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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Voltage - Rated | Operating Temperature | Applications | Mounting Type | Package / Case | Features | Base Product Number | Input Type | Frequency | Technology | Current - Supply | Battery Chemistry | Voltage - Input | Number of Cells | Output Type | Ratio - Input:Output | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Function | Configuration | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Number of Outputs | Fault Protection | Output Configuration | Display Type | Digits or Characters | Rds On (Typ) | Voltage - Load | Voltage - Output | Switch Type | Current - Output (Max) | Current Rating (Amps) | Current - Test | Power - Output | Gain | Noise Figure | Voltage - Test |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. PCA8547BHT/AY | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 95°C | Surface Mount | 64-TQFP | PCA8547 | 90 µA | 1.8V ~ 5.5V | 64-TQFP (10x10) | download | ROHS3 Compliant | 2 (1 Year) | REACH Unaffected | EAR99 | 8542.39.0001 | 1,500 | 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix | SPI | LCD | 11 Characters, 22 Characters, 176 Elements | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. PCA8543AHL/AY | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 105°C | Surface Mount | 80-LQFP | PCA8543 | 250 µA | 2.5V ~ 5.5V | 80-LQFP (12x12) | download | ROHS3 Compliant | 2 (1 Year) | REACH Unaffected | EAR99 | 8542.39.0001 | 1,000 | 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix | I²C | LCD | 15 Characters, 30 Characters, 240 Elements | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. PCA85276ATT/AJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 105°C | Surface Mount | 56-TFSOP (0.240", 6.10mm Width) | PCA85276 | 6 µA | 1.8V ~ 5.5V | 56-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,000 | 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix | I²C | LCD | 10 Characters, 20 Characters, 160 Elements | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC11E68JBD64E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC11Exx | Tray | Discontinued at Digi-Key | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | LPC11 | 64-LQFP (10x10) | download | ROHS3 Compliant | 2 (1 Year) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 50 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 50MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 36K x 8 | 2.4V ~ 3.6V | A/D 10x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
NXP USA Inc. AFV09P350-04GNR3 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | 105 V | Surface Mount | OM-780G-4L | AFV09 | 920MHz | LDMOS | OM-780G-4L | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318141528 | 5A991G | 8541.29.0040 | 250 | Dual | - | 860 mA | 100W | 19.5dB | - | 48 V | |||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC22XS4200BEKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Slew Rate Controlled | MC20XS4200 | - | N-Channel | 1:2 | 32-HSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934070635518 | EAR99 | 8542.39.0001 | 1,000 | 3V ~ 5.5V | SPI | 2 | Open Load Detect, Over Temperature | High Side | - | 8V ~ 36V | General Purpose | 3A | |||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX286CVM4BR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX28 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 289-LFBGA | MCIMX286 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317889518 | 5A992C | 8542.31.0001 | 1,000 | ARM926EJ-S | 454MHz | 1 Core, 32-Bit | Data; DCP | LVDDR, LVDDR2, DDR2 | No | Keyboard, LCD, Touchscreen | 10/100Mbps (1) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | Boot Security, Cryptography, Hardware ID | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | |||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MM9Z1J638BM2EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 48-VFQFN Exposed Pad | MM9Z1J638 | Multi-Chemistry | - | 48-QFN-EP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315214564 | EAR99 | 8542.39.0001 | 2,000 | Battery Monitor | CAN | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MMPF0200F4AEPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Converter, i.MX6 | Surface Mount | 56-VFQFN Exposed Pad | MMPF0200 | 2.8V ~ 4.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318205528 | EAR99 | 8542.39.0001 | 4,000 | 11 | Multiple | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MMPF0200F4ANESR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Converter, i.MX6 | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MMPF0200 | 2.8V ~ 4.5V | 56-QFN-EP (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320371528 | EAR99 | 8542.39.0001 | 4,000 | 11 | Multiple | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MMPF0200NPAZESR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Converter, i.MX6 | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MMPF0200 | 2.8V ~ 4.5V | 56-QFN-EP (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311651528 | EAR99 | 8542.39.0001 | 4,000 | 11 | Multiple | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MMPF0200NPAZES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 105°C (TA) | Converter, i.MX6 | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MMPF0200 | 2.8V ~ 4.5V | 56-QFN-EP (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | 11 | Multiple | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK22DX128VMC5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK22DX128 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 348 | 56 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 20x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK22DX256VMC5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK22DX256 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324612557 | 3A991A2 | 8542.31.0001 | 348 | 56 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 20x16b; D/A 1x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK22FN128VDC10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-XFBGA | MK22FN128 | 121-BGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 348 | 67 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 24K x 8 | 1.71V ~ 3.6V | A/D 34x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MKL03Z16VFK4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL03 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 24-VFQFN Exposed Pad | MKL03Z16 | 24-QFN (4x4) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311782557 | 3A991A2 | 8542.31.0001 | 490 | 22 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 3.6V | A/D 7x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MKL03Z32VFG4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL03 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 16-UFQFN Exposed Pad | MKL03Z32 | 16-QFN (3x3) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322136557 | 3A991A2 | 8542.31.0001 | 490 | 14 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 3.6V | A/D 7x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MKL03Z8VFK4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL03 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 24-UFQFN Exposed Pad | MKL03Z8 | 24-QFN (4x4) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315381557 | 3A991A2 | 8542.31.0001 | 490 | 22 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 3.6V | A/D 7x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK10DX256VLH7R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MK10DX256 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,500 | 44 | ARM® Cortex®-M4 | 32-Bit Single-Core | 72MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 2K x 8 | 64K x 8 | 1.71V ~ 3.6V | A/D 26x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK20DX256VMC7R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK20DX256 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 70 | ARM® Cortex®-M4 | 32-Bit Single-Core | 72MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 2K x 8 | 64K x 8 | 1.71V ~ 3.6V | A/D 35x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6S8DVM10AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6U8DVM10AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MMPF0200F3ANES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C (TA) | Converter, i.MX6 | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MMPF0200 | 2.8V ~ 4.5V | 56-QFN-EP (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318204557 | EAR99 | 8542.39.0001 | 260 | 11 | Multiple | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MMPF0200F4ANES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C (TA) | Converter, i.MX6 | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MMPF0200 | 2.8V ~ 4.5V | 56-QFN-EP (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320371557 | EAR99 | 8542.39.0001 | 260 | 11 | Multiple | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MMPF0200NPANES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 85°C (TA) | Converter, i.MX6 | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MMPF0 | 2.8V ~ 4.5V | 56-QFN-EP (8x8) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | 11 | Multiple | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912XHZ384F1VAG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313994557 | 3A991A2 | 8542.31.0001 | 300 | 117 | HCS12X | 16-Bit | 80MHz | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | LCD, Motor control PWM, POR, PWM, WDT | 384KB (384K x 8) | FLASH | 4K x 8 | 28K x 8 | 2.35V ~ 5.5V | A/D 16x8/10b | External | |||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVFP64F1CLL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | S912 | 100-LQFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 450 | 78 | S12Z | 16-Bit | 32MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, LCD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 2K x 8 | 4K x 8 | 4.5V ~ 5.5V | A/D 4x10b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVFP64F1VLL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | S912 | 100-LQFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311165557 | 3A991A2 | 8542.31.0001 | 450 | 78 | S12Z | 16-Bit | 32MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, LCD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 2K x 8 | 4K x 8 | 4.5V ~ 5.5V | A/D 4x10b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVHY32F1CLL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | S912 | 100-LQFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320283557 | 3A991A2 | 8542.31.0001 | 450 | 73 | S12Z | 16-Bit | 32MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, LCD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 2K x 8 | 2K x 8 | 4.5V ~ 5.5V | A/D 4x10b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVHY32F1VLL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | S912 | 100-LQFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315087557 | 3A991A2 | 8542.31.0001 | 450 | 73 | S12Z | 16-Bit | 32MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, LCD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 2K x 8 | 2K x 8 | 4.5V ~ 5.5V | A/D 4x10b | Internal |
