Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Features | Base Product Number | Frequency | Technology | Voltage - Input (Max) | Output Type | Number of Circuits | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Function | Current - Output / Channel | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Data Rate | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Input Signal | Output Signal | Number of Outputs | Translator Type | Channel Type | Channels per Circuit | Voltage - VCCA | Voltage - VCCB | Internal Switch(s) | Topology | Frequency - Switching | Voltage - Supply (Max) | Output Configuration | Synchronous Rectifier | Current - Output | Voltage - Load | Motor Type - Stepper | Motor Type - AC, DC | Step Resolution | Dimming | Voltage - Supply (Min) | Voltage - Output | Voltage - Output (Min/Fixed) | Voltage - Output (Max) | Voltage - Input (Min) |
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NXP USA Inc. SPC5125YVN400R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC51xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 324-BBGA | SPC5125 | 324-PBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322286518 | 3A991A2 | 8542.31.0001 | 500 | 64 | e300 | 32-Bit Single-Core | 400MHz | CANbus, EBI/EMI, Ethernet, I²C, USB OTG | DMA, WDT | - | ROMless | - | 32K x 8 | 1.08V ~ 3.6V | - | External | |||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5746CHK0AMKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5746 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318894557 | 5A002A1 | 8542.31.0001 | 200 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5746CHK0AMMH6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LFBGA | SPC5746 | 100-MAPBGA (11x11) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935326051557 | 5A002A1 | 8542.31.0001 | 176 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5746CHK0AMMJ6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 256-LBGA | SPC5746 | 256-MAPPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935326065557 | 5A002A1 | 8542.31.0001 | 450 | 178 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5746CSK1MMJ6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 256-LBGA | SPC5746 | 256-MAPPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312542557 | 5A992C | 8542.31.0001 | 450 | 178 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5747CK1CMJ2R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 256-LBGA | SPC5747 | 256-MAPPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323726518 | 5A002A1 | 8542.31.0001 | 1,000 | 178 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5747CK1CMJ6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 256-LBGA | SPC5747 | 256-MAPPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316182518 | 5A002A1 | 8542.31.0001 | 1,000 | 178 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5747CK1MKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5747 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315929557 | 5A002A1 | 8542.31.0001 | 200 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5747CK1MKU6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5747 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315929528 | 5A002A1 | 8542.31.0001 | 500 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5747GK1CKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5747 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320747557 | 5A002A1 | 8542.31.0001 | 200 | 129 | e200z2, e200z4, e200z4 | 32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 4MB (4M x 8) | FLASH | - | 768K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5747GK1MKU6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5747 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316212528 | 5A002A1 | 8542.31.0001 | 500 | 129 | e200z2, e200z4, e200z4 | 32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 4MB (4M x 8) | FLASH | - | 768K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5747GK1MMJ6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 256-LBGA | SPC5747 | 256-MAPPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318778518 | 5A002A1 | 8542.31.0001 | 1,000 | 178 | e200z2, e200z4, e200z4 | 32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 4MB (4M x 8) | FLASH | - | 768K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5747GSK1MKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5747 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318739557 | 5A002A1 | 8542.31.0001 | 200 | 129 | e200z2, e200z4, e200z4 | 32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 4MB (4M x 8) | FLASH | - | 768K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5748CK1MKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5748 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322271557 | 5A002A1 | 8542.31.0001 | 200 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5748CK1MKU6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5748 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322271528 | 5A002A1 | 8542.31.0001 | 500 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5748GGK1MMJ6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 256-LBGA | SPC5748 | 256-MAPPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316302518 | 5A002A1 NXP | 8542.31.0001 | 1,000 | 178 | e200z2, e200z4, e200z4 | 32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5748GSK1MKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5748 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318831557 | 5A002A1 | 8542.31.0001 | 200 | 129 | e200z2, e200z4, e200z4 | 32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5748GSK1MMN6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 324-LBGA | SPC5748 | 324-MAPBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320249557 | 5A002A1 | 8542.31.0001 | 336 | 246 | e200z2, e200z4, e200z4 | 32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MKV42F256VLL16 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KV | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MKV42F256 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 74 | ARM® Cortex®-M4 | 32-Bit Single-Core | 168MHz | CANbus, I²C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 1.71V ~ 3.6V | A/D 38x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MKL13Z64VLK4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL13 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MKL13Z64 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 96 | 70 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | FlexIO, I²C, IrDA, SPI, UART/USART | DMA, PWM, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 1.71V ~ 3.6V | A/D 20x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX6G3DVK05AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6UL | Tray | Obsolete | 0°C ~ 95°C (TJ) | Surface Mount | 272-LFBGA | MCIMX6 | 272-MAPBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323757557 | 5A992C | 8542.31.0001 | 260 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3, DDR3L | No | LCD, LVDS | 10/100Mbps (2) | - | USB 2.0 + PHY (2) | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | |||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SSL5251T/1J | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Discontinued at Digi-Key | -40°C ~ 150°C (TJ) | Lighting | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | AC DC Offline Switcher | SSL5251 | - | 8-SO | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | - | 1 | No | Step-Down (Buck), Step-Up (Boost) | 16V | Triac | 9.9V | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. PCA9410AUKZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 9-UFBGA, WLCSP | PCA9410 | 5.25V | Fixed | 9-WLCSP (1.24x1.24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 3,000 | Step-Up | 1 | Boost | 3MHz | Positive | Yes | 500mA | 5V | - | 2.5V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC33GD3000EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Automotive | Surface Mount | 56-VFQFN Exposed Pad | MC33GD3000 | Power MOSFET | 6V ~ 58V | 56-QFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316315528 | EAR99 | 8542.39.0001 | 2,000 | Controller - Commutation, Direction Management | SPI | Half Bridge (3) | - | 6V ~ 58V | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MPC17510AEJR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -30°C ~ 150°C (TJ) | Battery Powered | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) Exposed Pad | MPC17510 | CMOS | 4V ~ 5.5V | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320734518 | EAR99 | 8542.39.0001 | 5,000 | Driver - Fully Integrated, Control and Power Stage | Parallel | Half Bridge (2) | 1.2A | 2V ~ 15V | - | Brushed DC | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MPC17531ATEJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -20°C ~ 150°C (TJ) | Battery Powered | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) Exposed Pad | MPC17531 | Power MOSFET | 2.7V ~ 3.6V | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 75 | Driver - Fully Integrated, Control and Power Stage | Parallel | Half Bridge (4) | 700mA | 2V ~ 8.6V | Bipolar | Brushed DC | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX6G2CVK05AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6UL | Tray | Obsolete | -40°C ~ 105°C (TJ) | Surface Mount | 272-LFBGA | MCIMX6 | 272-MAPBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 260 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3, DDR3L | No | LCD, LVDS | 10/100Mbps (2) | - | USB 2.0 + PHY (2) | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX6G2CVM05AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6UL | Tray | Obsolete | -40°C ~ 105°C (TJ) | Surface Mount | 289-LFBGA | MCIMX6 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3, DDR3L | No | LCD, LVDS | 10/100Mbps (2) | - | USB 2.0 + PHY (2) | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. NTB0101AGWH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 6-TSSOP, SC-88, SOT-363 | Auto-Direction Sensing | NTB0101 | Non-Inverted | 1 | 6-TSSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 3,000 | 100Mbps | - | - | Voltage Level | Bidirectional | 1 | 1.2 V ~ 3.6 V | 1.65 V ~ 5.5 V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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NXP USA Inc. NVT4857UKZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | Memory Card | Surface Mount | 20-UFBGA, WLCSP | NVT48 | 1.1V ~ 3.6V | 20-WLCSP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935304822012 | EAR99 | 8542.39.0001 | 500 | - |
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