64 | 44-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314938557 | 3A991A2 | 8542.31.0001 | 800 | 37 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 64KB (64K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MKE02Z64VLH4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MKE02Z64 | 64-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318162557 | 3A991A2 | 8542.31.0001 | 160 | 57 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 64KB (64K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MKE02Z64VQH4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-QFP | MKE02Z64 | 64-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317939557 | 3A991A2 | 8542.31.0001 | 84 | 57 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 64KB (64K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MKE04Z128VLD4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE04 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 44-LQFP | MKE04Z128 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 38 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 2.7V ~ 5.5V | A/D 12x12b; D/A 2x6b | Internal | |||||||||||||||||||||||||||||||
NXP USA Inc. MKE04Z64VLD4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE04 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 44-LQFP | MKE04Z64 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318189557 | 3A991A2 | 8542.31.0001 | 160 | 38 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 2.7V ~ 5.5V | A/D 12x12b; D/A 2x6b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. MKE04Z64VLH4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE04 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MKE04Z64 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311826557 | 3A991A2 | 8542.31.0001 | 160 | 58 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | ||||||||||||||||||||||||||||||
NXP USA Inc. MKE04Z64VQH4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE04 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-QFP | MKE04Z64 | 64-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 84 | 58 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal |
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